本研究探討添加1 ~ 2 wt% Sb對Sn3.5Ag無鉛銲料熔點、硬度、微結構、銲點附著強度、剪切強度的影響，以及其對高溫熱儲存的抵抗能力。同時探討冷卻率對Sn-Ag銲料系微結構與硬度的影響，以及界面IMC層總厚度對銲點附著強度、剪切強度以及斷口形貌的影響。
實驗之銲料皆利用純元素(Sn 99.9wt%, Ag 99.99wt%, Sb 99.5wt%)秤取適當比例熔煉而成，再以ICP-AES進行成分確認。結果發現添加1~2 % Sb雖使Sn3.5Ag銲料的熔點上升，但也同時提高銲料硬度。Sb的添加不影響Ag3Sn化合物組成，Sb全部固溶於b-Sn中。205°C´625h儲存後，界面附近的Ag3Sn深腐蝕後呈現粗大的板狀，離界面較遠的Ag3Sn則呈現不規則的長條狀。不同冷卻率使Sn-Ag銲料系微結構，由細緻的環狀結構變成樹枝狀結構，再轉變成菊花狀的條紋組織。Ag3Sn的型態亦由細條狀變為長條狀、薄片狀。硬度變化方面，As-cast硬度以水淬最高，其次為空冷，爐冷則為最低。含Sb銲料與Cu銲接後，微量的Sb參與界面Cu6Sn5與Cu3Sn層的生長，使界面IMC層轉變為Cu6(Sb,Sn)5與Cu3(Sb,Sn)非化學計量型的化合物型態。
銲點強度方面，添加Sb有助於提升Sn-Ag銲點附著與剪切強度強度。經高溫長時間儲存後，添加Sb的銲點仍然具有較高的附著與剪切強度，且強度下降的速率亦較緩慢。此外，添加Sb的試件中，銲點附著強度與剪切強度在熱儲存過程中都出現了強度回升的現象。
斷口分析顯示銲點強度、界面IMC層厚度與斷口形貌間具有一定的關係存在。界面IMC層總厚度小於1.0 mm時，銲點具有最高的強度表現，破壞位置大約位於銲料與界面IMC層之間，斷口形貌大致平坦。總厚度介於1.0 ~ 10 mm時，銲點附著與剪切強度皆急遽下降，斷口出現韌窩形貌。總厚度高於10 mm時，銲點強度附著與剪切強度皆下降緩慢。銲點破壞的位置則轉移到界面IMC層內部，斷口也轉變成為劈裂形貌。

The work discussed the effect of adding 1 – 2 wt% Sb on the melting point temperature, hardness, microstructure, adhesive strength and shear strength of Sn3.5Ag solder and solder joints. The effect of cooling rate on the microstructure and hardness of Sn3.5Ag solder, as well as the relationship among the total thickness of interfacial IMC (Intermetallic Compound) layers, adhesive strength and shear strength of solder joint and fractography were discussed.
The solders were smelted from pure elements, i.e. Sn 99.9wt%, Ag 99.99wt%, Sb 99.5wt%, and the compositions were confirmed by ICP-AES. The results showed that adding 1-2 % Sb increased the melting point temperature of Sn3.5Ag solder, but the hardness were also enhanced. Adding Sb didn’t influence the composition of Ag3Sn that existed in the Sn3.5Ag solder, the added Sb atoms were solute into b-Sn completely. After 205°C´625h storage, the morphology of Ag3Sn that existed near the soldering interface appeared coarse plate, and the Ag3Sn that existed far away from the soldering interface appeared irregular rod. The experiment also revealed that the as-cast microstructure of Sn-Ag solder was governed by cooling rates. The microstructure changed from the ring-like structure to the dendrite structure, and finally to the chrysanthemum structure as the cooling rate slowed. The morphology of Ag3Sn also changed from needle-like to flake-like as the cooling rate slowed. The water-quenched hardness of Sn3.5Ag solder exhibited the highest hardness, and then air-cooling; the furnace cooling was the lowest. After soldering with Cu, there was a little Sb found in the interfacial Cu6Sn5 and Cu3Sn layers, which showed that adding Sb induced the Cu6Sn5 and Cu3Sn compound transforming to Cu6(Sb,Sn)5 and Cu3(Sb,Sn) non-stoichiometry compounds respectively.
Adding Sb also enhanced the adhesive and shear strength of Sn3.5Ag solder joint, even after long-term thermal storage the solder joints that contained Sb still exhibited higher strength and slower strength decreasing rate. Furthermore, the bouncing phenomenon of adhesive and shear strength of solder joints occurred in all Sb-contained solder joints during thermal storage.
Fractographic analysis revealed that there was a certain relationship existing among the total thickness of interfacial IMC layers, adhesive and shear strength of solder joints, and fractography. As the total thickness of interfacial IMC layers was smaller than 1.0 mm, the highest strength was obtained. The fracture occurred approximately along the interface between solder and interfacial IMC layers. The fractography appeared flat. As the thickness lay between 1.0 - 10 mm, the adhesive and shear strength of solder joints decrease rapidly, and the fractography appeared dimple morphology. Finally, as the thickness exceeded 10 mm, the strength of solder joints decreased slowly. The fracture moved to inside the interfacial IMC layers and the fractography appeared cleavage morphology.

