隨著製程進步，單一晶片已經可以包含數百萬顆電晶體，而單位面積下的功率消耗也隨之愈來越大，進而導致溫度大幅地上升。在設計探勘中，高階的虛擬平台被用來模擬晶片效能、功率和溫度的問題，並且驗證探勘後的成效。但光靠設計探勘並沒有辦法完全降低晶片在動態運作時產生的熱點(Hotspot)，因此動態溫度管理(Dynamic Thermal Management)技術的應用漸漸的越趨普遍。而電壓和頻率調整技術是最常用於動態溫度管理的其中一種技術，因此如何在一個探勘後的虛擬平台中發展動態溫度管理演算，並且考慮到電壓和頻率調整技術所帶來的負面效應，這將會是一個問題的所在。
在論文中我們建置了一個用於驗證動態溫度管理演算法的異質虛擬平台，且是針對使用電壓和頻率調整技術的溫度管理演算法，其中整合了一個雙核心的數位系統模組以及直流電源轉換器(DC-DC)和鎖相迴路(PLL)等類比模組，如此一來便可清楚地顯現出電壓和頻率調整技術所帶來的負面影響。再來我們使用近幾年著名期刊所提出的演算法來當作我們虛擬平台的研究個案，而且設計了三個測試範例，搭配期刊中所提到的演算法，清楚地說明和驗證此平台的應用方向和正確性。

As technology advancement, millions of transistor could be integrated into single chip. Thus power density increases accordingly and subsequently led to the increase of chip temperatures. In design space exploration, virtual platforms are used to model the performance, power and thermal issues and verify the system design. However, it is not enough in dealing with thermal issues, especially hotspots, by design exploration alone due to the infrequent run-time thermal emergency. Thus, dynamic thermal management (DTM) technique is applied to tackle the hotspots. As voltage and frequency scaling is one of the most popular schemes for DTM. Therefore, it would be a problem to develop DTM algorithms on a virtual platform not able to consider the voltage and frequency transition overhead. In this thesis, we proposed a heterogeneous virtual platform for thermal and power management with the capability of using voltage and frequency scaling. The platform integrates a digital dual-core system model with the DC-DC and PLL analog models for clearly showing the voltage and frequency transition overhead. Several recent developed algorithms are used as case studies for verifying the proposed heterogeneous virtual platform.

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