| 研究生: |
張詠翔 Chang, Yung-Hsiang |
|---|---|
| 論文名稱: |
二氧化鈦/砷化鎵薄膜退火前後之奈米壓痕行為及微觀結構變化之研究 Nanoindentation Behaviour and Microstructure of TiO2/GaAs Thin Film with and without Annealing |
| 指導教授: |
李偉賢
Lee, Woei-Shyan |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 機械工程學系 Department of Mechanical Engineering |
| 論文出版年: | 2019 |
| 畢業學年度: | 107 |
| 語文別: | 中文 |
| 論文頁數: | 69 |
| 中文關鍵詞: | 二氧化鈦 、砷化鎵 、退火 、奈米壓痕 、裂痕 |
| 外文關鍵詞: | Nanoindentation, GaAs, Microstructural, evolution, Annealing, Thin films |
| 相關次數: | 點閱:92 下載:5 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本研究主要探討二氧化鈦/砷化鎵薄膜系統奈米壓痕行為,以及退火
前後機械性質、表面形貌和微觀結構之變化。首先利用共濺鍍機於砷化
鎵基板上沈積200nm 及300nm 之二氧化鈦薄膜,分別對薄膜厚度200nm
試片進行150nm 和250nm 深度之壓痕試驗,以及薄膜厚度300nm 試片進行250nm 和350nm 深度之壓痕試驗,以了解壓痕深度與膜厚對機械性質及為結構之影響。此外也對另一組試片進行300℃持溫3 小時之加熱,同樣進行上述之量測,以比較退火前後機械性質與微觀結構之差異。實驗結果顯示,退火後之負載-深度曲線有pop-in 之現象,經退火後硬度及楊氏模數皆上升,與一般材料退火處理後,硬度與彈性模數之降低有所不同。利用TEM 照射薄膜的結構,發現經退火製程,薄膜從非晶系轉變結晶系,造成機械性質上升之結果。觀察試片表面形貌及剖面微觀結構可發現,退火後硬度及脆性提升,壓痕表面產生裂痕,而剖面結構則觀察到產生分離之現象,這是薄膜硬度遠高於基板硬度所造成之
buckling現象。
The mechanical properties of TiO2/GaAs thin films with and without annealing indented at room temperatures of different depth were measured by using a nanoindentation technique. The specimens were annealed at the temperature 300℃ for 3 hours. The result show that the pop-in effect appeared at the load-depth curve randomly for the annealed specimen indented at room temperature. The delamination of the thin film from the substrate were also observed. After annealing,the load-depth curve become not smooth and both the hardness and Young’s modulus were found to increase. Furthermore,dislocations density increased significantly as the indentation depth is increased. The changes in microstructure and mechanical properties were also discussed in terms of annealing, indentation depth and thickness of the thin film
[1] J. G. Swadener, E. P. Georgea, and G. M. Pharra, "The correlation of the indentation size effect measured with indenters of various shapes," Journal of the Mechanics and Physics of Solids, vol. 50, pp. 681-694, 2002.
[2] G. M. Pharr, "Measurement of mechanical properties by ultra-low load indentation," Materials Science and Engineering, vol. A253, pp. 151-159, 1998.
[3] M. Sakai, N. Hakiri, and T. Miyajima, "Instrumented indentation microscope: A powerful tool for the mechanical characterization in microscales," Journal of materials research, vol. 21, no. 9, pp. 2298-2303, 2006.
[4] S. Rajagopalan and R. Vaidyanathan, "Nano-and microscale mechanical characterization using instrumented indentation," JOM, vol. 54, no. 9, pp. 45-48, 2002.
[5] T. P. Rao and M. Santhoshkumar, "Effect of thickness on structural, optical and electrical properties of nanostructured ZnO thin films by spray pyrolysis," Applied Surface Science, vol. 255, no. 8, pp. 4579-4584, 2009.
