| 研究生: |
許銘哲 Hsu, Ming-Che |
|---|---|
| 論文名稱: |
應用於K-band之低功耗高靈敏度介電材料檢測系統設計 Low Power and High Sensitivity Dielectric Material Detection System Design for K-band |
| 指導教授: |
楊慶隆
Yang, Chin-Lung |
| 學位類別: |
碩士 Master |
| 系所名稱: |
電機資訊學院 - 電機工程學系 Department of Electrical Engineering |
| 論文出版年: | 2024 |
| 畢業學年度: | 112 |
| 語文別: | 中文 |
| 論文頁數: | 115 |
| 中文關鍵詞: | K-band 、互補式開口環形共振器 、介電材料檢測 、低功耗 、高靈敏度 |
| 外文關鍵詞: | complementary split ring resonator, dielectric material detection, high sensitivity, K-band, low power consumption |
| 相關次數: | 點閱:65 下載:0 |
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本研究提出了一低功耗、高靈敏度的微波介電材料感測系統,針對系統和感測器進行了優化,最終將其整合成一介電材料量測系統。在系統優化方面,我們設計了一低功耗的壓控振盪器,透過在考畢子架構壓控振盪器中電晶體交叉耦合對的源極端增加了負實部和正虛部的負載,利用這種負載特性和電晶體的寄生電容之負載特性,使壓控振盪器轉導值的轉移函數的分母趨近於零,以提升整體電路之轉導值。同時,我們採用考畢子架構提升壓控振盪器的輸出擺幅,減少了熱雜訊對相位雜訊的影響,在減低電路功耗的同時,保持了一定的訊號穩定性,整體電路消耗功率經計算為1.4 mW。
在感測器優化方面,我們透過多個互補式環形共振腔的相互耦合,並考慮待測物放置時對每個共振腔之間內部耦合的影響,將各個共振腔之間的內部耦合設計為弱耦合之形式以提升感測器之靈敏度。同時,透過結合基板整合波導的傳輸結構,改變原先微帶線傳輸結構之傳輸模態,以提升傳輸線與感測器之間的外部耦合,使電場能更集中於感測器內部,進一步提高感測器的靈敏度,該感測器結構相較於其餘同頻帶結構,在介電係數為1至10的介電材料中靈敏度約提升88.1 %。
在系統整合方面,透過結合前述兩子電路,實現了一同時具有低功耗與高靈敏度之感測系統,並通過與網路分析儀的量測結果進行比對,證明了系統整合的可行性。
This paper proposes a low-power, high-sensitivity microwave dielectric material sensing system. In terms of system optimization, a low-power voltage-controlled oscillator (VCO) is designed. The VCO utilizes transistor cross-coupling pairs in a Colpitts architecture, with negative real and positive imaginary load additions at the source terminal. This exploit of load characteristics, coupled with parasitic capacitance of the transistor, drives the transfer function's denominator toward zero, enhancing the overall transconductance. Simultaneously, a Colpitts architecture is employed to boost the VCO's output swing, minimizing the impact of thermal noise on phase noise. This not only reduces power consumption but also maintains a certain level of signal stability, with a calculated overall circuit power consumption of 1.4 mW. In sensor optimization, multiple complementary split-ring resonators (CSRRs) are employed. The internal coupling between the resonators is intentionally weakened to enhance sensor sensitivity. Additionally, by integrating a substrate-integrated waveguide (SIW) transmission structure with the sensor structure, improving the external coupling between sensor and transmission line. Compared to other structures in the same frequency band, the sensitivity of this sensor structure is increased by approximately 88.1% for dielectric materials with a permittivity ranging from 1 to 10.
Concerning system integration, the combination of the aforementioned two sub-circuits realizes a sensing system with simultaneous low power consumption and high sensitivity. A comparison with measurements from a network analyzer demonstrates the feasibility of system integration.
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