1.Paul T. Vianco, "Solder Alloys: A Look at the Past, Present and Future," Welding Journal, 1997.3, pp.45-49
2.張淑如, "鉛對人體的危害," 勞工安全衛生簡訊, 第12期, 勞工安全衛生研究所
3.IPC Roadmap: A Guide for Assembly of Lead-Free Electronics, 4th Draft, 2000.6
4.Laura J. Turbini, Gregory C. Munie, Dennis Bernier, Jürgen Gamalski, and David W. Bergman, "Examining the Environmental Impact of Lead-Free Soldering Alternatives," IEEE Transactions on Electronics Packaging Manufacturing, Vol.24, No. 1, 2001.1, pp.4-9
5.N. C. Lee, "Lead-Free Soldering---Where the World Is Going," Advanced Microelectron, Vol.26, 1999.9, pp.29
6.葉文裕, 陳春萬, "台灣地區鉛作業勞工暴露現況與未來研究規劃," 勞工安全衛生簡訊, 第26期, 1997, 勞工安全衛生研究所
7.NUS Corporation, "Summary of Data on Municipal Solid Waste Landfill Leachate Characteristics," Technical Report, US, Environmental Protection Agency, 1988
8.Industrial Economics, Inc., "Potential Human Exposures from Lead in Municipal Solid Waste," Technical Report, US, Report prepared for the Lead Industries Association, 1991.5
9.NUS Corporation, "Case Studies on Groundwater and Surface Water Contamination from Municipal Solid Waste Landfills," Technical Report, US, Environmental Protection Agency, 1988
10.J. Lowy, "Junked PC's a Growing Environmental Problem," Atlanta Journal of Constitution, 1999.8
11.N. C. Lee, "Getting Ready for Lead-free Solders," Soldering & Surface Mount Technology, No.26, 1997.7, pp.65-68
12.陳信文, "無鉛銲料簡介," 電子與材料, 第一期, 1999, pp.74-77
13.Pierre-Yves Chevalier, "A Thermodynamic Evaluation of the Ag-Sn System," Thermochimica Acta, Vol. 136, No.1, 1988.2, pp.45-54
14.Katsuaki Suganuma, "Interface Phenomena in Lead-free Soldering," 1999 Proceedings EcoDesign '99: First International Symposium on 1999, pp.620-625
15.M. McCormack, H. S. Chen, G. W. Kammlott, S. Jin, "Significantly Improved Mechanical Properties of Bi-Sn Solder Alloys by Ag-Doping," Journal of Electronic Materials, Vol. 26, Issue 8, 1997, pp.954-958
16.Wenge Yang, Robert W. Messler, JR., "Microstructure Evolution of Eutectic Sn-Ag Solder Joints," Journal of Electronic Materials, Vol.23, Issue 8, 1994, pp.765-772
17.D. R. Flanders, E. G. Jacobs, and R. F. Pinizzotto, "Activation Energies of Intermetallic Growth of Sn-Ag Eutectic Solder on Copper Substrates," Journal of Electronic Materials, Vol.26, Issue 7, 1997, pp.883-887
18.Masahide Harada and Ryoohei Satoh, "Mechanical Characteristics of 96.5Sn/3.5Ag Solder in Microbonding," IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol.13, No.4, 1990.12, pp.736-742
19.Wenge Yang, Lawwrence E. Felton, Robert W. Messler, JR., "The Effect of Soldering Process Variable on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints," Journal of Electronic Materials, Vol.24, Issue 10, 1995, pp.1465-1472
20.Sinn-Wen Chen and Yee-Wee Yen, " Interfacial Reactions in Ag-Sn/Cu Couples," Journal of Electronic Materials, Vol. 28, Issue 11, 1999, pp.1203-1208
21.V.I. Igoshev, J.I. Kleiman, D. Shangguan, S. Wong, and U. Michon, "Fracture of Sn-3.5%Ag Solder Alloy under Creep," Journal of Electronic Materials, Vol. 29, Issue 12, 2000, pp.1356-1361
22.Won Kyoung Choi and Hyuck Mo Lee, "Effect of Soldering and Aging Time on Interfacial Microstructure and Growth of Intermetallic Compounds between Sn-3.5Ag Solder Alloy and Cu Substrate," Journal of Electronic Materials, Vol. 29, Issue 10, 2000, pp.1207-1213
23.S. Chada, R. A. Fournelle, W. Laub and D. Shangguan, "Copper Substrate Dissolution in Eutectic Sn-Ag Solder and its Effect on Microstructure," Journal of Electronic Materials, Vol. 29, Issue 10, 2000, pp.1214-1221
24.I. E. Anderson, J. C. Foley, B. A. Cook, J. Harringa, R. L. Terpstra and O. Unal, "Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1050-1059
25.Noboru Wade, Kepeng Wu, Johji Kunil, Seiji Yamada and Kazuya Miyahara, "Effects of Cu, Ag and Sb on the Creep-Rupture Strength of Lead-Free Solder Alloys," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1228-1231
26.Kenji Warashina, Yoshiharu Kariya, Yasunori Hirata, and Masahisa Otsuka, "Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(X=Bi and Cu) Solder Joints," IEEE 1999, pp.626-631
27.United States Patent, Patent Number: 5,527,628
28.J. Sigelko, S. Choi, K.N. Subramanian, and J.P. Lucas, "The Effect of Small Additions of Copper on Aging Kinetics of the Intermetallic Layer and Intermetallic Particles of Eutectic Tin-Silver Solder Joints," Journal of Electronic Materials, Vol. 29, Issue 11, 2000, pp.1307-1311
29.Karl F. Seelig, "A Study of Lead Free Solder," AIM Technical Paper, pp.1-3
30.Karl F. Seelig and Donald G. Lockard, United States Patent, Patent Number: 5,352,407, 1994.1
31.Hwa-Teng Lee, Chuan-Lien Yang, Ming-Hung Chen, Cheng-Shyan Li, "Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints," The 5th International Conference on Fracture & Strength of Solids (FEOFS2003), Tohoku University, Sendai, Japan, 2003.10
