在產業中由於歐盟RoHS (the Restriction of the use of certain hazardous substances in electrical and electronic equipment)標準內，RoHS一共列出六種有害物質，包括：鉛 Pb，鎘 Cd，等等重金屬。電氣電子產品在生產中目前大量使用的焊錫、包裝箱印刷的油墨都含有鉛等有害重金屬，因此開始限制元件中不能含有重金屬成分。
使用成大的鋁膏以及化學置換反應的方式，將鋁膏置換成銅金屬，藉此方式讓低成本的鋁膏可以發揮出銅金屬較優的導電性，同時希望能夠取代封裝產業公司正在使使用的含鉛錫膏。
本研究分為三個部分，第一部分為鋁膏的配置，嘗試不同比例的固含量，利用離心攪拌機及三滾筒機均勻混和後， 60%固含量較能夠呈現與含鉛錫膏相同的印刷結果。
第二部分為鋁膏置換反應，鋁膏印刷在銅腳架後，經鋁膏固化後，以去離子水的硫酸銅做為置換反應的溶劑，並以50℃、60℃、70℃三種不同的溫度情況下，與不同的時間進行置換反應30分鐘、60分鐘、90分鐘，以電子顯微鏡觀察其微結構、能量散射X射線譜(EDX)進行材料分析，與四點探針量測電阻值。研究發現以70℃置換1小時的情況下，得以觀察到鋁膏全置換成銅金屬。
第三部分為在鋁膏上放上晶粒進行置換，鋁膏印刷於銅腳架上方後，在鋁膏上放晶圓切割後的晶粒再進行置換，置換的條件與第二部分相同。研究發現因為晶粒蓋住鋁膏，減少離子水的硫酸銅與鋁膏接觸的面積，因此僅只有再晶粒的邊緣有明顯置換，中間鋁膏並沒有明顯的置換反應。後續的實驗會再以不同的置換添加劑，讓去離子水的硫酸銅能夠經由邊緣滲透並進行置換反應。

The packaging industry companies use lead-containing solder paste. The reason why only lead-containing solder paste is used is in the packaging process, so that the die and the copper tripod can be perfectly combined. The interfacial alloy eutectic is formed, but its mechanical strength is the last in each alloy in the case of lead-free. To replace the process of lead-containing solder paste, it has become the most critical motivation of this research. First, use aluminum powder and resin to prepare aluminum paste, and then use screen printing equipment to print the aluminum paste on the copper tripod, and observe whether the printing result is the same as the lead-containing solder paste. Next, prepare the solution for the substitution reaction, try to carry out the substitution reaction of the aluminum paste at different temperatures and rotational speeds, and observe its microstructure, composition analysis and electrical measurement. After covering the die for replacement, the use of the additive ETU can completely replace the aluminum paste under the die, so that the copper sulfate solution is also strongly penetrating, so that the replacement can react from the gaps on the left and right sides. However, the push-pull force of the die and the copper tripod is greatly reduced.
Key words : Al Paste、Replacement.

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