氰酸酯硬化（三環化）的過程，因分子量變大，黏度非常高，攪拌困難，質傳不易，因而導致少部分Cyanate基殘留而無反應，殘留的Cyanate基極性高，介電係數降低不易，本研究的目的便是探討如何使氰酸酯反應完全而達到降低介電係數的結果。

本研究分為兩個部分，第一部份是採用少量的單官能酚與部分Bisphenol-A-dicyanate（BADCY）形成imidocarbonate化，來增加BADCY在硬化過程中末期的流動性，使Cyanate基反應較完全，將殘存的Cyanate基減少而達到降低極性，進而使介電常數降低。或是以少量之單官能氰酸酯與BADCY共聚，來增加硬化末期之流動性，同樣使Cyanate基反應較完全並使殘存的Cyanate基減少。反應完之硬化物以高頻阻抗分析儀等儀器測定。

第二部分以第一部份結果最佳的4-tert-butylphenolcyanate簡稱為 4TPCY，來與DCPD型與DP型氰酸酯(DCPDCY、DPCY)共聚來改善其介電性質。Dicyclopentadiene(DCPD)與Dipentene(DP)為輕油裂解的廉價副產物，具有疏水性、低極性及剛硬性脂環狀結構，其結構之氰酸酯單體（DCPDCY、DPCY）的固化物由文獻中已知具有良好的介電性質。由結果發現，4TPCY添加量（單官能/雙官能mol比）在0.05~0.10時介電性質最佳，DCPDCY Dk為2.62~2.52U，tanδ為0.0076~0.0074；DPCY Dk為2.54~2.50U，tanδ為0.0078~0.0074。添加少量的單官能氰酸酯雖會使Tg分別降至271.8~264.8℃、259.5~246.4℃ ，但是仍具有高Tg的特性。此外，由TGA、TMA、吸濕性分析得知，硬化物仍具有良好熱安定性、良好尺寸安定性與低吸濕率，符合現今印刷電路板材料的需求。

Dicyclopentadiene(DCPD) and Dipentene(DP),are inexpensive byproducts from naphtha cracker. The cyanate esters synthesized from DCPD and DP are known to have fine properties like low dielectrical property , low polarity and low water absorption. The object of this research is to synthesize DCPDCY and DPCY , and to explore their dielectrical property for the printed circuit board application.

The first part of this research is that parts of bisphenol-A-dicyanate(BADCY) is reacted with a small quantity of mono-functional phenol to form imidocarbonate, or BADCY is combined with a small quantity of mono-functional cyanate esters to form cocyanate esters polymer. Both methods are intend to increase the mobility of BADCY at final stage of curing , and results in a complete reaction of cyanate group. The dielectrical properties of polymer are determined by RF Impedance Analyzer.

The second part of this research is that DCPDCY and DPCY are mixed with a small quantity of 4-tert-butylphenolcyanate which was found the best properties in the first part of study and are cured accordingly. The addition of 4-tert-butylphenolcyanat at mole ratio of 0.05~0.10 (mono- functional/(bi-functional) can obtain the best dielectrical properties. The Dk of cured DCPDCY is 2.62~2.52U , tanδis 0.0076~0.0074. The Dk of DPCY is 2.54~2.50U , tanδ is 0.0078~0.0074. Although the Tgs of DCPDCY are reduced to 271.8~264.8℃. The Tg of DPCY is low to 259.5~246.4℃, they still have the property of high glass transition temperature. In addition , that the polymers still have the properties of excellent thermal stability、dimensional stability and low moisture absorption by TGA、TMA、moisture absorption test. Therefore , they fulfil the requirement of the printed circuit board materials of modern times.

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