32.Rodney J. McCabe, Morris W. Fine, 'Creep of Tin, Sb-Solution-Strengthened Tin, and SbSn-Precipitate-Strengthened Tin,' Metallurgical and Materials Transactions A, Vol. 33A, 2002.5, pp.1531-1539
33.Hwa-Teng Lee, Tain-Long Liao, Ming-Hung Chen, "Study on Microstructure and Shear Strength of Sn-Ag-Sb Solder Joints," The 3rd International Symposium on Electronics and Packaging 2001 (EMAP2001), Jeju Island, Korea, 2001.11
34.C. H. Raeder, L. E. Felton, D. B. Knorr, G. B. Schmeelk, D. Lee, "Microstructural Evolution and Mechanical Properties of Sn-Bi Based Solders," 1993 IEEE/CHMT International Electronics Manufacturing Technology Symposium, pp.119-127
35.Yoshiharu Kariya, Yasunori Hirata, and Masahisa Otsuka, "Effect of Thermal Cycles on the Mechanical Strength of Quad Flat Pack Leads/Sn-3.5Ag-X(X=Bi and Cu) Solder Joints," Journal of Electronic Materials, Vol.28, Issue11, 1998, pp.1263-1269
36.W. J. Boettinger, C. A. Handwerker, B. Newbury, T. Y. Pan, and J. M. Nicholson, "Mechanism of Fillet Lifting in Sn-Bi Alloys," Journal of Electronic Materials, Vol.31, Issue 5, 2002.6, pp.545-550
37.H. Takao and H. Hasegawa, "Influence of Alloy Composition on Fillet-Lifting Phenomenon in Tin Binary Alloys," Journal of Electronic Materials, Vol. 30, Issue 5, 2001.5, pp.513-520
38.E. P. Wood, K. L. Nimmo, "In Search of New Lead-free Electronic Solders," Journal of Electronic Materials, Vol.23, Issue 8, 1994, pp.709-713
39.Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo, "Intermetallic Compound Layer Formation between Copper and Hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb Coatings," Journal of Electronic Materials, Vol.23, Issue 7, 1994, pp.583-594
40.Yoshiharu Kariya and Masahisa Otsuka, "Mechanical Fatigue Characteristics of Sn-3.5Ag-X(X=Bi, Cu, Zn and In) Solder Alloys," Journal of Electronic Materials, Vol.27, Issue 11, 1998, pp.1229-1235
41.Sungho Jin, Mark Thomas McCormack, United States Patent, Patent Number : 5,762,866, 1998.6
42.Katsuaki Suganuma, Toshikazu Murata, Hiroji Noguchi, Yoshitaka Toyoda, "Heat resistance of Sn-9Zn Solder/Cu Interface with or without Coating," Journal of Material Research, Vol.15, No.4, 2000.4, pp.884-891
43.H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine, "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders," Journal of Electronic Materials, Vol. 26, Issue 7, 1997, pp.783-790
44.Kwang-Lung Lin and Yu-Chien Wang, "Wetting Interaction of Pb-Free Sn-Zn-Al Solders on Metal Plated Substrate," Journal of Electronic Materials, Vol.27, Issue 11, 1998, pp.1205-1210
45.Shan-Pu Yu, Hsiu-Ju Lin, Min-Hsiung Hon, Moo-Chin Wang, "Effects of Process Parameters on the Soldering Behavior of the Eutectic Sn-Zn Solder on Cu Substrate," Journal of Materials Science: Materials in Electronic, Vol. 11, Issue 6, 2000.8, pp.461-471
46.J.C. Foley, A.Gickler, F.H. Leprovost, and D. Brown, "Analysis of Ring and Plug Shear Strengths for Comparison of Lead-Free Solders," Journal of Electronic Materials, Vol. 29, Issue 10, 2000, pp.1258-1263
47.C.M. Chuang, T.S. Lui, and L.H. Chen, "The Characteristics of Vibration Fracture of Pb-Sn and Lead-Free Sn-Zn Eutectic Solders," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1232-1240
48.M.L. Huang, C.M.L. Wu, J.K.L. Lai, L. Wang, and F.G. Wang, "Lead Free Solder Alloys Sn-Zn and Sn-Sb Prepared by Mechanical Alloying," Journal of Materials Science: Materials in Electronic, Vol. 11, Issue 1, 2000.2, pp.57-65
49.Hyuck Mo Lee, Seung Wook Yoon, and Byeong-Joo Lee, "Thermodynamic Prediction of Interface Phases at Cu/Solder Joints," Journal of Electronic Materials, Vol.27, Issue 11, 1998, pp.1161-1166
50.S. Choi, J. G. Lee, K. N. Subramanian, J. P. Lucas and T. R. Bieler, "Microstructural Characterization of Damage in Thermomechanically Fatigued Sn-Ag Based Solder Joints," Journal of Electronic Materials, Vol. 31, Issue 4, 2002.4, pp.292-297
51.Mitsuo Yamashita, Shinji Tada and Kunio Shiokawa, United States Patent, Patent Number: 6,179,935, 2001.1
52.林秀如, 游善溥, 洪敏雄, 王木琴, "共晶錫鋅無鉛焊錫之研究," 1999材料年會論文集, 台灣, 新竹, 工研院, 1999.12
53.王新建, 游善溥, 王木琴, 洪敏雄, "Sn-Zn-Al無鉛銲錫與銅基材熱處理時間對之附著強度與界面反應之影響," 1999材料年會論文集, 台灣, 新竹, 工研院, 1999.12
54.王新建, 游善溥, 王木琴, 洪敏雄, "Sn-Zn-Al合金組成對其與銅基材間附著強度之影響," 1999材料年會論文集, 台灣, 新竹, 工研院, 1999.12
55.Kang-I. Chen and Kwang-Lung Lin, "The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys—the Effect of Ag," Journal of Electronic Materials, Vol.31, Issue 8, 2002.8, pp.861-867
56.Jong Hoon Kim, Sang Won Jeong, and Hyuck Mo Lee, "A Thermodynamic Study of Phase Equilibria in the Au-Sb-Sn Solder System," Journal of Electronic Materials, Vol.31, Issue 6, 2002.6, pp.557-563
57.Goran S. Matijasevic, Chin C. Lee, and Chen Y. Wang, "Au-Sn Alloy Phase Diagram and Properties Related to its Use as a Bonding Medium," Thin Solid Films, Vol. 223, 1993, pp.276-287
58.Joachim Kloeser, Elke Zakel, Franz Bechtold, and Herbert Reichl, "Reliability Investigations of Fluxless Flip-Chip Interconnections on Green Tape Ceramic Substrates," IEEE Transactions on Components, Hybrids, and Manufacturing Technology - Part A, Vol. 19, 1996.3, pp.24-33
