簡易檢索 / 詳目顯示

研究生: 黃品睿
Huang, Pin-Jui
論文名稱: 電遷移對 7075-T6 鋁合金及 4N 純鋁微拉伸機械性質和微結構的影響
Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of 7075-T6 Aluminum Alloys and 4N Pure Aluminum
指導教授: 林光隆
Lin, Kwang-Lung
學位類別: 碩士
Master
系所名稱: 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年: 2023
畢業學年度: 111
語文別: 中文
論文頁數: 349
中文關鍵詞: 7075-T6 、純鋁 、電遷移 、微拉伸
外文關鍵詞: 7075-T6, Pure Aluminum, Electromigration, Micro Tensile Test
相關次數: 點閱:128  下載:0 
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報
  • 7075-T6鋁合金以17000~23000A/cm2電流密度通直流電,並以4N純鋁作為無析出物的對照組,通17000~30000A/cm2電流密度的直流電,通電之後以拉伸試驗以及微硬度試驗觀察電流對上述兩種鋁合金的機械性質影響。
    7075-T6鋁合金在經過1循環、通電1-30 min的通電實驗後,機械強度以及韌性普遍隨通電時間和電流密度增加而微幅下降;而微硬度卻在通電後有所提升,23000A/cm2電流密度通電後試片的微硬度最高有5-7%的強化;微拉伸機械性質的下降源自於通電後晶粒隨通電時間增加而成長,通電對於7075-T6的析出強化相無顯著影響,進行多循環的通電也無法強化它。
    4N純鋁經過各電流密度通電,降伏強度與楊氏係數皆有60%上的強化,在某些條件下,分別可以達到接近120%與130%的強化。伸長率也有所提升,進而提升韌性;但極限抗拉強度則微幅下降。純鋁的多循環通電雖增加總通電時間,但並不能再進一步強化其機械性質。純鋁在通電之後機械性質獲得強化,但其為組織變化,例如晶粒細化,不能完全解釋降伏強度和楊氏係數的強化;理論計算所得結果也於實驗結果不同,故目前對於降伏應力和楊氏係數顯著提升的現象沒有明確的解釋。

    7075-T6 Aluminum alloys were subjected to direct electric current stressing at current densities of 17000~23000A/cm2 for duration times(td) ranging from 1 to 30 min while being fan-cooled. Micro Tensile Test (MTT) was used as the primary method to obtain the mechanical properties of the specimens after being stressed with current. All mechanical properties, except for micro hardness obtained from the Vickers microhardness test, showed a slight decrease after being stressed with current. However, the micro hardness increased up to 7.25% after 5 minutes of current stressing at 23000A/cm2. As current densities and td were raised, the degree of grain growth was also increased. The High Angle Annular Dark-Field (HAADF) analysis revealed that the nano precipitates, which are considered to be the primary strengthening factor in 7075-T6 alloys, were not affected by current stressing. Cyclic current stressing at 17000, 20000, and 23000A/cm2 for 1 min showed similar results. Non-precipitated 4N aluminum was used as a control group in experiments which were similar to those conducted on 7075-T6, but with the addition of an extra current density, 30000A/cm2. After current stressing, pure aluminum exhibited a markedly different response. The yield stress (YS) and Young's modulus (E) of the specimens increased by up to about 120%, while a minor strengthening observed in elongation (EL) and microhardness. The toughness of the current-stressed specimens also increased, although slight decrease was noted in the ultimate tensile strength (UTS) of the samples. Despite a certain degree of grain refinement, there was still insufficient evidence of such significant increases in YS and E. Cyclic current stressing pure aluminum at 17000, 20000, 23000 and 30000A/cm2 for 1 min resulted in similar behavior as 1 cycle current stressing.

