利用PCB積層製程技術將電感元件以積層的方式埋入於epoxy或polyimide基板中，不但可提升基板的封裝密度，並符合軟性電子基板可撓性之需求。本研究以鐵氧磁體、環氧樹脂及溶劑所配製之漿料，利用塗佈的方式將其製成薄膜，以取代PCB基板中之預浸布(prepreg)。此外，本研究透過添加鈦酸酯耦合劑對鐵氧磁體粉末表面進行改質，進而改善粉末與樹脂的分散性質；並藉由添加液態橡膠 (CTBN)，改善鐵氧磁體/環氧樹脂複合薄膜的機械性質。實驗結果得知，耦合劑濃度2.0wt%及CTBN添加量15 phr時所製得之複合薄膜有較佳的分散性質及機械性質。

To embed inductors into epoxy or polyimide substrates using PCB processing technology can increase the integration density and conform to the flexibility requirement for flexible electronics. In this study, the composite films prepared by coating ferrite/epoxy paste were used to replace the prepreg of PCB substrates. Titanium coupling agent was used to modify the surfaces of NiZn ferrites powders to improve the dispersion property in organic solvent. Moreover, CTBN was added into the ferrite-epoxy suspensions to improve the mechanical property of composite films. The ferrite/epoxy composite films prepared by adding with 2.0wt% of coupling agent and 15 phr of CTBN show a well dispersion property, a good dielectric property, and a strong mechanical property.

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