59.John F. Cain and Octavio I. Chirino, United States Patent, Patent Number: 3,607,253, 1971.9
60.Mulugeta Abtew, Guna Selvaduray, "Lead-free Solders in Microelectronics," Materials Science and Engineering: R, Vol. 27, Issue 5-6, 2000.6, pp.95-141
61.Z. G. Chen, Y. W. Shi, Z. D. Xia, and Y. F. Yan, "Study on the Microstructure of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints," Journal of Electronic Materials, Vol. 31, Issue 10, 2002.10, pp.1122-1128
62.Kang-I. Chen and Kwang-Lung Lin, "The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys—the Effect of Ag," Journal of Electronic Materials, Vol.31, Issue 8, 2002.8, pp.861-867
63.S.K. Bhattacharya and D.F. Baldwin, Advanced. Packaging, Vol. 9, 2000, pp.61
64.T.J. Anderson and I. Ansara, Journal of Phase Equilibria, Vol.13, 1992, pp.181
65.Hyun-Ki An, Jae-ho Han and In-chul Kim, United States Patent, Patent Number: 6,033,488, 2000.3
66.Kazutaka Habu, Naoko Takeda, Haruo Watanabe, Hiroshi Ooki, Jiro Abe, Takashi Satto, Yoshikuni Taniguchi, Kinjiro Takayama, "Development of Lead-free Solder Alloys of the Ge Doped Sn-Ag-Bi System," 1999 Proceedings EcoDesign '99: First International Symposium on 1999, pp.606-609
67.Xin Ma, Yiyu Qian and Fusahito Yoshida, "Strengthening Sn60-Pb40 Solder Alloy by Adding Trace Amount of La," Materials Letters, Vol. 52, Issues 4-5, 2002.2, pp.319-322
68.N. C. Lee, "Lead-Free Soldering---Where the World Is Going," Advanced Microelectron, Vol.26, 1999.9, pp.29
69.Jong Ho Lee and Dong Nyung Lee, "Use of Thermodynamic Data to Calculate Surface Tension and Viscosity of Sn-Based Soldering Alloy Systems," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1112-1119
70.Wufeng Feng, Chunqing Wang and M. Morinaga, "Electronic Structure Mechanism for the Wettability of Sn-Based Solder Alloys," Journal of Electronic Materials, Vol. 31, Issue 3, 2002.3, pp.185-190
71.Metals Handbook, 10th Edition, Vol.3 Alloy Phase Diagrams, American Society for Metals, Metals Park, 1992
72.Thomas Siewert, Stephen Liu, David R. Smith, and Juan Carlos Madeni, "Properties of Lead-Free Solders Release 4.0---Database for Solder Properties with Emphasis on New Lead-free Solders," National Institute of Standards and Technology & Colorado School of Mines, USA, 2002.2
73.Yujing Wu, Jennifer A. Sees, Cyrus Pouraghabagher, L. Ann Foster, James L. Marshall, Elizabeth G. Jacobs and Russell F. Pinizzotto, "The Formation and Growth of Intermetallics in Composite Solder," Journal of Electronic Materials, Vol.22, Issue 7, 1993, pp.769-777
74.R. F. Pinizzotto, E. G. Jacobs, Y. Wu, J. A. Sees, L. A. Foster and C. Pouraghabagher, "The Dependence of the Activation Energies of Intermetallic Formation on the Composition of Composite Sn/Pb Solders," Reliability Physics Symposium, 1993 31st IEEE Annual Proceedings, 1993, pp.209-216
75.Jong-Hyun Lee, Dea-Jin Park, Jung-Na Heo, Yong-Ho Lee, Dong-Hyuk Shin and Yong-Seog Kim, 'Reflow Characteristics of Sn-Ag Matrix In-Situ Composite Solders,' Scripta Materialia, Vol. 42, 2000, pp.827–831
76.M. McCormack, S. Jin, G. W. Kammlott, "Suppression of Microstructural Coarsening and Creep Deformation in a Lead-free Solder," Applied Physics Letter, Vol.64, No.5, 1994.1, pp.580-582
77.S. Jin, M. McCormack, "Dispersion Additions to a Pb-free Solder for Suppression of Microstructural Coarsening," Journal of Electronic Materials, Vol.23, No.8, 1994, pp.735-739
78.Jeff Sigelko, S. Choi, K.N. Subramanian, James P. Lucas, and T.R. Bieler, "Effect of Cooling rate on Microstructure and Mechanical Properties of Eutectic Sn-Ag Solder Joints with and without Intentionally Incorporated Cu6Sn5 Reinforcements," Journal of Electronic Materials, Vol. 28, Issue 11, 1999, pp.1184-1188
79.S. Choi, T. R. Bieler, J. P. Lucas, and K. N. Subramanian, "Characterization of the Growth of Intermetallic Interfacial Layers of Sn-Ag and Sn-Pb Eutectic Solders and Their Composite Solders on Cu Substrate during Isothermal Long-Term Aging," Journal of Electronic Materials, Vol. 28, Issue 11, 1999, pp.1209-1215
80.J. McDougall, S. Choi, T.R. Bieler, K.N. Subramanian, J.P. Lucas, "Quantification of Creep Strain Distribution in Small Crept Lead-Free In-situ Composite and Non Composite Solder Joints," Materials Science and Engineering A, Volume: 285, Issue: 1-2, June 15, 2000, pp.25 - 34
81.F. Guo, J. Lee, S. Choi, J. P. Lucas, T. R. Bieler and K. N. Subramanian, "Processing and Aging Characteristics of Eutectic Sn-3.5Ag Solder Reinforced with Mechanically Incorporated Ni Particles," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1073-1082
82.F. Guo, J. Lee, J. P. Lucas, K. N. Subramanian and T. R. Bieler, "Creep Properties of Eutectic Sn-3.5Ag Solder Joints Reinforced with Mechanically Incorporated Ni Particles," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1222-1227
83.H. Mavoori and S. Jin, "New, Creep-Resistant, Low Melting Point Solders with Ultrafine Oxide Dispersions," Journal of Electronic Materials, Vol.27, Issue 11, 1998, pp.1216-1222