    中文摘要 I Extended Abstract III 致謝 LVI 總目錄 LVII 圖目錄 LXI 表目錄 XCIII 第一章簡介 1 1-1 電遷移 1 1-1-1 電遷移簡史 1 1-1-2 電遷移理論 2 1-1-2-1 焦耳熱效應 3 1-1-3 電遷移對材料的影響 3 1-2 電塑性 15 1-2-1 電塑性理論 15 1-2-2 電塑性實例 19 1-3 鋁合金簡介 29 1-3-1 7075鋁合金析出物簡介 30 1-3-2 電遷移對鋁合金的影響 31 1-4 研究動機 38 第二章實驗方法 39 2-1 實驗構成 39 2-1-1 試片成分與尺寸 39 2-1-2 通電載台 40 2-1-3 測量試片溫度 41 2-1-4 通電實驗 42 2-1-4-1 風扇 44 2-1-5 電解拋光 44 2-2 機械性質測量 54 2-2-1 微拉伸試驗 54 2-2-2 維氏微硬度試驗 54 2-2-3 奈米壓痕試驗 55 2-3 微結構觀察與分析 59 2-3-1 X光繞射 59 2-3-2 掃描式電子顯微鏡分析 60 2-3-3 電子背向散射繞射分析 60 2-3-4 穿透式電子顯微鏡分析 61 2-3-4-1 高角度環形暗視野影像-掃描穿透電子顯微鏡 63 2-3-5 試片通電後微結構或機械性質觀察量測順序 64 第三章結果與討論 71 3-1 7075-T6通電變化 71 3-1-1 通電時試片中心溫度 71 3-1-2 通電後的機械性質 73 3-1-3 破斷面觀察 84 3-1-4 微結構分析(EBSD) 90 3-1-4-1通電後晶粒成長與晶格組織變化 90 3-1-5 XRD差排密度與晶格應變分析 111 3-1-6 穿透式電子顯微鏡分析 122 3-1-7 機械性質定量計算 138 3-1-8 熱對照組機械性質 144 3-2 7075-T6循環通電結果 148 3-2-1 通電後的機械性質(微硬度) 148 3-2-2 微結構分析(EBSD) 150 3-2-3 XRD差排密度與晶格應變分析 165 3-3 4N 純鋁通電變化 175 3-3-1 通電時試片中心的溫度 175 3-3-2 通電後的機械性質 177 3-3-3 破斷面觀察 192 3-3-4 微結構分析(EBSD) 202 3-3-5 機械性質定量計算 223 3-4 4N純鋁循環通電結果 227 3-4-1 通電後的機械性質 227 3-4-2 破斷面觀察 235 3-4-3 微結構分析(EBSD) 240 3-4-4 機械性質定量計算 260 第四章結論 263 參考文獻 265 附錄 271 附錄一7075-T6 1循環通電微結構附圖 271 附錄二7075-T6 1循環通電穿透式電子顯微鏡分析附圖 302 附錄三4N純鋁1循環通電微結構附圖 318

    [1] J. R. Black, Electromigration - a brief survey and some recent results, IEEE Transaction on Electron Devices 16(4) (1969) 338-347.
    [2] P. S. Ho and T, Kwok, Electromigration in metals, Reports on Progress in Physics 52 (1989) 301-348.
    [3] F. Skaupy, Electrical conduction in metals, Verband Deutscher Physikalischer Gesellschaften 16 (1914), 156-157.
    [4] V. B. Fiks, On the mechanism of the mobility of ions in metals, Soviet Physics-Solid State 1(1) (1959) 14-28.
    [5] H. B. Huntington and A. R. Grone, Current-induced marker motion in gold wires, Journal of Physics and Chemistry of Solids 20(1-2) (1961) 76-87.
    [6] J. Lieng and M. Thiele, Fundamentals of electromigration-aware integrated circuit design, Berlin: Springer(2018) 14.
    [7] H. B. Huntington, Diffusion in solids:recent developments, edited by A. S. Nowick and J. J. Burton, Academic Press, New York (1975) 303-352.
    [8] C. C. Hsu, C. L. Liang and K. L. Lin, Electro-work hardening of metals induced by the athermal electromigration effect, Materials Science and Engineering A 772 (2020) 138689.
    [9] Y. Zhou, J. Guo, W. Zhang and G. He, Influence of electropulsing on nucleation during phase transformation, Journal of Materials Research 17(12) (2002) 3012-3014.
    [10] Y. Zhou, S. Xiao and J. Guo, Recrystallized microstructure in cold worked brass produced by electropulsing treatment, Materials Letters 58(12-13) (2004) 1948-1951.
