簡易檢索 / 詳目顯示

研究生: 周子晉
Chou, Tzu-Chin
論文名稱: 導線電阻負載效應及輸入偏移對非揮發性記憶體組成的記憶體內運算電路影響之研究
Study of the Interconnect Loading Effect and Input Offset on Computing-In-Memory Circuits with Non-Volatile Memory Devices
指導教授: 江孟學
Chiang, Meng-Hsueh
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 奈米積體電路工程碩士博士學位學程
MS Degree/Ph.D. Program on Nano-Integrated-Circuit Engineering
論文出版年: 2023
畢業學年度: 111
語文別: 英文
論文頁數: 88
中文關鍵詞: 范紐曼瓶頸 、記憶體內運算 、非揮發性記憶體 、HSPICE 、快閃記憶體 、電阻式隨機存取記憶體 、導線電阻負載效應 、數位類比轉換器偏移
外文關鍵詞: von Neuman bottleneck, Computing in memory, Non-volatile memory, HSPICE, Flash memory, Resistive random-access memory (RRAM), Wire resistance loading effect, DAC offset
相關次數: 點閱:230  下載:0 
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報
  • 近年來,人工智慧迅速蓬勃發展,對於類神經網路的元件要求也勢必提高。最近
    研究指出,目前的功率消耗大多產生在運算單元及記憶體單元的資料傳輸而不是運算,
    這現象可稱為范紐曼瓶頸。記憶體內運算是其中一種解決辦法,但由靜態隨機存取記
    憶體組成的記憶體內運算的功耗太大,且需要較大面積,所以非揮發性記憶體組
    成的記憶體內運算的電路是目前致力研究的項目。另外導線隨著製程進步變得更
    細,導致導線電阻增加。若是導線電阻串聯起來,會影響到記憶體內運算的結果,並
    導致類比數位轉換器辨別錯誤,這現象可稱為導線電阻的負載效應。接著,因為數位
    類比轉換器的輸出電壓會有偏移,這也會影響到記憶體內運算的結果。這篇論文將會
    對這兩部分進行討研究與討論。
    這篇論文使用快閃記憶體精簡模型以及電阻式隨機存取記憶體的精簡模型,並使
    用 HSPICE 模擬軟體探討了導線負載效應及數位類比轉換器的輸出電壓偏移對記憶
    體內運算電路所造成的影響。我們從導線電阻負載效應實驗看出,當我們降低讀取電
    壓或是改變元件尺寸,可以改善導線電阻負載效應。另外,我們從數位類比轉換器偏
    移實驗中,我們使用蒙地卡羅模擬輸入電壓偏移,從模擬結果發現了當我們讀取電壓
    降低之後,電流偏移量會變大。所以如果要設計一個記憶體內運算晶片,在準確度、
    耗能還有面積三者之中去做取捨是非常重要的。

    The rapid growth of artificial intelligence (AI) in recent years has inevitably increased the demand for neural-like network devices. Recent studies have shown that most of the current power consumption is generated in the data transfer of the computational unit and memory unit rather than in the computation, a phenomenon known as the von Neuman bottleneck. Computing-in memory (CIM) is one of the solutions, but the power consumption of in-memory computing consisting of static random-access memory (SRAM) is too large and requires a larger area, so CIM circuits consisting of non-volatile memory are currently being studied. In addition, the wire becomes thinner as the process progresses, increasing the resistance of the wires. If the wire resistances are connected in series, it affects the result of the CIM and causes misidentification, which is called the wire resistance loading effect. Then, because the output of the digital-analog converter has an offset, this also affects the result of the computing-in-memory. These two parts will be discussed in this thesis.
    This thesis uses a flash memory compact model and a resistive random access memory compact model, and uses HSPICE simulation software to investigate the effects of wire resistance loading effect and output voltage offset of DAC on the CIM circuit. We have seen from the simulation on the wire resistance loading effect that the wire resistance loading effect can be improved when we reduce the read voltage or change the device size. In addition, we used the Monte Carlo method to simulate the input offset in our digital analog converter offset simulation and found that the current variation becomes larger when we reduce the read voltage. Therefore, if we design a CIM chip, choosing between accuracy, power consumption, and area is very important.