84.D. Lin, G. X. Wang, T. S. Srivatsan, Meslet Al-Hajri and M. Petraroli, "The Influence of Copper Nanopowders on Microstructure and Hardness of Lead-Tin Solder," Materials Letters, Vol. 53, Issues 4-5, 2002.4, pp.333-338
85.Sung K. Kang and Amit K. Sarkhel, "Lead(Pb)-Free Solders for Electronic Packaging," Journal of Electronic Materials, Vol. 23, No.8, 1994, pp.701-707
86.劉家明, 高振宏, "Ni與96.5Sn-3.5Ag無鉛銲料反應生成介金屬機制之探討," 1999材料年會論文集, 台灣, 新竹, 工研院, 1999.12
87.M. McCormack, S. Jin, G. W. Kammlott, and H. S. Chen, "New Pb-free Solder Alloy with Superior Mechanical Properties," Applied Physics Letter, Vol.63, No.1, 1993.7, pp.15-17
88.M. McCormack, S. Jin, "New, Pb-free Solders," Journal of Electronic Materials, Vol. 23, No.7, 1994, pp.635-640
89.M. McCormack, S. Jin, "Improved Mechanical Properties in New, Pb-free Solder Alloys," Journal of Electronic Materials, Vol.23, Issue 8, 1994, pp.715-720
90.Kazutaka Habu, Naoko Takeda, Haruo Watanabe, Hiroshi Ooki, Jiro Abe, Takashi Saito, Yoshikuni Taniguchi, and Kinjiro Takayama, "Development of New Pb-free Solder Alloys of Sn-Ag-Bi System," Proceedings of the International Symposium on 1999, pp.21-24
91.P. T. Vianco, K. L. Erickson and P. L. Hopkins, "Solid State Intermetallic Compound Growth between Copper and High Temperature, Tin-rich Solders-Part I: Experimental Analysis," Journal of Electronic Materials, Vol.23, Issue 8, 1994, pp.721-728
92.R. K. Mahidhara, S. M. L. Sastry, K. L. Jerina, Iwona Turlik, K. L. Murty, "Room Temperature Tensile Properties of Sn-5%Sb Solder," Journal of Materials Science Letters, Vol.13, 1994, pp.1387-1389
93.R. K. Mahidhara, S. M. L. Sastry, Iwona Turlik, K. L. Murty, "Deformation and Fracture Behavior of Sn-5Sb Solder," Scripta Metallurgica et Meterialia, Vol. 31, No. 9, 1994, pp.1145-1150
94.M.H.N. Beshai, S.K. Habib, G. Saad, M.M. Hasab EL-Naby, "Effect of SnSb Particle Size on Creep Behavior under Power Law Regime of Sn-10%Sb Alloy," Crystalline Research Technology, Vol. 34, 1999, pp.119-126
95.V. Vassiliev, M. Lelaurain, J. Hertz, ""A New Proposal for the Binary (Sn,Sb) Phase Diagram and its Thermodynamic Properties Based on a New e.m.f Study," Journal of Alloys and Compounds, Vol.247, 1997, pp.223-233
96.P.J.T.L. Oberndorff, A.A. Kodentsov, V. Vuorinen, J.K. Kivilahti and F.J.J. van Loo, "Phase Relations in The Sn-Ag-Sb System at 220℃," Berichte der Bunsen-Gesellschaft fur Physikalische Chemie, No.9, 1998, pp.1321-1325
97.Yasuyuki Miyazawa ,Tadashi Ariga, "Microstructural Change and Hardness of Lead Free Solder Alloys," Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium, 1999, pp.616-619
98.Yasuyuki Miyazawa and Tadashi Ariga, "Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag,Bi,Zn) Eutectic Solder Alloys," Materials Transactions, Vol. 42, No.5, 2001, pp.776-782
99.Anton Zoran Miric, Angela Grusd, "Lead-free Alloys," Soldering & Surface Mount Technology, Vol.10, No.1, 1998, pp.19-25
100.M. McCormacks, S. Jin, H. S. Chin, D. A. Machusak, "New Lead-free, Sn-Zn-In Solder Alloys," Journal of Electronic Materials, Vol.23, Issue 7, 1994, pp.687-690
101.Alan Rae, "Lead-Free: The Designer's Dilemma," http://www.circuitsassembly.com/, Online Exclusives Archives, 2002.12
102.J. Glazer, International Materials Reviews, Vol. 40, Issue 2, 1995, pp.65-93
103.Susan Crum, "Targeting Lead-Free Solutions," EP&P, 1999.6, pp.28-35
104.Lead-Free Solder Project - Final Report 0401RE96, National Center of Manufacturing Sciences (USA), 1997.8
105.B. P. Richards, C. L. Levoguer, C. P. Hunt, K Nimmo, S Peters, P Cusack, “An Analysis of the Current Status of Lead-Free Soldering,” US Department of Trade and Industry (DTI), Technological report, 1999.1
106.Room Temperature Tensile Properties of Lead-Free Solder Alloys, Technical Reports for the Lead Free Solder Project: Properties Reports, Lead Free Solder Project CDROM, USA, National Center for Manufacturing Sciences (NCMS), 1998
107.Down Selection, Technical Reports for the Lead Free Solder Project: Properties Reports, Lead Free Solder Project CD-ROM, National Center for Manufacturing Sciences (NCMS), 1998
108.John H. L. Pang, Kwang Hong Tan, Xunqing Shi, and Z. P. Wang, "Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint Specimen," IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 1, 2001.3, pp.10-15
109.咎世蓉, "無鉛銲錫在電子封裝產品的應用與發展現況," 1999材料年會論文集, 台灣, 新竹, 工研院, 1999.12
110.Martin R Harrison & James H Vincent, "IDEALS Improved Design Life and Environmentally Aware Manufacturing of Electronic Assemblies by Lead-Free Soldering", Marconi Materials Technology Limited
111.David Suraski, "A Study of Antimony in Solder," AIM Technical Paper, pp.1-7
112.1997 CERCLA Priority List of Hazardous Substances, USA
113.Metals Handbook, 8th Edition, Vol.8 Metallography, Structures and Phase Diagrams, American Society for Metals, Metals Park, 1976
114.G. Petzow and G. Effenberg edit, "Ternary Alloys Vol. 2," VCH Verlagsgesellschaft, 1988
