| 研究生: |
呂冠賢 Lu, Kuan-Hsien |
|---|---|
| 論文名稱: |
利用電化學沉積法對銅銦硒薄膜反應機構之研究 A study on Reaction Mechanism of CuInSe2 Thin Films through Electrodeposition |
| 指導教授: |
李文熙
Lee, Wen-Hsi |
| 學位類別: |
碩士 Master |
| 系所名稱: |
電機資訊學院 - 電機工程學系 Department of Electrical Engineering |
| 論文出版年: | 2010 |
| 畢業學年度: | 98 |
| 語文別: | 中文 |
| 論文頁數: | 97 |
| 中文關鍵詞: | 電鍍 、銅銦硒薄膜 |
| 外文關鍵詞: | electrodeposition, CuInSe2 |
| 相關次數: | 點閱:84 下載:1 |
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本實驗是以分層電鍍銅,銦,硒三種元素在鉬基板上來作為研究。首先本實驗發現電鍍銦在銅薄膜上時,會產生銅銦相與銦相共存,並且銦有聚集的現象。所以此時本實驗的研究目標分成了兩個部份來探討CIS不同反應機構的研究,第一個部份則是阻止銅銦相的生成,本實驗嘗試在銅薄膜上電鍍上硒後再電鍍銦,並且研究最佳的電鍍硒秒數能夠成功阻擋銅銦相的產生,並且探討一階段式熱處理與二階段式熱處理對於合成CIS薄膜的影響。第二個部份為走CIS反應機制的Type-III,先合成出穩定的Cu11In9化合物,再此化合物上電鍍一層硒。實驗研究不同的RTA熱處理溫度與持溫時間對CIS薄膜的影響,利用FE-SEM來觀察CIS薄膜表面的微結構變化,XRD來分析CIS的結晶性,並用拉曼來做輔助有無雜相的存在。
實驗結果顯示以Cu11In9為初始相的CIS薄膜,其CIS的晶粒是比較大的,大約是在3μm~4μm之間。然而實驗結果也發現走這個路徑必須要用較高的RTA溫度,這樣所合成出的薄膜空洞與雜相會比較少。而本實驗也成功找出了電鍍硒的參數能夠成功阻擋銅銦相的產生。實驗發現利用兩階段式熱處理對於此路徑所合成出的CIS結構有很大的變化。實驗最後嘗試把整個元件製作出來,並且利用IV curve的測量,來研究元件中各層的鍍膜對於整個元件PN接面的影響。
In the research, we found the existence of Cu-In phase while electrodepositing indium onto copper layer. Therefore, our experiment separated into two routes. The first route was to prevent the formation of Cu-In phase by electrodepositing a selenium thin film between the Cu and In layer. The effect of two steps thermal treatment was also took into discussion in route two. The second route was to form steady Cu11In9 compound following an electrodeposition of selenium layer, and through RTA process we obtained a stiochiometric CuInSe2 compound. Furthermore, we study the effect of RTA temperature on the microstructure of CuInSe2 thin films. The crystal structure of the thin films was identified by powder x-ray diffraction (XRD). Raman spectroscopy was applied for analysis of second phases. The microstructure was observed by scanning electron microscope (SEM).
The SEM image of Cu11In9 thin films showed that the grain size was about 3μm~4μm. And we also found that higher temperature was need in route one to form CuInSe2 thin films of good quality. In route two, electrodeposited selenium with enough thickness could prevent the formation of Cu-In phase, and the film quality became better through two steps thermal treatment. By IV curve measurement we understood the characteristic of PN junction in the cell.
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校內:2015-08-25公開