[6] T. P. Rao and M. Santhoshkumar, "Effect of thickness on structural, optical and electrical properties of nanostructured ZnO and operation temperature on ZnO: Al thin film CO gas sensor," Sensors and actuators B: Chemical, vol. 84, no. 2-3, pp. 258-264, 2002.
[7] H. Kim et al., "Effect of film thickness on the properties of indium tin oxide thin films," Journal of Applied Physics, vol. 88, no. 10, pp. 6021-6025, 2000.
[8] C.-Y. Yen et al., "Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films," Applied Surface Science, vol. 257, no. 17, pp. 7900-7905, 2011.
[9] O. Lupan et al., "Effects of annealing on properties of ZnO thin films prepared by electrochemical deposition in chloride medium, " Applied Surface Science, vol. 256, no. 6, pp. 1895-1907, 2010.
[10] S.-K. Wang, T.-C. Lin, S.-R. Jian, J.-Y. Juang, J. S.-C. Jang, and J.-Y. Tseng, "Effects of post-annealing on the structural and nanomechanical properties of Ga-doped ZnO thin films deposited on glass substrate by rf-magnetron sputtering, " Applied Surface Science, vol. 258, no. 3, pp. 1261-1266, 2011.
[11] Houman Yaghoubi,Nima Taghavinia, Eskandar Keshavarz Alamdari, "Self cleaning TiO2 coating on polycarbonate:Surface treatment, photocatalytic and nanomechanical properties, "Surface & Coatings Technology, vol.204, no9-10, pp1562-1568, 2010
[12] Kaihong Qi, John H.Xin, andWalid A.Daoud, "Function Polyester Fiber with a Self-Cleaning Property Using Anatase TiO2 and Low-Temperature Plasma Treatment,"Cream Technology, vol4, no.6, pp554-563, 2007
[13]蕭達慶, "高頻通訊用半導體基板材料發展現況,"工業材料雜誌, vol.381
[14] B. L and B. Roberto, "The scaling challenges of CMOS and the impact on high-density non-volatile memories, " Microsystem Technologies, vol. 13, pp. 133-138, 2006.
[15]R. Ludeke and G. Landgren, "Electronic properties and chemistry of Ti/GaAs and Pd/GaAs interfaces," Physical Review B, vol. 33, no. 8, pp. 5526-5535, 1986.
[16] S. Ashok and J. M. Borrego, "Electrical characteristics of GaAs MIS Schottky diodes, " Solid-State Electronics, vol. 22, pp. 621-631, 1979.
[17] T. Nakamura, "Mars Rover power system for solar and laser beam Utilization, " Concepts and Approaches for Mars Exploration, 2012.
[18] Kayano Sunada, Yoshihiko Kikuchi, Kazuhito Hashimoto,and Akira Fujishima, "Bactericidal and Detoxification Effects of TiO2 Thin Film Photocatalysts, "Environmental science &Technology, vol.32, no.5, pp726-728, 1998
[19] C. Anthony and C. Fischer, "Nanoindentation, " 2nd ed. Springer, N. Y., 2004.
[20] S. Timoshenko and J. N. Goodier, "Theory of Elasticity," 2nd ed. McGraw-Hill, N. Y., 1951.
[21] G. M. Pharr, W. C. Oliver, and F. R. Brotzen, "On the generality of the relationship among contact stiffness, contact area, and elastic modulus during indentation," Journal of Materials Research, vol. 7 No.3, 1992.
[22]M. Martin and M. Troyon," Fundamental relations used in nanoindentation: Critical examination based on experimental measurements, " Journal of Materials Research, vol.17 ,no.9, pp. 2227-2234, 2002.
[23] W. C. Oliver and G. M. Pharr, "An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, " Journal of Materials Research, vol. 7, no. 6, pp. 1564-1583, 1992.
[24] R.B.King, " Elastic analysis of some punch problems for a layered medium, " International Journal of Solids and Structures, vol 23, no. 12, pp1657-1664, 1987.
