本論文研究所使用之氮化鋁（AlN）主要為本實驗室以不同鋁粉使用本實驗室自行開發之燃燒合成技術製備而得，吾使用氮化鋁粉體為填充料（filler）與環氧樹脂製備成複合材料。為進行比較，部分實驗亦使用產學合作公司所提供之氮化鋁為填充料。本論文研究分成三大部分，第一部份是為提升氮化鋁之流動性而改良氮化鋁之後處理製程之開發，在實驗中，使用不同研磨設備及不同尺寸磨球，和先前製程相比，能對於氮化鋁粉體平均粒徑、粒徑分佈、形狀及團聚物進行適當之後處理，並成功提升了氮化鋁粉體之流動性，經研磨後從5μm至30μm間不同大小粒徑之氮化鋁皆通過了產學合作公司之流動性出貨標準；第二部份為氮化鋁/液態環氧樹脂之流動性探討，經上述改良之後處理製程製備之氮化鋁固含量至少能達78.3 wt%，而能維持良好之流動性；第三部份將不同粒徑之氮化鋁製成的環氧成型模料（Epoxy molding compound, EMC），探討其熱傳導值及流變性質，並與業界EMC產品進行比較，在相近平均粒徑之下（約20μm），實驗室氮化鋁相較於業界二氧化矽填充之EMC有較低的震盪力矩，代表著有更佳之流動性，而其熱傳導值（在相同的體積含量下）可從業界樣品之2.2 W/m·K提升至10.3W/m·K，因此使用實驗室合成之氮化鋁不僅解決了業界使用二氧化矽填充之低熱傳導問題，也克服了一般使用氮化鋁填充之EMC流動性不佳的問題，使得本實驗室技術生產之氮化鋁更能符合產業應用。除此之外，改善氮化鋁粉體流動性後，不只流動性提升，對於熱傳導值也有所上升，在相同平均粒徑為5μm之氮化鋁，流動性最高固含量從73.7wt%至78.3wt%，其熱傳導值則從2.91W/m·K提升至5.4W/m·K。又因為具有好流動性之粉體，在相同固含量下黏度較低，於熱壓成型時較容易熔融流動形成一緻密之塊材，在SEM截面分析中也能清楚看到，較少孔隙存在，堆積會較為緊密，具有較佳之熱傳導途徑。

AlN (aluminum nitride) used in this research is mainly obtained by combustion synthesis of different aluminum powders in the laboratory and is used as filler in epoxy composite material. For comparison, some experiments also use the AlN from a cooperation company. This research can be divided into three parts. The first part is the development of improved subsequent processing of AlN. In our experiments, using different grinding devices and different sizes of grinding balls, compared with the previous process, the average particle size, particle size distribution, morphology and agglomerates of aluminum nitride can be properly processed, and new method for subsequent processing of AlN has been successfully improved the flowability of AlN powder synthesized in the laboratory. After milling, AlN with different particle sizes ranging from 5μm to 30μm has passed the flowability standard of the cooperation company. The second part is to discuss the flowability of aluminum nitride powder in liquid epoxy resin. In the sagging method test of liquid epoxy resin, it is shown that the flowability of AlN after the new method for subsequent processing of AlN is better than before, and the solid content can be filled to 78.3 wt%, while maintaining good flowability. In the third part, Epoxy molding compound (EMC) filled of AlN with different particle sizes is discussed, and its thermal conductivity and rheological properties are compared with industrial products. With a similar average particle size (nearly 20μm), AlN powder synthesized in the laboratory has a lower oscillation torque than the industry product (SiO2, silicon dioxide), which means that it has better flowability and its thermal conductivity (under the same volume content) can be increased from 2.2 W/m·K to 10.3W/m·K. Therefore, using AlN powder synthesized in the laboratory not only solves the problem of low thermal conductivity, but also overcomes the flowabilty of AlN after the subsequent processing process is comparable to the commonly used SiO2 powder in the industry. This makes the aluminum nitride synthesized by our laboratory technology more suitable for industrial applications. In addition, after improving the flowability of aluminum nitride powder, not only the flowability is enhanced, but also the thermal conductivity in composite is also increased. For AlN with the same average particle size of 5μm, the flowability in sagging method is from 73.7wt% to 78.3wt %, its thermal conductivity has increased from 2.91W/m·K to 5.4W/m·K, and because the powder with good flowability has a lower viscosity at the same solid content, it is easy to melt to form a uniformly dense bulk material. It can also be clearly seen in the SEM cross-sectional analysis that there are fewer pore, and the accumulation will be denser, which has a better heat conduction path.

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