本研究將奈米級氮化硼均勻分散於Photosensitive Polybenzoxazole (PSPBO)前驅物中，製備出熱導型正型鹼性水溶液顯影的耐高溫感光性材料。製備方法是利用2,2-bis(3-amino-4-hydroxyphenol)hexafiouoropropane（BisAPAF) 作為二胺單體，isophthaloyl chloride (IC)和4,4’-oxydibenzoyl chloride (ODC) 作為二醯氯單體進行低溫共聚反應，形成聚苯噁唑(Polybenzoxazole ; PBO) 之前驅物-聚羥醯胺 (PHA)，再使用 1,2-naphthoquinonediazide-5-sulfonyl chloride (DNQ-5)對聚羥醯胺進行改質，合成出感光性聚羥醯胺，再添加感光材料PAC-TPA520作為溶解抑制劑，並混摻奈米氮化硼於其中，最後以350oC高溫閉環即可製備出熱導型正型感光性聚苯噁唑/氮化硼奈米複合材料。
此外使用3-mercaptopropionic acid (MPA)作為改質劑對氮化硼奈米粒子進行表面改質，增加奈米氮化硼在聚苯噁唑基材中的分散性。結果顯示隨著氮化硼添加量的增加熱傳導係逐漸上升，當添加量增加到30 wt%時，聚苯噁唑/氮化硼奈米複合材料的熱傳導係數可增加至0.72 Wm-1K-1，微影成像圖案轉移的解析度可達30 μm。此外聚苯噁唑/氮化硼奈米複合材料之玻璃轉移溫度為325oC，熱裂解溫度為501oC，顯示具有良好的耐熱性。

A thermally conductive photoresist based on a dispersion of nano-sized hexagonal boron nitride (h-BN) in a positive-tone photosensitive poly(benzoxazole) (PSPBO) precursor was developed in this work. 3-Mercaptopropionic acid (MPA) was used as the surfactant to modify the h-BN surface in order to improve the dispersion of h-BN in the polymer. The PSPBO/BN nanocomposites exhibited different thermal conductivities in the h-BN content. The thermal conductivity of the PSPBO/BN nanocomposite was as high as 0.71 W/m-K for a mixture containing 30 wt% of modified BN fillers in the poly(benzoxazole) matrix. The PSPBO/BN30 resist exhibited a sensitivity of 878 mJ/cm2 and a contrast of 1.56. The patterns were obtained after curing at 350 oC with a resolution of 30 μm. The PSPBO/BN nanocomposites also showed excellent thermal properties. When the loading level of modified BN reached 30 wt%, the 5% weight loss temperature was 501 oC, and the glass transition temperature was 325 oC.

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