115.D. Bruce Masson and Brian K. Kirkpatrick, "Equilibrium Solidification of Sn-Ag-Sb Thermal Fatigue-Resistant Solder Alloys," Journal of Electronic Materials, Vol. 15, No. 6, 1986, pp.349-353
116.Chang-Seok Oh, Jae-Hyeok Shim, Byeong-Joo Lee and Dong-Nyung Lee, "A Thermodynamic Study on the Ag-Sb-Sn System," Journal of Alloys and Compounds, Vol. 238, No. 1-2, 1996, pp.155-166
117.Dennis R. Olsen and Keith G. Spanjer, United States Patent, Patent Number : 4,170,472, 1979.10
118.Shigemasa Kusabiraki and Manabu Sumita, United States Patent, Patent Number : 6,229,248, 2001.5
119.David Suraski and Karl Seelig, "The Current Status of Lead-Free Solder Alloys," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, 2001.10, pp.224-248
120.Dennis R. Olsen and Keith G. Spanjer, "Improved Cost Effectiveness and Product Reliability through Solder Alloy Development," Solid State Technology, 1981.9, pp.121-126
121.饒慧美, "添加Sb、Cu對無鉛銲料Sn-Ag銲點之機械性質及微結構研究'," 國立成功大學機械研究所, 碩士論文, 2000.6
122.廖天龍, "添加Sb對Sn-Ag無鉛銲料之銲點剪切強度研究," 國立成功大學機械研究所, 碩士論文, 2001.6
123.楊傳鏈, "添加Sb 對Sn-Ag 無鉛銲料銲點微結構與剪切強度之影響," 國立成功大學機械研究所, 碩士論文, 2002.6
124.A. Gangulee, G. C. Das and M. B. Bever, "An X-Ray Diffraction and Calorimetric Investigation of the Compound Cu6Sn5," Metallurgical Transactions, Vol. 4, 1973.9, pp.2063-2066
125.H. K. Kim, H. K. Liou, and K. N. Tu, "Three-dimensional Morphology of a Very Rough Interface Formed in the Soldering Reaction between Eutectic SnPb and Cu," Applied Physics Letters, Vol. 66, Issue 18, 1995.5, pp.2337-2339
126.D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, "The Mechanics of Solder Alloy Interconnects," Van Nostrand Reinhold, New York, 1994, p60
127.H. P. R. Frederikse, R. J. Fields, and A. Feldman, 'Thermal and Electrical Properties of Copper-Tin and Nickel-Tin Intermetallics,' Journal of Applied Physics, Vol. 72, Issue 7, 1992.10, pp2879-2882
128.R. J. Fields and S. R. Low, 'Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints,' Metallurgy Division of National Institute of Standards and Technology (NIST), USA, Technical paper, 2001
129.A.-K. Larsson, L. Stenberg and S. Lidin, "The Superstructure of Domain-twinned h'-Cu6Sn5," Acta Crystallographica Section B, Vol.50, 1994.12, pp.636-643
130.P. L. Brooks and E. Gillam, "The e-Phase in the Cu-Sn System," Acta Metallurgica, Vol. 18, 1970.11, pp.1181-1185
131.H. K. Kim and K. N. Tu, "Kinetic Analysis of the Soldering Reaction between Eutectic SnPb Alloy and Cu Accompanied by Ripening," Physical Review B53, 1996, pp.16027–16034
132.H. K. Kim and K. N. Tu, "Rate of Consumption of Cu in Soldering Accompanied by Ripening," Applied Physics Letters, Vol. 67, Issue 14, 1995.10, pp.2002-2004
133.K. N. Tu, "Cu/Sn Interfacial Reaction: Thin-Film Case versus Bulk Case," Materials Chemistry and Physics, Vol.46, 1996, pp.217-223
134.Matt Schaefer, Raymond A. Fournelle, and Jin Liang, "Theory for Intermetallic Phase Growth between Cu and Liquid Sn-Pb Solder Based on Grain Boundary Diffusion Control," Journal of Electronic Materials, Vol. 27, Issue 11, 1998.11, pp.1167-1176
135.D. A. Porter and K. E. Easterling, "Phase Transformations in Metals and Alloys," 2nd edition, Chapman & Hall, 1992, p102
136.K. L. Erickson and P. L. Hopkins, P. T. Vianco, "Solid State Intermetallic Compound Growth between Copper and High Temperature, Tin-rich Solders-Part II: Modeling," Journal of Electronic Materials, Vol.23, Issue 8, 1994, pp.729-734
137.K. N. Yu, Fiona Ku, T. Y. Lee, "Morphological Stability of Solder Reaction Products in Flip Chip Technology," Journal of Electronic Materials, Vol. 30, No. 9, 2001, pp.1129-1132
138.陳明宏, "錫銲接點之機械性質與顯微組織研究," 國立成功大學機械研究所, 碩士論文, 1999.5
139.蕭本俐, 何政恩, 高振宏, "球矩陣封裝內鎳與鉛錫銲料界面反應之研究," 1999材料年會論文集, 1999.12
140.Won Kyoung Choi and Hyuck Mo Lee, "Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface between Molten Sn-3.5Ag and Ni/Cu Substrate," Journal of Electronic Materials, Vol. 28, Issue 11, 1999, pp.1251-1255
141.Sinn-Wen Chen, Chih-Ming Chen, and Wen-Chyuarn Liu, "Electric Current Effects Upon the Sn/Cu and Sn/Ni Interfacial Reactions," Journal of Electronic Materials, Vol.27, Issue 11, 1998, pp.1193-1197
142.Chih-Ming Chen and Sinn-Wen Chen, "Electric Current Effects on Sn/Ag Interfacial Reactions," Journal of Electronic Materials, Vol. 28, Issue 7, 1999.7, pp.902-906
143.C.-M. Chen, S.-W. Chen, "Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures," Acta Materialia, Vol. 50, 2002, pp.2461–2469
144.William C. Johnson and G. Martin, "Influence of Elastic Stress on the Growth Kinetics of Planar Thin-film Binary Diffusion Couples," Journal of Applied Physics, Vol. 68, Issue 3, 1990.8, pp.1252-64
145.F.C. Larché and J.W. Cahn: Acta Metallurgica et Materialia, 1973, vol. 21, pp.1051-61.
146.F.C. Larché and J.W. Cahn: Acta Metallurgica et Materialia, 1992, vol. 40, pp.947-56.
147.F.C. Larché and J.W. Cahn: Acta Metallurgica et Materialia, 1982, vol. 30, pp.1835-46.