    摘要 I Abstract II 誌謝 IV Contents V Table Captions VII Figure Captions VIII Chapter 1 Introduction 1 1.1 Background 1 1.2 Motivation 3 1.3 Introduction of simulation tools 6 1.4 Overview of the thesis 6 Chapter 2 Device Introduction 8 2.1 Introduction of non-volatile memory 8 2.2 Flash 9 2.2.1 Introduction of flash 9 2.2.2 Flash operation principle 10 2.2.3 The shift of threshold voltage 12 2.2.4 Read operation 12 2.2.5 Write operation 13 2.2.6 Comparison NOR flash and NAND flash 17 2.3 RRAM 22 2.3.1 Introduction to RRAM 22 2.3.2 Operation and resistance switching mechanism 23 2.3.3 Current conduction mechanism of MIM structure 25 2.3.4 Ion drift model[32] 31 Chapter 3 Device Compact Model 33 3.1 Flash compact model 33 3.1.1 PSP model 33 3.1.2 Fundamentals of model theory 34 3.1.3 Current calculation method 36 3.2 Flash model calibration 37 3.3 RRAM compact model 40 3.3.1 Measured data 40 3.3.2 Bilayer RRAM 41 3.3.3 Modeling methodology 41 3.4 RRAM model calibration 45 Chapter 4 Loading Effect of Wire Resistance Discussion 47 4.1 Wire resistance loading effect of Flash 47 4.1.1 NOR flash circuit design 47 4.1.2 Experiment 48 4.1.3 Different read voltage 50 4.1.4 Different cell size 54 4.2 Wire resistance loading effect of RRAM 58 4.2.1 RRAM CIM cell design 58 4.2.2 BL Rwire loading effect and SL Rwire loading effect 60 4.2.3 Loading effect of single layer and bilayer RRAM 63 4.2.4 Different read voltage 66 4.3 Summary of wire resistance loading effect 68 Chapter 5 Input Offset Discussion 70 5.1 Experiment 70 5.2 Effect of input offset on NOR flash 71 5.2.1 Monte Carlo simulation for VWL 71 5.2.2 Monte Carlo simulation for VSL 73 5.2.3 Monte Carlo simulation for both VWL and VSL 75 5.3 Effect of input offset on RRAM 77 5.3.1 Monte Carlo simulation for VWL 77 5.3.2 Monte Carlo simulation for VSL 78 5.3.3 Monte Carlo simulation for both VWL and VSL 79 5.4 Summary of input offset 81 Chapter 6 Conclusion 82 Chapter 7 Future Work 84 Reference 85

    [1] D. Ielmini and H. S. P. Wong, "In-memory computing with resistive switching devices," Nature Electronics, vol. 1, no. 6, pp. 333-343, 2018, doi: 10.1038/s41928-018-0092-2.
    [2] M. Horowitz, "1.1 Computing's energy problem (and what we can do about it)," in 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 9-13 Feb. 2014 2014, pp. 10-14, doi: 10.1109/ISSCC.2014.6757323.
    [3] C. J. Jhang, C. X. Xue, J. M. Hung, F. C. Chang, and M. F. Chang, "Challenges and Trends of SRAM-Based Computing-In-Memory for AI Edge Devices," IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 68, no. 5, pp. 1773-1786, 2021, doi: 10.1109/TCSI.2021.3064189.
    [4] K. T. Tang et al., "Considerations of Integrating Computing-In-Memory and Processing-In-Sensor into Convolutional Neural Network Accelerators for Low-Power Edge Devices," in 2019 Symposium on VLSI Technology, 9-14 June 2019 2019, pp. T166-T167, doi: 10.23919/VLSIT.2019.8776560.
    [5]R. Han, P. Huang, Y. Zhao, X. Cui, X. Liu, and J. Kang, "Efficient evaluation model including interconnect resistance effect for large scale RRAM crossbar array matrix computing," Science China Information Sciences, vol. 62, no. 2, 2018, doi: 10.1007/s11432-018-9555-8.
    [6] R. T. Baird and T. S. Fiez, "Linearity enhancement of multibit /spl Delta//spl Sigma/ A/D and D/A converters using data weighted averaging," IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing, vol. 42, no. 12, pp. 753-762, 1995, doi: 10.1109/82.476173.
    [7] Accellera, Verilog-AMS language reference manual version 2.4.0. 2014.
    [8] S. YunSeung, "Non-volatile memory technologies for beyond 2010," in Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005., 16-18 June 2005 2005, pp. 156-159, doi: 10.1109/VLSIC.2005.1469355.
    [9] M. h. Chi and H. Wu, "Technologies and materials for memory with full compatibility to CMOS," in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, 20-23 Oct. 2008 2008, pp. 823-826, doi: 10.1109/ICSICT.2008.4734669.