    [11] P. C. Liang and K. L. Lin, Non-deformation recrystallization of metal with electric current stressing, Journal of Alloys and Compounds 722 (2017) 690-697.
    [12] C. L. Liang, S. W. Lee and K. L. Lin, The mechanism of an increase in electrical resistance in Al thin film induced by current stressing, Thin Solid Films 636 (2017) 164-170.
    [13] J. Park, H. Jeong, S. Jin, M. Kim, K. Lee, J. J. Kim, S. Hong and H. N. Han, Effect of electric current on recrystallization kinetics in interstitial free steel and AZ31 magnesium alloy, Materials Characterization 133 (2017) 70-76.
    [14] E. S. Machilin, Applied voltage and the plastic properties of “brittle” rock salt, Journal of Applied Physics 30(7) (1959) 1109.
    [15] O. A. Troitskii and V. I. Likhtman, The anisotropy of the action of electron and γ radiation on the deformation of zinc single crystals in the brittle state, Soviet Physics Doklady 8(1963) 91.
    [16] V. Y. Kravchenko, Effect of directed electron beam on moving dislocations, Soviet Physic JETP 24(6) (1967) 1135-1142.
    [17] A. F. Sprecher, S. L. Mannan and H. Conrad, On the mechanism for the electroplastic effect in metals, Acta Metallurgica 34(7) (1986) 1145-1162.
    [18] Y. Kamimura, K. Edagawa, S. Takeuchi, Experimental evaluation of the Peierls stresses in a variety of crystals and their relation to the crystal structure, Acta Materialia 61(1) (2013) 294-309.
    [19] M. J. Kim, S. Yoon, S. Park, H. J. Jeong, J. W. Park, K. Kim, J. Jo, T. Heo, S. T. Hong, S. H. Cho, Y. K. Kwon, I. S. Choi, M. Kim and H.N. Han, Elucidating the origin of electroplasticity in metallic materials, Applied Materials Today 21 (2020) 100874.
    [20] K. Okazaki, M. Kagawa and H. Conrad, An evaluation of the contributions of skin, pinch and heating effects to the electroplastic effect in Titatnium, Materials Science and Engineering 45(2) (1980) 109-116.
    [21] S. Xiang, X. Zhang, Dislocation structure evolution under electroplastic effect, Materials Science & Engineering A 761 (2019) 138026.
    [22] G. Tang, J. Zhang, Y. Yan, H. Zhou and W. Fang, The engineering application of the electroplastic effect in the cold-drawing of stainless steel wire, Journal of Materials Processing Technology 137(1-3) (2003) 96–99.
    [23] J .H. Roh, J. J. Seo, S. T. Hong, M. J. Kim, H. N. Han and J. T. Roth, The mechanical behavior of 5052-H32 aluminum alloys under a pulsed electric current, International Journal of Plasticity 58 (2014) 84-99.
    [24] W. Kim, K. H. Yeom, N. T. Thien, S. T. Hong, B. K. Min, S. I. Oh, M. J. Kim, H. N. Han and H. W. Lee, Electrically assisted blanking using the electroplasticity of ultra-high strength metal alloys, CIRP Annals -Manufacturing Technology 63(1) (2014) 273-276.
    [25] R.F. Zhu, G.Y. Tang, S.Q. Shi and M.W. Fu, Effect of electroplastic rolling on the ductility and superelasticity of TiNi shape memory alloy, Materials and Design 44 (2013) 606-611.
    [26] L. K. Berg, J. Gjønnes, V. Hansen, X. Z. Li, M. Knutson-Wedel, G. Waterloo, D. Schryvers and L. R. Wallenberg, GP-zones in Al–Zn–Mg alloys and their role in artificial aging, Acta Materialia 49(17) (2001) 3443-3451.
    [27] S. C. Jacumasso, J. D. P. Martins and A. L. M. D. Carvalho, Analysis of precipitate density of an aluminium alloy by TEM and AFM. REM-International Engineering Journal 69 (2016) 451-457.
    [28] R. Goswami, S. Lynch, N. J. H. Holroyd, S. P. Knight and R. L. Holtz, Evolution of grain boundary precipitates in Al 7075 upon aging and correlation with stress corrosion cracking behavior, Metallurgical and Materials Transactions A 44 (2013) 1268-1278.