148.William C. Johnson, "Effect of Elastic Stress on Two-Phase Binary Diffusion Couples," Metallurgical and Materials Transactions A, Vol. 28A, Issue 1, 1997, pp.27-38
149.Yujing Wu, Elizabeth G. Jacobs, Cyrus Pouraghabgher, and Russell F. Pinizzotto, "In-Situ TEM Study of Copper-Tin Intermetallic Formation," Materials Research Society Symposium Proceeding, Vol. 323, 1994, pp.165-170
150.D. C. Yeh and H. B. Huntington, "Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin," Physical Review Letters, Vol. 53, Issue 15, 1984.10, pp.1469-1472
151.J. Y. Park, C. W. Yang, J. S. Ha, C. U. Kim, E. J. Kwon, S. B. Jung and C. S. Kang, "Investigation of Interfacial Reaction between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1165-1170
152.Siegfried Däbritz, Wolfgang Hauffe, 'Characterization of Cu-Sn/Pb Diffusion Zones of Microelectronic Contacts by Means of Electron Probe Microanalysis and Ion Beam Sputtering,' Fresenius Journal of Analytical Chemistry, Vol. 353, 1995, pp.271–277
153.S. Däbritz, E. Langer, W. Hauffem, "Combined Use of Lattice Source Interferences and Divergent Beam X-ray Interferences to Investigate the Microstructure of Ion-bombarded Cu-Sn-diffusion zones," Fresenius Journal of Analytical Chemistry, Vol. 358, Issue 1/2, 1997, pp.148-153
154.S.K. Kang and S. Purushothaman, "Study of Interfacial Reactions between Tin and Copper by Differential Scanning Calorimetry," Journal of Electronic Materials, Vol.27, Issue 11, 1998, pp.1199-1204
155.Lenora Quan, Darrel Frear, Dennis Grivas, J. W. Morris Jr., "Tensile Behavior of Pb-Sn Solder/Cu Joints," Journal of Electronic Materials, Vol.16, Issue 3, 1987, pp.203-208
156.S. Kikuchi, M. Nishimura, K. Suetsugu, T. Ikari, K. Matsushige, "Strength of Bonding Interface in Lead-free Sn Alloy Solders," Materials Science and Engineering A, Vol.319–321, 2001, pp.475–479
157.K. S. Kim, S. H. Huh, and K. Suganuma, "Effects of Intermetallic Compounds on Properties of Sn-Ag-Cu Lead-free Soldered Joints," Journal of Alloys and Compounds, Vol 352, 2003, pp.226-236
158.Bi-Shio Chiou, Jiann-Haur Chang, Jenq-Gong Duh, "Metallurgical Reactions at the Interface of Sn/Pb Solder and Electroless Copper-Plated AlN Substrate," IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B, Vol.18, No.3, 1995, pp.537-542
159.N. R. Bonda, I. C. Noyan, "Effect of the Specimen Size in Predicting the Mechanical Properties of PbSn Solder Alloys," IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol.19, No.2, 1990.6, pp.208-212
160.M. Cole, T. Caulfield, "Constant Strain Rate Tensile Properties of Various Lead Based Solder Alloys at 0, 50 and 100℃," Scripta Metallurgica et Materialia, Vol.27, 1992, pp.903-908
161.Nicolae Iosipescu, "New Accurate Procedure for Single Shear Testing of Metals," Journal of Materials, Vol. 3, No. 2, 1967.9, pp.537-566
162.ASTM D5379/D5379M-98, "Standard Test Method for Shear Properties of Composite Materials by the V-Notched Beam Method," American Society for Testing of Materials, 1998
163.李驊登, 陳明宏, 饒慧美, "添加Cu對Sn-Ag-Sb銲錫接點附著強度之影響," 2000年材料科學研討會論文集, 台灣, 高雄, 義守大學, 2000.11
164.J. S Hwang, Z.Guo and G. Lucey, "Strengthened Solder Materials for Electronic Packaging," Surface Mount International Conference, USA, California, San Jose, 1993.8, pp.45-51
165.Peter L. Hacke and et al., "Modeling of Thermomechanical Fatigue of 63Sn-37Pb Alloy," Thermomechanical Fatigue Behavior of Materials - Vol.1, Huseyin Sehitoglu Edit, ASTM STP 1186, 1993
166.ASTM F1269-89, "Test Methods for Destructive Shear Testing of Ball Bonds," American Society for Testing of Materials, 1995
167.J. R. Oliver, J. Liu and Z. Lai, "Effect of Thermal Aging on the Shear Strength of Lead-Free Solder Joint," 2000 International Symposium on Advanced Packaging Materials, 2000, pp.152-157
168.G. Schammler, K. Buschick, R. Hahn, H. Reichl, "Shear Test for Adhesion Measurement of Small Structures," IEEE 1997IRW Final report, pp.31-36
169.H.L.J. Pang, K.H. Tan, X.Q. Shi, Z.P. Wan, "Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging, " Materials Science and Engineering A, Vol. 307, 2001, pp.42–50
170.Z. Mei, J. W. Morris, Jr., "Fatigue Lives on 60Sn/40Pb Solder Joints Made with Different Cooling Rates," Transactions of ASME-Journal of Electronic Packaging, Vol. 114, 1992.6, pp.104-111
171.Z. Mei, J. W. Morris, Jr., M. C. Shine, "Superplastic Creep of Eutectic Tin-Lead Solder Joints," Journal of Electronic Packaging, Vol.113, 1991.6, pp.109-114
172.Shawkret Ahat, Huang Weidong, Sheng Mei and Luo Le, "Joint Shape, Microstructure, and Shear Strength of Lead-Free Solder Joints with Different Component Terminations," Journal of Electronic Materials, Vol. 31, Issue 2, 2002.2, pp.136-141
173.Ö. Ünal, D. J. Barnard and I. E. Anderson, "A Shear Test Method to Measure Shear Strength of Metallic Materials and Solder Joints Using Small Specimens," Scripta Materials, Vol.40, No.3, 1999, pp.271-276
