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研究生: 葉金村
Ye, Jin-Cun
論文名稱: 具1687標準之三維積體電路自動化測試
Autonomous Testing for 3D-ICs with IEEE Std. 1687
指導教授: 李昆忠
Lee, Kuen-Jong
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2016
畢業學年度: 105
語文別: 英文
論文頁數: 32
中文關鍵詞: 1687標準IJTAG可重規劃之掃描電路自動化測試三維積體電路可測試設計
外文關鍵詞: IEEE Std. 1687, IJTAG, reconfigurable scan network, autonomous testing, 3D-ICs, DFT
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  • 1687標準又稱IJTAG,定義了基於序列掃描且具彈性的架構,可以有效率地存取晶片內部的電路。本篇論文提出一創新的架構,結合1687標準以及ㄧ有效率的測試控制器來執行三維積體電路的自動化測試。此測試控制器能傳送平行的測試資料至1687標準之架構以及待測試電路,並提供所需的控制訊號以控制整個測試流程。這個設計能達到全速度、自動化及可程式化的三維積體電路測試。在實驗結果中,在考量這個設計之自動化測試的能力的情況下,這個設計的額外面積負擔及測試時間負擔是很小的。

    IEEE Std. 1687, or IJTAG, defines flexible serial scan-based architectures for accessing embedded instruments efficiently. In this thesis, we present a novel test architecture that employs IEEE Std. 1687 together with an efficient test controller to carry out 3D-IC testing autonomously. The test controller deliver parallel test data for the IEEE Std. 1687 structures and the cores under test, and provide required control signals to control the whole test procedure. This design can achieve at-speed, autonomous and programmable testing in 3D-ICs. Experimental results show that the additional area and test cycle overhead of this architecture is small considering its autonomous test capability.

    CHAPTER 1 INTRODUCTION 1 CHAPTER 2 BACKGROUND AND RELATED WORK 4 2.1. BACKGROUND 4 2.1.1. IEEE Std. 1687 4 2.1.2. On-Chip SOC Test Platform 7 2.2. RELATED WORK 8 2.2.1. 3D-IC DFT based on IEEE Std. 1687 8 2.2.2. 3D-IC DFT based on IEEE 1149.1 and IEEE 1500 10 CHAPTER 3 DFT ARCHITECTURE FOR AUTONOMOUS 3D-IC TEST 12 3.1. 3D-IC DFT ARCHITECTURE BASED ON IEEE STD. 1687 12 3.2. SCAN PATH CONTROL UNIT 15 3.3. TEST ACCESS MECHANISM CONTROLLER (TAMC) 17 3.4. MODIFICATION OF IEEE 1500 WRAPPER SCAN CELLS TO TEST TSVS 18 CHAPTER 4 TEST PROCEDURE 20 CHAPTER 5 EXPERIMENTAL RESULTS 21 CHAPTER 6 CONCLUSIONS 30 REFERENCES 31

    [1]E.J. Marinissen, “Challenges in testing TSV-based 3D stacked ICs: Test flows, test contents, and test access,” in Proc. 2010 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2010.
    [2]IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device," IEEE Std. 1687-2014, 2014.
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    [11]K.-J. Lee, C.-Y. Chu, Y.-T. Hong, “An embedded processor based SOC test platform,” in Proc. ISCAS, 2005.
    [12]H. Lee, K. Chakrabarty, “Test Challenges for 3D Integrated Circuits,” IEEE Design & Test of Computers, 2009.
    [13]E.J. Marinissen, T. McLaurin, H. Jiao, “IEEE Std P1838: - DFT Standard-under-Development for 2.5D-,3D-, and 5.5D-SICs,” in Proc. European Test Symposium, 2016.
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