隨著多處理器系統設計的複雜度增加，三維積體電路將有利於多處理器系統設計。然而，三維積體電路搭配先進製程可能導致嚴重的熱效應。熱效應將對系統的效能、功率消耗、可靠性和冷卻成本造成顯著地影響。至今，網格熱分析是被廣泛地利用去分析熱效應。熱分析的分析效能和準確性是相互影響的。因此，如何在早期系統設計階段，快速和有效地分析熱效應將是一個迫切的問題。
傳統積體電路熱分析方法忽略溫度相依的因素和這熱分析結果無法反映晶片的熱效應在早期系統設計階段。因此，我們考量溫度相依的因素(熱輻射、材質熱導和漏電功率消耗) 在提出的溫度梯度感知熱分析方法裡去較好的顯示出晶片的熱效應在架構層級的積體電路設計階段。
網格熱分析是被廣泛地利用在熱分析方法裡。網格數目是常由使用者去彈性的定義。然而，一個不合適的網格單元數目在網格熱分析中可能降低分析效能和損失準確度。因此，我們提出一個溫度梯度探索方法去決定一個合適的網格單元數目，並且使用在網格熱分析中以達到高分析效能和準確度。
網格熱分析需要使用大數量的熱傳導公式在一個矩陣運算的形式裡。為了提高網格熱分析效能，矩陣運算仍然可以藉由圖形處理器再加速。然後，我們提出一個新的矩陣壓縮的方法去加速此熱分析方法的網格熱分析平均12.48倍。
系統設計者需要一個電子系統層級具功率和熱感知的虛擬平台去分析系統的熱效應由於較短系統設計時間和較低系統設計成本的好處。傳統的功率感知虛擬平台不具備熱感知。因此，我們提出一個方法論關於功率感知的虛擬平台發展至功率和熱感知的虛擬平台。此方法論讓傳統的電子系統層級功率感知虛擬平台能有系統地具備熱的分析能力。
總結，此提出的方法之研究能輔助系統設計者設計出高可靠性、高效能及低功耗之三維積體電路多處理器系統。

With the design complexity growth of multiprocessor systems, three-dimensional integrated circuit (3D IC) will benefit the design of multiprocessor systems. However, 3D-IC with advanced process techniques may incur serious thermal effects. The thermal effects will significantly affect the performance, power consumption, reliability, and cooling cost of the system. To date, mesh-based thermal analysis is commonly utilized to analyze the thermal effects. The analytical performance and accuracy of the thermal analysis are affected by each other. Therefore, how to fast and effectively analyze the thermal effects of ICs at early stages of system design is an urgent problem.
Conventional thermal analysis methods of ICs ignore temperature-dependent factors, and the results of the thermal analysis cannot reflect the thermal effects of ICs at early stages of system design. Therefore, we consider the temperature-dependent factors (specifically thermal radiation, the thermal conductivity of materials, and leakage power consumption) in the proposed temperature gradient-aware thermal analysis (TGA) method to better manifest the thermal effects at the architecture level of design stage.
The mesh-based thermal analysis is often used to observe the variations and distribution of the temperatures in ICs. The number of cells in the mesh is often defined by the users to provide flexibility. However, an unsuitable number of the cells in the mesh-based analysis may reduce analytical performance while losing analytical accuracy. Hence, we propose a temperature gradient exploration method (called TGE) for determining the appropriate number of the cells used in the mesh-based thermal analysis to achieve high analytical performance and accuracy.
The mesh-based thermal analysis needs to solve a large number of heat transfer equations in a form of matrix operations. In order to increase the performance of the mesh-based thermal analysis, the matrix computation can be further accelerated by a graphics processing unit (GPU). Then, we propose a novel matrix compression method to speed up the mesh-based thermal analysis of TGA by 12.48 times on average.
System designers require a power- and thermal-aware virtual platform at electronic system level (ESL) to analyze the thermal effects of systems because of the benefits of shorter time and lower cost in system design. Conventional power-aware virtual platforms are not thermal aware. Therefore, we propose a methodology for developing power-aware virtual platforms to power- and thermal-aware virtual platforms. The methodology let conventional power-aware virtual platforms incorporate with thermal analysis capability systematically.
In summary, the proposed methods can assist system designers to design the multiprocessor systems of 3D ICs with higher reliability, higher performance, and lower power consumption.

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