可攜式設備已成為現今社會的消費主流，然而這些可攜式設備的IC元件大部分是輕薄短小且高精密度的設計，容易遭受到ESD（Electrostatic Discharge，ESD）的破壞，因此ESD防護也就愈顯得格外重要。在這當中暫態電壓抑制器（Transient Voltage Suppressor，TVS）為ESD靜電防護元件的主流，因此本論文的研究主題即為陣列式（Array）暫態電壓抑制器，利用箝制電壓（Clamping Voltage）達到良好的靜電防護的效果。本論文首先以Silvaco TCAD軟體模擬陣列式暫態電壓抑制器的元件結構，並分析改變摻雜濃度對元件電性的影響。之後使用Tanner L-Edit軟體做光罩（Photo Mask）設計並在晶圓廠投片做工程試產，完成之晶片經由探針測試（Chip Probe）量測電性資料，再經由封裝廠完成封裝製程後對產品量測電性資料，比較實際產品與軟體模擬的電性差異。最後採用IEC-61000-4-2測試規範實際量測此元件在空氣放電（Air Discharge）與接觸放電（Contact Discharge）下的靜電防護效能，確認此元件之靜電防護能力能否達到level 4等級規範。

Portable devices have become staples of modern society consumption. However, most IC components in these devices are slim and high-precision design which means more vulnerable to ESD damage. So the ESD protection will be more particularly important in modern consumption applications. Among many ESD protection devices, transient voltage suppressor (TVS) has become mainstream for ESD protection devices. Thus research topic of this thesis is array transient voltage suppressor.

Silvaco TCAD software was required first to simulate array transient voltage suppressor component structure and analyze impact on the electrical characteristics when doping concentration changed. Then Tannar L-Edit software was used to design photo mask and manufacture wafers in FAB for engineer pilot run. After pilot wafers finished, electrical data was collected first by chip probing (CP) test, then completed assembly process in assembly house and made final test (FT) to collect electrical data again to compare the difference between real products and software simulation results. Finally, ESD protection performance of these devices was tested by human body model of IEC-61000-4-2 test specification.

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