本文主要利用ANSYS有線元素分析軟體模擬分析負晶封裝體FCBGA在溫度循環負載其無鉛錫球的機械行為及壽命比較。
首先建立模型並設定各材料參數，再以Anand model描述錫球的行為，進行網格化進行溫度負載模擬分析，將所得結果搭配Coffin-Manson equation 計算疲勞壽命並比較差異及優劣。
本文主要探討材料均為無鉛銲錫，所有組合包括兩種無鉛材料及三種組合體，首先比較兩種材料分別在各組合體的應力及應變分布，再針對單一材料在不同組合體進行模擬，最後總結並計算比較壽命，分析材料及組合體對壽命所帶來的效益。

This paper uses finite element software ANSYS14.0 to analyze the Flip-Chip Ball Grid Array packaging (FCBGA) under accelerated thermal cycling loading, we observe the thermal and mechanical behaviors of the solder balls and compare their fatigue life.

First we have to use ANSYS to establish the model of FCBGA and set up the material parameters, than describe solder ball's mechanical behaviors with Anand model, after that, mesh the model and analyze it by accelerated thermal cycling loading, finally we use Coffin-Manson equation to calculate solder balls fatigue life.

We use two lead-free materials and three type of models, first compare the mechanical behaviors of the same materials' solder ball in different types, than compare the mechanical behaviors of the different materials' solder ball in same types, eventually calculate the fatigue life and investigate the effect of solder ball with different material and model.

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