由於可攜式電子產品的蓬勃發展，許多高規格與多功能之電子產品(例如:智慧型手機、平板電腦…等等)市場需求大增，針對此類電子產品，本論文提出一個擁有高效率、並將補償網路內置晶片的非反向升–降壓型直流-直流轉換器。有別於傳統之升–降壓功率級的切換，本論文採用升壓或降壓的切換，可降低導通損失與切換損失，以提高轉換效率；而在系統控制方面，採用遲滯電流的控制方法，讓本轉換器工作於輕載時自動降頻，以更進一步減少切換損失，而工作於重載時擁有類似脈波寬度調變控制之表現，得到較小之輸出漣波。除此之外，本論文使用電容倍乘器與內建電阻，將晶片外部之被動補償元件內建於晶片中。如此一來，此轉換器便可擁有更好的系統晶片整合，及低成本與高效率之特性。
本論文設計之晶片使用台灣積體電路公司0.35 μm 2P4M 5 V混合訊號製程，晶片大小約為4 mm2。當輸入電壓為2.5~5 V、輸出負載電流為10~400 mA時，輸出電壓均可穩定於3.3 V，並且最高效率可達到98%。

Due to the development of portable electronic devices, more and more high performance, battery-powered, and multifunctional devices (e.g., smartphone, tablet) are introduced to the market. For these devices, a high-efficiency buck-boost DC-DC converter with built-in compensation network is proposed in this thesis. This converter uses buck or boost mode (BOBM) control to reduce both switching and conduction losses, which is different from the traditional buck-boost conversion. By using hysteretic-current-mode (HCM), the light-load efficiency can be further improved due to reduced switching frequency. Moreover, the capacitor multiplier and on-chip resistors are used to replace traditionally off-chip compensation network. Therefore, the proposed converter has the advantages of low-cost and high efficiency, and is also good for system-on-chip (SoC) applications.
The chip was fabricated by using TSMC 0.35 μm 2P4M 5 V mixed-signal process, and the chip size is about 4 mm2. The input voltage range is 2.5–5 V, the output voltage is set to 3.3V, and the load current can range from 10 to 400 mA. The measured maximal efficiency is 98%.

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