本論文主要針對封裝用V2O5-P2O5-TeO2系的玻璃進行銀添加之研究。V2O5-P2O5-TeO2系的玻璃具有低於400℃的封裝溫度，玻璃轉化溫度低（一般低於300℃），很適合低溫封裝玻璃材料使用。低溫封裝膠可用於石英震盪器或是液晶面板等封裝黏合使用，由於製程影響，封裝膠高溫融合時會產生許多問題，例如氣泡產生、石英共振特性會消失及液晶不耐熱等等。而以往的低溫封裝玻璃大多含有鉛的成分，具有化學穩定性好、封裝溫度低的優點，但鉛會造成有害人體及違害環境，因此必須開發無鉛成份的低溫封裝玻璃來取代含鉛封裝玻璃材料。
本論文以銀當作玻璃添加物來降低熱膨脹係數(CTE)α值、降低玻璃轉化溫度(Tg)。
研究發現，隨著銀添加比例的增加，玻璃轉移溫度也會有下降的趨勢，其中以銀添加量為50%時，Tg測得最低值173.7℃；而熱膨脹係數也會因銀的添加而變小，其中以銀添加量為30%時，α值測得最低值5.62×10-6/℃。從XRD分析可得知銀添加比例為30%時，在400燒結時沒有析晶行為發生，因此熱膨脹係數變低。從FTIR及Raman分析可得知銀添加比例為50%時，玻璃整提結構由Q2轉變為Q０，使玻璃整體結構變弱，因此玻璃轉移溫度下降。
添加銀元素之V2O5-P2O5-TeO2系玻璃可強化低溫封裝玻璃特性與適合應用於石英震盪器或是液晶面板等產業封裝黏合使用。

The conventional low-melting sealing glasses usually contain large amounts of lead, and therefore have a good chemical stability, low-sealing temperature. But lead can cause harmful and illegal harm the environment. As a result, it is important to explore lead-free low-melting sealing glasses.
Among lead-free low-melting sealing glasses, V2O5-P2O5-TeO2 glass system have low temperature of sealing process(<400℃), and hard to crystallize. It is suitable for low-melting sealing glass materials. In order to improve the coefficient of thermal expansion (CTE), lower the glass transformation temperature (Tg) and to increase the dielectric constant. In this experiment, silver is an additive to improve problem.
In this experiment, it was found when we increase the proportion of silver, the glass transformation temperature (Tg) will decrease. The minimum of Tg is 173.7℃ when addition of silver is 50wt%. The CTE of the glass will be decreased when addition of silver is increased. The minimum of CTE is 5.62×10-6/℃ when addition of silver is 10wt%.
Adding silver can improve the V2O5-P2O5-TeO2 glass system used in low temperature sealing process.
In XRD result, when addition of silver is 30wt% and sinter temperature in 400℃, there is no crystallization. The CTE will become lower.
In FTIR and Raman result, when addition of silver is 50wt%, the structure of glass will become Q０. The structure of Q０is weak than Q2, therefore the Tg will become lower.

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