可追溯性的生產履歷已被國際標準組織訂定為標準，甚至於國際衛生組織也將食品生產的處理與運送的可追溯性做出定義。
半導體製程當然也有可追溯性，但是傳統半導體封裝的產品，因最終紀錄在產品上的記號，已經經過晶圓切割，只能向前追溯到產品批號及封裝時間，無法再回溯到其在晶圓上的位置，因此在某些時候，無法正確回溯。封裝製程從先前的「打金線」加上「封黑膠」進步到不再使用金線以節省成本，沒有長導線使得訊號距離最短，不需封膠保護金線可直接散熱的錫鉛凸塊製程，再由錫鉛凸塊製程進展到高可靠度高鉛凸塊及綠色產品的無鉛凸塊製程，而凸塊沈積製程也由原先傳統電鍍液的電鍍製程，發展到錫膏印刷製程。如此種種，讓凸塊製程似乎領先傳統封裝許多。
本研究就生產履歷追溯部分，對應用在凸塊製程的紀錄方式，做各階段的比較，同時做整合可能性的探討。最後配合強化型雷射背印，將各個晶片賦予獨一無二的辨識碼。藉由此辨識碼來比對整合過的製程記錄，便可以知道該晶片是否為「偽造品」或「瑕疵品」。最後對於執行該生產履歷的方式及執行方法，做現階段的探討。其限制與可能發展，則在最後一章節做闡述。

The traceability system be defined in ISO (International Organization for Standardization) SPEC, It can be review in ISO9000:2005 and ISO22000:2005 and, ISO/TS16949:2002. Even the WHO/Codes defined it for the food production and processing and distribution.
In semiconductor field, it also follows the definition of ISO for traceability in all devices. But the traditional assembly device, the mark was made after wafer sawing. That is this device only can be traced for the lot number and assembly date. It will not be traced back to the exactly positopn on wafer. It is important for wafer process and engineering judgement. Sometimes the chip cannot be traced back correctly. Assembly process improved the gold wire bonding and molding compound into no more gold wire for cost saving and no long lead to shorten signal transmission distance and no compound to improve heat spreading, that is bumping. Then high lead bump for reliability concern and lead free bump for green envirement requirement be raised. The solder disposition method also improved from plating of high power requirement to printing of lower power wasting. Such advantage showed out bumping is better than tranditional assembly.
In this research, it shows the different recording in each step of semiconductor device and to investigate the integration of semiconductor front end and backend.In the other hands, to enhance the backside laser marking (an individual ID for each chip die), compare with the integrated mapping file, we can easy to check if this chip die is “Fake” or “Fault”. In the last section, it also mentions the feasibility of implement and methodology limitation.

[1] Eric Laine, Klaus Ruhmer, Dietrich Toennies &, Emmett Hughlett & Peter Gruber, “C4NP”, Advanced Packaging, No.64, pp.58-63, 2006/October
[2] Fujitsu website, “wafer bumping”, from the World Wide Web: http://www.fujitsu.com/downloads/MICRO/fma/pdf/waferbumping.pdf, Retrieved 2004.
[3] Rahamat Bidin, Rosemarie Tagapulot, Cari Nichelled.Lao & Rodel Manalac, ST assembly Test Service, “Lead-free Material”, Advanced Packaging ASIA, No.1, pp.29-33, 2001.
[4] ASE global website, http://www.aseglobal.com,“Bumping Presentation 013105.ppt” , 2005.
[5] Eric Laine, Klaus Ruhmer, “C4NP of solder bump related cost and logistic”, Technology Advanced Packaging, pp.32-33 , 2007.
[6] Gregory Phipps, “Wire bond and Flip Chip”, Advanced Packaging, No.56, pp.50-53, 2005.
[7] Mark Whitmore, “The new wafer level package of solder bumping”, Advanced Packaging, No.59, pp.64-66 , 2006.
[8] Hacky Seiller, “Surface mount tech”. , Advanced Packaging, No.1, pp.40-47, 2001.
[9] 陳自榮，”金凸塊技術之新技術、新挑戰”，半導體科技，第144-145頁, 2005年。
[10] David Sempek, “RDL in WLCSP”, Advanced Packaging, No.53, pp.32-34, 2005.
[11] Stephen Kay, Doug Anberg, Thomas Goodman & Peter Elenius, “12 inch wafer backend Photo tech analysis”, Packaging & Assembly, pp. 174-178, 2001.8
[12] TSMC 2009, TSMC Backend Service, from the World Wide Web: http://www.tsmc.com/download/english/a05_literature/05_TSMC_Backend_Service.pdf, Retrieved 2009.