    [10] F. Zahoor, T. Z. Azni Zulkifli, and F. A. Khanday, "Resistive Random Access Memory (RRAM): an Overview of Materials, Switching Mechanism, Performance, Multilevel Cell (mlc) Storage, Modeling, and Applications," Nanoscale Res Lett, vol. 15, no. 1, p. 90, Apr 22 2020, doi: 10.1186/s11671-020-03299-9.
    [11] R. Bez, E. Camerlenghi, A. Modelli, and A. Visconti, "Introduction to flash memory," Proceedings of the IEEE, vol. 91, no. 4, pp. 489-502, 2003, doi: 10.1109/JPROC.2003.811702.
    [12] Paulo Cappelletti, Carla Golla, Piero Olivo, and E. Z. (auth.), Flash Memories. Springer US, 1999.
    [13] M. Woods, "An E-PROM’s integrity starts with its cell structure," ed: New York: IEEE Press, 1991, pp. 59-62.
    [14] P. E. Cottrell, R. R. Troutman, and T. H. Ning, "Hot-electron emission in n-channel IGFETs," IEEE Journal of Solid-State Circuits, vol. 14, no. 2, pp. 442-455, 1979, doi: 10.1109/JSSC.1979.1051196.
    [15] S. Tam, K. Ping-Keung, H. Chenming, and R. S. Muller, "Correlation between substrate and gate currents in MOSFET's," IEEE Transactions on Electron Devices, vol. 29, no. 11, pp. 1740-1744, 1982, doi: 10.1109/T-ED.1982.21019.
    [16] J. Sune, P. Olivo, and B. Ricco, "Quantum-mechanical modeling of accumulation layers in MOS structure," IEEE Transactions on Electron Devices, vol. 39, no. 7, pp. 1732-1739, 1992, doi: 10.1109/16.141240.
    [17] P. Pavan, R. Bez, P. Olivo, and E. Zanoni, "Flash memory cells-an overview," Proceedings of the IEEE, vol. 85, no. 8, pp. 1248-1271, 1997, doi: 10.1109/5.622505.
    [18] "FLASH MEMORY TECHNOLOGY."
    [19] N. Mielke et al., "Bit error rate in NAND Flash memories," in 2008 IEEE International Reliability Physics Symposium, 27 April-1 May 2008 2008, pp. 9-19, doi: 10.1109/RELPHY.2008.4558857.
    [20] TOSHIBA, "Toshiba NAND vs NOR Flash Memory Technology Overview."
    [21] F. Pan, S. Gao, C. Chen, C. Song, and F. Zeng, "Recent progress in resistive random access memories: Materials, switching mechanisms, and performance," Materials Science and Engineering: R: Reports, vol. 83, pp. 1-59, 2014/09/01/ 2014, doi: https://doi.org/10.1016/j.mser.2014.06.002.
    [22] P. Y. Chen and S. Yu, "Compact Modeling of RRAM Devices and Its Applications in 1T1R and 1S1R Array Design," IEEE Transactions on Electron Devices, vol. 62, no. 12, pp. 4022-4028, 2015, doi: 10.1109/TED.2015.2492421.
    [23] M. J. Lee et al., "Stack friendly all-oxide 3D RRAM using GaInZnO peripheral TFT realized over glass substrates," in 2008 IEEE International Electron Devices Meeting, 15-17 Dec. 2008 2008, pp. 1-4, doi: 10.1109/IEDM.2008.4796620.
    [24] Z. Ji et al., "A 3D RRAM using stackable 1TXR memory cell for high density application," in 2009 International Conference on Communications, Circuits and Systems, 23-25 July 2009 2009, pp. 917-920, doi: 10.1109/ICCCAS.2009.5250369.
    [25] R. Waser and M. Aono, "Nanoionics-based resistive switching memories," Nature Materials, vol. 6, no. 11, pp. 833-840, 2007/11/01 2007, doi: 10.1038/nmat2023.
    [26] H. S. P. Wong et al., "Metal–Oxide RRAM," Proceedings of the IEEE, vol. 100, no. 6, pp. 1951-1970, 2012, doi: 10.1109/JPROC.2012.2190369.
    [27] E. W. Lim and R. Ismail, "Conduction Mechanism of Valence Change Resistive Switching Memory: A Survey," Electronics, vol. 4, pp. 586-613, 09/09 2015, doi: 10.3390/electronics4030586.