174.B. A. Cook, I. E. Anderson, J. L. Harringa, R. L. Terpstra, J. C. Foley, and F. C. Laabs, "Shear Deformation in Sn-3.5Ag and Sn-3.6 Ag-1.0Cu Solder Joints Subjected to Asymmetric Four Point Bend Tests," Journal of Electronic Materials, Vol. 30, Issue 9, 2001.9, pp.1214-1221
175.Amos Gilat and Kavita Hrishna, "Test Eutectic Tin-Lead in Pure Shear," ASME Advances in Electronic Packing Eep., Vol. 4-2, 1993, pp.1017-1018
176.Z. Guo, A. F. Sprecher, and H. Conrad, "Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue," Transactions of ASME-Journal of Electronic Packaging, Vol. 114, 1992.6, pp.112-117
177.Robert Darveaux, and Iwona Turlik, "Shear Deformation of Indium solder Joints," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.13, No.4, 1990, pp.929-939
178.T. Reinokainen, M. Poech, M. Krumm, and J. Kivilahti, "A Finite Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints," Transactions of ASME-Journal of Electronic Packaging, Vol. 120, 1998, pp.106-113
179.Katsuaki Suganuma, Seok-Hwang Huh, Keunsoo Kim, Hirofumi Nakase, Yoshikazu Nakamura, "Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder," Materials Transactions, Vol. 42, No. 2, 2001, pp.286-291
180.Hwa-Teng Lee, Ming-Hung Chen, Shuen-Yuan Hu, Cheng-Shyan Li, "Influence of Sb addition on Microstructural Evolution of Sn-Ag solder," The 4th International Symposium on Electronic Materials and Packaging (EMAP2002), Kaohsiung, Taiwan, 2002.12
181.Hwa-Teng Lee, Ming-Hung Chen, "Influence of Intermetallic Compounds on the Adhesive Strength of Solder Joints," Material Science and Engineering A, Vol. 333, 2002.8, pp24-34
182.A. K. Bandyopadhyay and S. K. Sen, 'A Study of Intermetallic Compound Formation in a Copper-Tin Bimetallic Couple,' Journal of Applied Physics, Vol.67, Issue 8, 1990.4, pp.3681-3688
183.Robert A. Galiano, Morris E. Fine, "Growth of η Phase Scallops and Whiskers in Liquid Tin-Solid Copper Reaction Couples," JOM: the Journal of the Minerals, Metals & Materials Society, 2001.6, pp.33-38
184.Darrel Frear, Dennis Grivas, J. W. Morris Jr., "The Effect of Cu6Sn5 Whisker Precipitates in Bulk 60Sn-40Pb Solder," Journal of Electronic Materials, Vol.16, Issue 5, 1987, pp.181-186
185.Won Kyoung Choi, Se-Young Jang, Jong Hoon Kim, Kyung-Wook Paik, and Hyuck Mo Lee, "Grain Morphology of Intermatallic Compounds at solder Joints," Journal of Materials Research, Vol. 17, No. 3, 2002, pp.597-599
186.D. A. Porter and K. E. Easterling, "Phase Transformations in Metals and Alloys," 2nd edition, Chapman & Hall, 1992, p170
187.K. -S. Bae and S. -J. Kim, "Interdiffusion Analysis of the Soldering Reactions in Sn-3.5Ag/Cu Couples," Journal of Electronic Materials, Vol. 30, Issue 11, 2001.11, pp.1452-1457
188.Shawkret Ahat, Mei Sheng and Le Luo, "Microstructure and Shear Strength Evolution of SnAg/Cu Surface Mount Solder Joint during Aging," Journal of Electronic Materials, Vol. 30, Issue 10, 2001.10, pp.1317-1322
189.S. Chada, W. Laub, R. A. fournelle and D. Shangguan, "An Improved Numerical Method for Predicting Intermetallic Layer Thickness Developed during the Formation of Solder Joints on Cu Substrates," Journal of Electronic Materials, Vol. 28, Issue 11, 1999.11, pp.1194-1202
190.S.-Y. Jang, J. Wolf, O. Ehrmann, H. Reichl, K.-W. Paik, "Pb-free Sn/3.5Ag Wafer-bumping Process and UBM (Under Bump Metallurgy) Study," Microsystem Technologies, Vol. 7, No. 5/6, 2002, pp.269-272
191.S. Chada, A. Herrmann, W. Laub, R. Fournelle, D. Shangguan, and A. Achari, "Microstructural Investigation of Sn-Ag and Sn-Pb-Ag Solder Joints," Soldering & Surface Mount Technology, No. 26, 1997.07, pp.9-21
192.T.Y. Lee, W.J. Choi, and K.N. Tu, "Morphology, Kinetics, and Thermodynamics of Solid-state Aging of Eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu," Journal of Materials Research, Vol. 17, No. 2, 2002, pp.291-301
193.K.S. Kim, S.H. Huh, K. Suganuma, "Effects of Fourth Alloying Additive on Microstructures and Tensile Properties of Sn–Ag–Cu alloy and Joints with Cu," Microelectronics Reliability, Vol.43, 2003, pp.259-267
194.J. J. Ramon, S. F. Dirnfeld, "A Practical Way to Measure the Strength of Small Soldered Solder Joints," Welding Journal, Vol.67, 1988.10, pp.19-21
195.Shan-Pu Yu, Min-Hsiung Hon, Moo-Chin Wang, "The Adhesion Strength of a Lead-Free Solder Hot-Dipped on Copper Substrate," Journal of Electronic Materials, Vol. 29, Issue 2, 2000, pp.237-243
196.K.S. Kim, S.H. Huh, K. Suganuma, "Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys," Materials Science and Engineering A, Vol. 333, 2002, pp.106-114
197.Z. Mei, A. J. Sunwoo, and J. W. Morris, Jr., "Analysis of Low-Temperature Intermetallic Growth in Copper-Tin Diffusion Couples," Metallurgical Transactions A, Vol. 23A, 1992.3, pp.857-864
198.張家福, "光電二極體錫銲構裝之IMC層應力分析," 國立中山大學機械與機電研究所, 碩士論文, 1999.6
199.胡順源, "Sn-Ag-xSb無鉛錫銲接點與Au/Ni-P/Cu金屬層之界面微結構與剪切強度研究," 國立成功大學機械研究所, 碩士論文, 2003.6
200.李政賢, "Sn-Ag-xSb無鉛錫銲接點微結構與低週疲勞之研究", 國立成功大學機械研究所, 碩士論文, 2003.6