[13] Peland Koh, “printing tech for mass production for WLCSP”, Technology Advanced Packaging, pp.116-118, 2005.
[14] ASE, “Flip chip bumping”, from the World Wide Web: http://www.aseglobal.com/content/4-1-7-4.htm, Retrieved 2008.
[15] 溫從凱，“利用G/L方法探討WLCSP構裝含UBM錫球之疲勞壽命”，國立成功大學工程科學系，碩士論文，台南，2005年。
[16] 林建泰，“覆晶接合銲錫隆點及其底層金屬之研究”，國立成功大學材料科學及工程學系，博士論文，台南，2004年。
[17] Terence Collier, “Copper cleaner to reduce oxidation in bumping process”, Advanced Packaging, No.76, pp.42-44, 2008.
[18] 張琬君，“一種兼具低消耗速率及抗氧化作用之銲點墊層材料”，國立中央大學化學工程與材料工程研究所，碩士論文，中壢，2004年。
[19] ASE, “bumping WLCSP roadmap”, from the World Wide Web: http://www.asetwn.com.tw/content/11.html, Retrieved 2008.
[20] 蔡宗岳，“晶圓級構裝承受JEDEC上板級掉落衝擊測試之研究”，國立成功大學工程科學系，博士論文，台南，2008年。
[21] 劉振中，“無鉛錫球含多層金屬薄膜之晶圓級封裝結構應力分析”，國立成功大學工程科學系，碩士論文，台南，2003年。
[22] ASE, “Wafer Bumping Solder Bumping product overview”, from the World Wide Web: http://www.asetwn.com.tw/content/2-6-1.html, c 2008.
[23] R. J. Klein Wassink, “Soldering in electronics - Second Edition”, from the World Wide Web: http://www.elchempub.com/epfiles/ep01.htm, Retrieved 2005.
[24] 張哲銘，“共鍍鎳銅合金與錫銀銲料界面反應之研究”，國立中央大學化學工程與材料工程研究所，碩士論文，中壢，2005年。
[25] 台灣食品GMP發展協會，“什麼是生產履歷? ”，取自http://www.gmp.org.tw/newsdetail.asp?id=4446，2006年。
[26] FAO, “Animal Feed Impact on Food Safety”, fron the World Wide Web: http://www.who.int/foodborne_disease/resistance/Report_AnimalFeed_Oct07.pdf, Retrieved 2007.10.
[27] ISO, “ISO9000: 2005 Fundamentals and Vocabulary”, from the World Wide Web: http://www.iso9001help.co.uk/iso_9000_2005.htm, Retrieved 2005.
[28] Ahmed E1Amin, “ISO standard set for food traceability”, from the World Wide Web: http://www.foodqualitynews.com/Legislation/ISO-standard-set-for-food-traceability, Retrieved 2009.
[29] 行政院衛生署，ISO 22005:2007之概要，取自http://tfts.firdi.org.tw/Files/ISO220052007.doc，2007年。
[30] ISO, ISO/TS16949, from the World Wide Web: http://elsmar.com/pdf_files/iso_ts_16949%20semiconductor%20requirements.pdf , Retrieved 2005.
[31] 黃培訓，“日本食品生產履歷制度對台灣的啟示”，農政與農情，第145期，第75-82頁，2004年。
[32] 邱奕志，“建立宜蘭地區青蔥RFID產銷履歷系統”，國立宜蘭大學農業推廣委員會，取自http://acac.niu.edu.tw/download.php?filename=5_938b2849.pdf&dir=publish&title=%E5%85%A8%E6%96%87%E4%B8%8B%E8%BC%89，2009年。
[33] 費雯綺，“建立農產品生產履歷管理制度”，取自http://public.tactri.gov.tw/pdf/2005/建立農產品生產履歷管理制度940615.pdf，2005年。
[34] 賴兆炫，“讓有機農民動起來-談農產品生產履歷”，取自http://www.organic-rice.com.tw/about/7.htm，2005年。
[35] 銀川好米談農產品生產履歷，章節4，http://www.organic-rice.com.tw/about/7.htm， 2005年。
[36] Matthias Westermann, “Traceability at Texas Instruments”, from the World Wide Web: http://www.silica.com/fileadmin/05_Events/Seminar_PDFs/SCM_Seminars_2008/Traceability_at_Texas_Instruments.pdf, 2008.
[37] Juergen Leib & Volker Seidemann, “Optical sensor in WLCSP”, Advanced Packaging, No.63, pp.70-72, 2006.