[25] M. Qasmi, P. Delobelle, F. Richard, and A. Bosseboeuf, "Effect of the residual stress on the determination through nanoindentation technique of the Young's modulus of W thin film deposit on SiO2/Si substrate," Surface and Coatings Technology, vol. 200, no. 14-15, pp. 4185-4194, 2006.
[26] I. Manika and J. Maniks, "Size effects in micro- and nanoscale indentation," Acta Materialia, vol. 54, no. 8, pp. 2049-2056, 2006.
[27] K.-D. Bouzakis, N. Michailidis, S. Hadjiyiannis, G. Skordaris, and G. Erkens, "The effect of specimen roughness and indenter tip geometry on the determination accuracy of thin hard coatings stress–strain laws by nanoindentation, " Materials characterization, vol. 49, no. 2, pp. 149-156, 2002.
[28] M. Bobji and S. Biswas, "Deconvolution of hardness from data obtained from nanoindentation of rough surfaces, " Journal of materials research, vol. 14, no. 6, pp. 2259-2268, 1999.
[29] A. Bolshakov and G. Pharr, "Influences of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques, " Journal of materials research, vol. 13, no. 4, pp. 1049-1058, 1998.
[30] K. MIYAKE, S. FUJISAWA, and A. KORENAGA, "The Effect of Pile-Up and Contact Area on Hardness Test by Nanoindentation," Japanese Journal of Applied Physics, vol. 43, no. 4602-4605, 2004.
[31] R. Saha and W. D. Nix, "Effects of the substrate on the determination of thin film mechanical properties by nanoindentation, "Acta materialia, vol. 50, no. 1, pp. 23-38, 2002.
[32] D. Kramer, A. Volinsky, N. Moody, and W. Gerberich, "Substrate effects on indentation plastic zone development in thin soft films, " Journal of Materials Research, vol. 16, no. 11, pp. 3150-3157, 2001.
[33] B. Bokhonov and M. Korchagin, "In situ investigation of stage of the formation of eutectic alloys in Si–Au," Journal of Alloys and Compounds, vol. 312, pp. 238-250, 2000.
[34] Y.-L. Chuang, "Effect of annealing temperature on nanoindented microstructure of CuSi thin films," 2009.
[35] X. Li and B. Bhushan, "A review of nanoindentation continuous stiffness measurement technique and its applications," Materials characterization, vol. 48, no. 1, pp. 11-36, 2002.
[36] K. Wasmer, R. Gassilloud, J. Michler, and C. Ballif, "Analysis of onset of dislocation nucleation during nanoindentation and nanoscratching of InP, " Journal of Materials Research, vol. 27, no. 01, pp. 320-329, 2011.
[37] S J Bull," Nanoindentation of coatings, "Applied Physics, vol.38, no.24, pp.394-395, 2005.
[38] T.OhsakaS,YamaokaO,Shimomura, " Effect of hydrostatic pressure on the Raman spectrum of anatase (TiO2), " Solid State Communications, Vol. 30, pp. 345-347
[39] K. Durst, B. Backes, and M. Göken, "Indentation size effect in metallic materials: Correcting for the size of the plastic zone, " Scripta Materialia, vol. 52, no. 11, pp. 1093-1097, 2005.
[40] Y. Cao, S. Allameh, D. Nankivil, S. Sethiaraj, T. Otiti, and W. Soboyejo, "Nanoindentation measurements of the mechanical properties of polycrystalline Au and Ag thin films on silicon substrates: Effects of grain size and film thickness, "Materials Science and Engineering: A, vol. 427, no. 1-2, pp. 232-240, 2006.
[41] Gaillard, Yves; Rico, Victor J.; Jimenez-Pique, Emilio; González-Elipe, Agustín R,"Nanoindentation of TiO2 thin films with different microstructures," Applied Physics, vol. 42, pp.2-4, no.14,2009.