早期，LTCC元件中所使用的銀電極是在空氣下燒結，而銅電極需要在氮氣下進行燒結。這是因為氮氣可以提供一個無氧的環境，從而防止電極表面的氧化，保證燒結後的電極具有良好的導電性能。此外，氮氣還可以減少電極表面的殘留碳元素，從而減少對元件性能的負面影響。在使用銀電極和銅電極的生產過程中，氮氣的使用是一個重要的工藝措施，可以提高元件的品質和可靠性。
隨著金屬導電膏的進化演變，現在市面上大多使用銅、銀等作為導電粉末，可因為銀本身過於昂貴，而金屬銅則需要燒結在還原氣體下，而鋁作為導電性佳的材料之一，但因為鋁即使在真空的環境下也會生成保護性氧化層，這會抑制鋁顆粒之間的接觸導致在厚膜應用上受到限制。
因此，希望結合銅和鋁的特性，讓此兩種金屬形成合金，使銅鋁合金不容易與氧形成氧化物，能夠拉回空氣下燒結，因為使用空氣進行燒結不需要特殊氣體或氣氛控制設備，相對於其他氣氛控制燒結，成本相對較低。
本文研究了低溫共燒陶瓷（LTCC）中使用不同材料的電極（銅鋁合金電極、銅電極、銀電極）對元件性能的影響。實驗結果顯示，使用銅鋁合金電極的元件具有較低的溫度係數和較小的溫度漂移，這可以增加元件的穩定性和可靠性。相比之下，使用銀電極的元件具有較高的溫度係數和較大的溫度漂移，而使用銅電極的元件具有較差的導電性能和較差的耐腐蝕性能。因此，使用銅鋁合金電極是一種可行的替代方案，可以提高元件的性能並降低生產成本。本研究為LTCC元件的設計和生產提供了重要參考和指導。
此研究主要分為三個部分，第一部分是先藉由DTG與TMA的分析決定LTCC元件適合在什麼樣的溫度之下進行燒結，DTG分析可以研究燒結過程當中的反應跟變化，幫助優化燒結條件和提高材料的性能，而TMA可以用於研究材料的熱穩定性和燒結收縮率的性能，幫助優化材料的配方和製程，再來放進燒結爐會先設定不同的燒結階段，這主要是考慮LTCC元件的材料、電極材料、擴散問題、電極是否會氧化問題等等，應該適用於哪一個不同的燒結階段。第二部分會使用SEM與EDS來分析陶瓷材料與電極材料的本身燒結後狀況，這可以幫助我們在後續做一系列電性量測時的一個很好的輔助工具。最後，第三部分在電性量測樣品時就可得知樣品的一個電性結果是否符合前面燒結的步驟有無幫助。
關鍵字 : 銅鋁合金、內電極、厚膜技術、熱膨脹係數、低溫共燒陶瓷(LTCC)

In the past, the silver electrodes used in LTCC components were sintered in air, while copper electrodes needed to be sintered under nitrogen. This is because nitrogen provides an oxygen-free environment, thereby preventing the oxidation of the electrode surface and ensuring good conductivity of the electrode after sintering. In addition, nitrogen can also reduce the residual carbon elements on the electrode surface, thereby minimizing the negative impact on component performance. In the production process of using silver electrodes and copper electrodes, the use of nitrogen is an important process measure that can improve the quality and reliability of the components. This paper studied the effect of using different electrode materials (copper-aluminum alloy electrodes, copper electrodes, silver electrodes) in Low Temperature Co-fired Ceramics (LTCC) on component performance. The experimental results showed that components using copper-aluminum alloy electrodes have a lower temperature coefficient and smaller temperature drift, which can enhance the stability and reliability of the components. In contrast, components using silver electrodes have a higher temperature coefficient and larger temperature drift, while components using copper electrodes have poorer conductivity and corrosion resistance. Therefore, using copper-aluminum alloy electrodes is a viable alternative, which can enhance component performance and reduce production costs. This study provides important reference and guidance for the design and production of LTCC components. This research is divided into three parts. The first part is to determine the appropriate sintering temperature for LTCC components through DTG and TMA analysis. DTG analysis can study the reactions and changes during the sintering process, helping to optimize sintering conditions and improve material performance. TMA can be used to study the thermal stability and sintering shrinkage performance of materials, helping to optimize material formulas and processes. In the second part, SEM and EDS are used to analyze the condition of ceramic material and electrode material after sintering. This can provide us with a good auxiliary tool in subsequent electrical measurement series. Finally, in the third part, when measuring the electrical properties of the sample, we can find out whether the electrical results of the sample are consistent with the sintering steps.
Keywords: Copper-Aluminum Alloy, Inner Electrode, Thick Film Technology, Thermal Expansion Coefficient, Low-Temperature Co-fired Ceramics (LTCC)

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