    [28] F.-C. Chiu, "A Review on Conduction Mechanisms in Dielectric Films," Advances in Materials Science and Engineering, vol. 2014, p. 578168, 2014/02/18 2014, doi: 10.1155/2014/578168.
    [29] B. Majkusiak, P. Palestri, A. Schenk, A. S. Spinelli, C. M. Compagnoni, and M. Luisier, "Modeling and Simulation Approaches for Gate Current Computation," in Nanoscale CMOS, 2013, pp. 213-257.
    [30] M. A. Lampert and P. Mark, Current Injection in Solids. Academic Press, 1970.
    [31] H. Y. Lee et al., "Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM," in 2008 IEEE International Electron Devices Meeting, 15-17 Dec. 2008 2008, pp. 1-4, doi: 10.1109/IEDM.2008.4796677.
    [32] D. B. Strukov and R. S. Williams, "Exponential ionic drift: fast switching and low volatility of thin-film memristors," Applied Physics A, vol. 94, no. 3, pp. 515-519, 2009/03/01 2009, doi: 10.1007/s00339-008-4975-3.
    [33] A. Maure, P. Canet, F. Lalande, B. Delsuc, and J. Devin, "Flash Memory Cell Compact Modeling Using PSP Model," in 2008 IEEE International Behavioral Modeling and Simulation Workshop, 25-26 Sept. 2008 2008, pp. 45-49, doi: 10.1109/BMAS.2008.4751238.
    [34] M. H. Chiang, K. H. Hsu, W. W. Ding, and B. R. Yang, "A Predictive Compact Model of Bipolar RRAM Cells for Circuit Simulations," IEEE Transactions on Electron Devices, vol. 62, no. 7, pp. 2176-2183, 2015, doi: 10.1109/TED.2015.2428293.
    [35] G. Gildenblat et al., "PSP: An Advanced Surface-Potential-Based MOSFET Model for Circuit Simulation," IEEE Transactions on Electron Devices, vol. 53, no. 9, pp. 1979-1993, 2006, doi: 10.1109/ted.2005.881006.
    [36] F. M. Puglisi et al., "2D h-BN based RRAM devices," in 2016 IEEE International Electron Devices Meeting (IEDM), 3-7 Dec. 2016 2016, pp. 34.8.1-34.8.4, doi: 10.1109/IEDM.2016.7838544.
    [37] S. Rehman, M. F. Khan, S. Aftab, H. Kim, J. Eom, and D.-k. Kim, "Thickness-dependent resistive switching in black phosphorus CBRAM," Journal of Materials Chemistry C, 10.1039/C8TC04538K vol. 7, no. 3, pp. 725-732, 2019, doi: 10.1039/C8TC04538K.
    [38] K. C. Chuang et al., "Impact of the Stacking Order of HfOx and AlOx Dielectric Films on RRAM Switching Mechanisms to Behave Digital Resistive Switching and Synaptic Characteristics," IEEE Journal of the Electron Devices Society, vol. 7, pp. 589-595, 2019, doi: 10.1109/JEDS.2019.2915975.
    [39] U. Chand, K. C. Huang, C. Y. Huang, and T. Y. Tseng, "Mechanism of Nonlinear Switching in HfO2-Based Crossbar RRAM With Inserting Large Bandgap Tunneling Barrier Layer," IEEE Transactions on Electron Devices, vol. 62, no. 11, pp. 3665-3670, 2015, doi: 10.1109/TED.2015.2471835.
    [40] P. A. Chen, W. C. Hsu, and M. H. Chiang, "Bilayer Modulation With Dual Vacancy Filaments by Intentionally Oxidized Titanium Oxide for Multilayer-hBN RRAM," IEEE Transactions on Nanotechnology, vol. 20, pp. 687-694, 2021, doi: 10.1109/TNANO.2021.3110899.
    [41] J. W. Lee and M. H. Chiang, "Modeling of RRAM With Embedded Tunneling Barrier and Its Application in Logic in Memory," IEEE Journal of the Electron Devices Society, vol. 8, pp. 1390-1396, 2020, doi: 10.1109/JEDS.2020.3008172.
    [42] K. Xia, "Smoothing globally continuous piecewise functions based on limiting functions for device compact modeling," Journal of Computational Electronics, vol. 18, no. 3, pp. 1025-1036, 2019/09/01 2019, doi: 10.1007/s10825-019-01356-w.

    下載圖示
    2026-08-31公開
    QR CODE