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研究生： 王偉松
Wang, Wei-Song
論文名稱： 以CMOS MEMS技術實現聚合酶連鎖反應晶片之可行性分析
The feasibility of PCR chip by using CMOS MEMS technique
指導教授： 羅錦興
Luo, Ching-Hsing
學位類別： 碩士
Master
系所名稱： 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年： 2006
畢業學年度： 94
語文別： 中文
論文頁數： 67
中文關鍵詞： 聚合酶連鎖反應 、熱循環模組 、讀取電路 、微機電系統
外文關鍵詞： PCR, MEMS, read-out circuit, thermocycler
相關次數： 點閱：102  下載：1 
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    • 聚合酶連鎖反應（polymerase chain reaction, PCR）對DNA之研究有著重要之貢獻。本研究即利用TMSC 0.35 μm之CMOS MEMS製程技術來研發整合訊號讀取電路之應用於聚合連鎖反應的微型熱循環模組，藉此來達到晶片微小化及SOC（system on a chip）之功用。

    在微型PCR晶片部分，本研究包含了熱循環模組與訊號讀取電路兩部分。在熱循環模組方面，包含了兩個加熱器與一個溫度感測器；在訊號讀取電路部分，本研究之電路包含了定電流電路、類比訊號處理電路及濾除雜訊之低通濾波器。在讀取電路與熱循環模組之中間分隔處，本研究利用蝕刻溝槽隔離兩部分，藉此來達到降低溫度對讀取電路之影響。

    最後，本研究另外使用矽晶片為基材，利用微機電製程技術，以材料鋁製作感測器與加熱器，藉此瞭解此鋁感測器之穩定性與線性度，並對CMOS MEMS製作之微型PCR晶片進行可行性之分析。

    Polymerase chain reaction (PCR) has been making important contribution to the research of DNA in recent years. In this study, a micro-PCR chip implemented by TSMC 0.35μm CMOS MEMS techniques is proposed. The micro-PCR chip is integrated with thermocycler and read-out circuit that can reach the state of system on a chip (SOC).

    In the proposed micro-PCR chip, two separated parts are implemented: one is micro thermocycler integrated with a temperature sensor and two micro heaters and the other is read-out circuit that includes constant current circuit, analog signal processing circuit and low-pass filter for reducing noise. In order to reduce the thermal effect on read-out circuit from thermocycler, the etching hole is fabricated on separating space between them for isolation. This technology can improve the performance in the PCR research.

    Finally, heaters and sensors have been microfabricated in silicon substrate by using aluminum. We use this microfabricated chip to understand it’s stability and linearity. We also discuss the feasibility of the PCR chip based on CMOS MEMS techniques.

    摘 要.........................................................................i ABSTRACT.....................................................................ii 致 謝.......................................................................iii 目 錄.........................................................................v 圖 目 錄...................................................................viii 表 目 錄......................................................................x 第一章 緒論...................................................................1 1-1 前言......................................................................1 1-2 微機電系統簡介............................................................2 1-3 研究動機..................................................................3 1-4 文獻回顧..................................................................5 1-5 本文架構.................................................................10 第二章 DNA複製與微小型溫度感測元件之基本原理.................................12 2-1 DNA的結構與特性..........................................................12 2-2 聚合連鎖反應...........................................................13 2-3 溫度感測元件之基本原理...................................................17 第三章 聚合連鎖反應晶片之製作與讀取電路設計................................22 3-1 概述 TSMC 2P4M 0.35μm CMOS 製程..........................................22 3-2 系統架構.................................................................23 3-3 晶片設計.................................................................26 3-4 光罩設計與製作...........................................................28 3-5 微機電技術之晶片製作.....................................................30 3-5-1 晶片清潔...............................................................31 3-5-2 氧化...................................................................33 3-5-3 蒸鍍...................................................................36 3-5-4 蝕刻...................................................................38 3-6 CMOS MEMS技術之晶片製作..................................................40 3-7 CMOS MEMS晶片之後製程處理................................................44 3-7-1 反應離子蝕刻...........................................................46 3-7-2 電感應耦合電漿離子蝕刻.................................................49 第四章 結果與討論............................................................53 4-1 讀取電路模擬結果.........................................................53 4-2 感測器之TCR值............................................................58 4-3 微機電製程晶片之穩定性...................................................60 第五章 結論與未來展望........................................................62 5-1 結論.....................................................................62 5-2 未來工作.................................................................63 參考文獻.....................................................................64 自 述........................................................................67

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