    [29] H.V. Atkinson, K. Burke and G. Vaneetveld, Recrystallisation in the semi-solid state in 7075 aluminium alloy, Materials Science and Engineering A 490 (2008) 266-276.
    [30] F Viana, A.M.P Pinto, H.M.C Santos and A.B Lopes, Retrogression and re-ageing of 7075 aluminium alloy: microstructural characterization, Journal of Materials Processing Technology 92-93 (1999) 54-59.
    [31] Z. M. Liang , G. Y. Wang , Z. B. Sun , D. L. Wang , L. W. Wang and Y. M. Liang, Rapidly improved tensile strength of 6N01 Al alloy FSW joints by electropulsing and artificial aging treatment, Materials Science & Engineering A 841 (2022) 143056.
    [32] Y. Cao, L. He, Y. Zhou, P. Wang and J. Cui, Contributions to yield strength in an ultrafine grained 1050 aluminum alloy after DC current annealing, Materials Science & Engineering A 674 (2016) 193-202.
    [33] X. Xu, Y. Zhao, B. Ma and M. Zhang, Electropulsing induced evolution of grain-boundary precipitates without loss of strength in the 7075 Al alloy, Materials Characterization 105 (2015) 90-94.
    [34] P. Konopik, P. Farahnak, M. Rund, R. Prochazka and J. Dzugan, Application of micro-tensile test for material characterization of mild steel DC01, Ubiquity Proceeding 1(S1) (2018) 33.
    [35] J. E. Ayers, The measurement of threading dislocation densities in semiconductor crystals by X-ray diffraction, Journal of Crystal Growth 135 (1994) 71-77.
    [36] M. S. Baek, K. Euh and K. A. Lee, Microstructure, tensile and fatigue properties of high strength Al 7075 alloy manufactured via twin-roll strip casting, Journal of Materials Research and Technology 9(5) (2020) 9941-9950.
    [37] B. L. Adams and J. Kacher, EBSD-based microscopy: resolution of dislocation density, Computers, Materials, & Continua 14(3) (2010) 185-196.
    [38] M. Klinger, More features, more tools, more CrysTBox, Journal of Applied Crystallography 50(4) (2017) 1226-1234.
    [39] S. Bals, R. Kilaas, C. Kisielowski, Nonlinear imaging using annular dark field TEM, Ultramicroscopy 104(3-4) (2005) 281-289.
    [40] ASM International Handbook Committee, ASM Handbook Volume 2: Properties and selection: nonferrous alloys and special-purpose materials, ASM international (1990) 51, 65, 115.
    [41] T. B. Britton and J. L. R. Hickey, Understanding deformation with high angular resolution electron backscatter diffraction (HR-EBSD), IOP Conference Series: Materials Science and Engineering 304 (2018) 012003.
    [42] L. Ding, L. Zhao, Y. Weng, D. Schryvers, Q. Liu and H. Idrissi, Atomic-scale investigation of the heterogeneous precipitation in the E (Al18Mg3Cr2) dispersoid of 7075 aluminum alloy, Journal of Alloys and Compounds 851 (2021) 156890.
    [43] K. Ma, H. Wen, T. Hua, T. D. Topping, D. Isheim, D. N. Seidman, E. J. Lavernia, J. M. Schoenung, Mechanical behavior and strengthening mechanisms in ultrafine grain precipitation-strengthened aluminum alloy, Acta Materialia 62 (2014) 141-155.
    [44] U. F. Kocks, Polyslip in single crystals, Acta Metallurgica 8 (1960) 345-352.
    [45] J. A. Benito, J. Jorba, J. M. Manero and A. Roca, Change of Young’s modulus of cold-deformed pure iron in a tensile test, Metallurgical and Materials Transactions A 36 (2005) 3317-3324.
    [46] A. Villuendas, A. Roca and J. Jorba, Change of Young’s modulus of cold-deformed Aluminum AA 1050 and of AA 2024 (T65): a comparative study. Materials Science Forum 539-543 (2007) 293-298.

    下載圖示
    2026-08-01公開
    QR CODE