在封裝測試廠的測試工作中，錫球陣列載具扮演了負載板與積體電路間的橋樑，其藉由彈簧針以傳輸訊號，並經由測試機台來判定積體電路的可用與否。然而，隨著使用時間的拉長，此載具會有表現上的衰退或誤差。因此，需要一種建立電路模型的程序，來對不同使用期間的錫球陣列載具建模，以判斷在哪些情況下，需要將載具及彈簧針予以更換。
本論文之目的在於建立一個錫球陣列載具的電路模型，並以之來預測此錫球陣列載具在時域上的表現。研究中先使用時域反射量測儀量到模型的初始值，再輔以向量網路分析儀的量測數據，利用高速電路模擬軟體來做曲線近似，以得到最終的電路元件值。過程中使用自製的校正套件與測試介面板，並藉由測試金屬板來模擬當實際使用時，積體電路內部可能的開路、短路、穿透等情況。

A BGA socket acts as an interface between the load board and the integrated circuit during the testing. The socket propagates signals through pogo pins, then the testing machine judges if the IC works or not. However, the performance of sockets decay with time. A process of socket modeling is needed to create a BGA socket model and, based on the model, to determine in what kind of conditions should the sockets or pogo pins must be replaced.
In this thesis, a BGA socket model is derived and used to predict the time domain performance. Time Domain Reflectometry (TDR) are applied to get the initial values of the model, then they are fine tuned to fit the measured results from the network analyzer, by using a high-frequency circuit simulator. Calibration kits and test-fixture have been made to simulate the conditions of open, short and through for real integrated circuits during the modeling process.

[1] R. Knudsen, “Good Contact Design Improves Test Performance in BGA/CSP
Applications”, ChipScale review, May 1998.
http://www.chipscalereview.com/issues/0598/knudsen1.htm

[2] H.W. Johnson and M. Graham, “High-Speed Digital Design: a Handbook of Black
Magic”, PTR Prentice Hall, pp. 1-9, 1993.

[3] “TDA Primer”, TDA System Application Note, 2002.

[4] “TDR Techniques for Characterization and Modeling of Electronic Packaging”, TDA
System Application Note, 2001.

[5] S.A. Wartenberg, “RF Measurements of Die and Packages”, Artech House, pp.17-21,
2002

[6] S.A. Wartenberg, “RF Measurements of Die and Packages”, Artech House, pp.35-37,
2002