本研究旨在解決多層陶瓷電容（MLCC）中與端接方法相關的挑戰，這是現代電子技術中的關鍵元件。本研究探索改進端接工藝的替代方法，目的是提升性能和可靠性。研究首先概述了MLCC的製造過程，並強調了傳統端接方法中存在的問題，例如粘附力弱和導電性不佳。

研究探討了電化學技術，首先考察了直接電鍍作為潛在解決方案的可行性。起初，採用了無電鍍工藝來製作鎳-鎳端接，因為它能在非導電陶瓷表面進行沉積而無需外部電源。然而，實驗結果表明，無電鍍工藝無法在表面形成牢固的結合，因而在MLCC應用中效果有限。

作為更穩定的替代方法，研究評估了電鍍技術。該過程應用於鎳漿料上，並測試了三種常用電解質以確定其適用性。在這些電解質中，氨基磺酸鎳顯示出最佳性能，表現出比其他選項更好的粘附性和導電性。研究還檢查了成功電鍍所需的表面條件，強調了正確電極暴露以實現一致結果的重要性。

研究的最後階段集中於直接在MLCC上進行電鍍，省去了傳統的銅漿料方法。結果顯示，電鍍MLCC不僅滿足了必要的性能標準，還展現出與使用傳統技術生產的MLCC相當的特性。這表明電鍍是一種可行且有效的改進MLCC端接工藝的方法。總之，本研究強調了無電鍍工藝在MLCC端接中的局限性，並確立了電鍍技術（特別是氨基磺酸鎳）的可行性和優越性。

This study focuses on addressing the challenges associated with termination methods in Multilayer Ceramic Capacitors , a critical component in modern electronics. The research explores alternative approaches to improve termination processes, with the aim of enhancing performance and reliability. It begins with an overview of the multilayer ceramic capacitor manufacturing process and highlights current issues with traditional termination methods, such as weak adhesion and suboptimal conductivity.

The study investigates electrochemical techniques, starting with direct plating as a potential solution. Electroless plating was initially explored for nickel-nickel terminations, as it allows deposition on nonconductive ceramic surfaces without requiring an external power source. However, experimental results showed that electroless plating does not form a strong bond with the surface, rendering it less effective for multilayer ceramic capacitor applications.

Furthermore, electroplating was evaluated. The process was applied to nickel paste, and three commonly used electrolytes were tested to determine their suitability. Among these, nickel sulfamate exhibited superior performance, demonstrating better adhesion and conductivity compared to the other options. The research also examined the surface requirements necessary for successful electroplating, emphasizing the importance of proper electrode exposure to achieve consistent results.

The final phase of the study focused on electroplating directly onto multilayer ceramic capacitors, bypassing traditional copper paste methods. The results revealed that electroplated multilayer ceramic capacitors not only met the necessary performance criteria but also exhibited characteristics comparable to those produced using conventional techniques. This shows that electroplating can be a viable and effective approach to improving multilayer ceramic capacitor termination processes. In conclusion, this research highlights the limitations of electroless plating for multilayer ceramic capacitor terminations and establishes electroplating, particularly with nickel sulfamate.

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