由於電子元件的高功率密度及高溫操作等需求持續增長，對於傳輸速度或功率密度等功能更是重視，因此電子構裝工業對於內部互連技術相當重視，而耐高溫需求的焊錫材料或黏晶技術則是支援功率元件運作的關鍵材料及技術，另外為了適應當前電子組裝技術的無鉛化發展，無鉛焊料已經成為表面組裝技術中最重要的電子構裝技術，並且為了滿足微間隙、高密度、高精度、高可靠性的元件組裝技術要求，各大廠紛紛投入研發，在此趨勢下本論文將針對於高溫焊接新型導電技術進行探討。
本論文分為兩部分探討。
第一部分，近年來奈米金屬材料燒結技術在業界中也得到廣泛的運用，奈米化後整體的表面積大幅增加，進而可在燒結過程中，使奈米金屬在較低的反應溫度中進行燒結反應。金屬銀擁有優異的導電導熱性能，而奈米銀粒子能有效降低製程、接合溫度，但是此方法仍有價格高昂之主要問題，而金屬銅同樣也具有優異的導電導熱特性，但是銅仍然有容易氧化的問題，所以如何在使用奈米金屬燒結技術時使用能達到相同效果之材料但降低其使用成本，也成了未來的發展趨勢，本實驗秉持以上所匯聚之觀點，製造一種藉由奈米銀包覆於銅表面之核殼結構以降低銅金屬表面與空氣接觸，達到抗氧化且降低成本的要求。再來利用製備完成的銅銀核殼結構之粉末，依需求添加所需的溶劑，並且加入黏結劑、分散劑、增稠劑等等有機成分，改變其流變狀態及分散行為，使其適用於接著製程。
第二部分，高溫焊料在以目前市場上仍然佔有一定的市占率，儘管近年來以有不少研究開發無鉛焊料，但仍有導電性及導熱性不足之主要問題。綜上所述，本實驗將錫膏燒結後，於金屬錫表面置換大量金屬銅，使其覆蓋於金屬錫之表面，此方式對於提升錫膏的導電率及導熱率都有極大的幫助，且由於置換反應機制操作簡單、成本較低，符合市場需求。
本論文綜合上述所提及之兩種不同實驗方法，期望達到業界以現有機台增加些許步驟或是降低其購買新材料之成本，能夠有效符合量產效益。本研究使用四點探針、掃描式電子顯微鏡、金相顯微鏡、推力測試機、X光繞射儀等儀器來交叉比對並解釋實驗結果。
透過實驗跟分析，在銅銀核殼結構研究中我們發現奈米銀低溫熔融特性確實幫助銅金屬顆粒間之熔接，形成連續導電面。本實驗結果制備出奈米銀包覆率達90%以上之銅銀核殼結構複合粉體，有效形成核殼結構，達到可低溫燒結的特性，並且應用於晶片接著技術上時擁有優異的導熱性能以及拉伸強度。
另外針對錫銅置換反應我們也瞭解粉體含量的選擇對於不同焊接材料有不同的要求，藉由針對不同反應時間之錫膏也瞭解到置換銅厚度之極限，置換時間拉得越長銅表面沉積得越完整。相較於業界使用之高溫焊料規格體積電阻率普遍要求小於1×10-6Ω·m，此實驗製備之銅電阻率遠低於其標準要求達到了1.3×10-7Ω·m，故可知將錫上置換銅的確能有效的提升其導電率。

The interconnect technology remains under high focus for packaging. The solder or the die-attach material has to withstand high temperatures generated during device functioning. For fitting the free-Pb requirement of the development of electronic products oriented to microstructure, thin type and high precision, the free- Pb solder paste has been one of the most significant and inevitable electronic accessories, which quality directly related to the quality of surface mount components.
We study on two parts. In the first part of this study, we would look into the sintering technique of nano-metal materials. Since the surface area increases dramatically as the material is in nanoscale, the nano-metal powder can be sintered at a lower temperature; therefore, there is a wide application of nano-metal materials in industry.
Silver (Ag) has an ideal electrical conductivity and an ideal thermal conductivity, and its nano-particle can decrease the process temperature effectively, but the main problem of this material is the expensive cost. Additionally, Copper (Cu) also has an ideal electrical conductivity and an ideal thermal conductivity, but it oxidizes easily. Therefore, a material that includes the ideal properties of electrical conductivity and thermal conductivity with low price is going to be a future trend. In this study, we prepare a material which has a core-shell structure that nano-Ag is covered on Cu powder to prevent the oxidation of Cu and achieve the low-cost.
The study of Lead-free (Pb-free) solder is in the second part of this study. Though there are lots of research in Pb-free solder, the problems in less electrical conductivity and thermal conductivity still need to be improved. Therefore, a replacement reaction of Tin (Sn) with Cu on the surface is introduced to our study. By this reaction, the electrical conductivity and thermal conductivity of the sintered Sn paste are extremely improved. Furthermore, the fabrication of replacement reaction is easy and low-cost, and is suitable for market demand.

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