半導體為現代生活中不可或缺的部分。本研究使用有限元素法分析軟體ANSYS模擬顆粒被氣源移除的狀況。欲測試結構為光學玻璃(CIS)與矽光子晶片(Silicon Photonics)，顆粒粒徑有5μm、10μm、20μm、50μm等等，主要可以分為三組情況進行測試。第一個是在所有條件皆相同的情況下將氣源的角度進行改變，分別以0°、15°、30°、45°，分別進行模擬，發現其中是以45°進行顆粒移除會有最好的效果。第二種情況為測試不同入流速度以及出口負壓，分別為0m/s、20m/s、40m/s、60m/s和0Pa、2500Pa、5000Pa、7500Pa，總共可以模擬出16種情況，其中雖然以60m/s以及7500Pa的組合效果最佳，但若以整體數據而言，在高入流速度以及高出口負壓的情況下，增加兩者對顆粒移除效益較低。第三種為模擬不同顆粒大小以及不同濕度的狀況，其中可以發現顆粒越小愈難被移除，而在將濕度由50%調整為20%後，各種尺寸的顆粒在移除效果上都有提升，其中又以小顆粒增加幅度為最大。最後可以得到，在顆粒的移除上以氣源旋轉45°、入流速度60m/s、出口負壓7500Pa以及濕度為20%的時候會得到相對好的移除效率。

Semiconductors are an indispensable part of modern life. This study uses finite element method (FEM) analysis software, ANSYS, to simulate the removal of particles by an air source. The structures to be tested include optical glass (CIS) and silicon photonics chips, with particle sizes of 5μm, 10μm, 20μm, and 50μm. The tests are divided into three main scenarios.The first scenario changes the angle of the air source under identical conditions, simulating angles of 0°, 15°, 30°, and 45°. It was found that a 45° angle is the most effective for particle removal.The second scenario tests different inlet velocities and outlet pressures, specifically 0m/s, 20m/s, 40m/s, 60m/s, and 0Pa, 2500Pa, 5000Pa, 7500Pa. A total of 16 conditions are simulated. Although the combination of 60m/s and 7500Pa yielded the best results, increasing both parameters shows diminishing returns on particle removal efficiency at high inlet velocities and high outlet pressures.The third scenario simulates different particle sizes and humidity levels. It was found that smaller particles are more difficult to remove. However, when the humidity is adjusted from 50% to 20%, the removal efficiency improves for all particle sizes, with the smallest particles showing the greatest improvement.In conclusion, the optimal conditions for particle removal are a 45° air source angle, an inlet velocity of 60m/s, an outlet pressure of 7500Pa, and a humidity level of 20%.

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