本研究旨在探討電子封裝元件在侷限流道（方形風箱）與開放空間下之熱傳特性，透過實驗量測與物理路徑解耦程序，建立一套具備高精確度之熱傳預測模型。研究針對發熱元件（DB157S）於不同量測距離（8cm至45 cm）與局部風速（1.6m/s至6.0m/s）環境下之穩態溫度響應進行系統性觀測，並深度對照「有風箱（侷限流道）」與「無風箱（開放空間）」之冷卻效益差異。實驗結果顯示，在微型低功耗系統中，非對流路徑之寄生熱損失（含固體傳導與熱輻射）高達總輸入功耗之76.3%，透過本研究建立之基準熱損失模型，能精確解耦出純對流換熱量 。流場量測證實，侷限流道能顯著維持氣流動能，相較於開放空間，其局部風速增益比最高可達1.79倍 ，並在全量測距離內提供5.1°C至 6.0°C之穩定降溫效益。此外，研究發現風扇輪轂產生之「尾流區」低速特徵在受限流道中具持續性，揭示了佈局設計應避開輪轂遮蔽區之關鍵策略。最後，本研究整合多維度實測數據，建構出修正後熱傳係數對局部風速之二階多項式預測模型。該模型在有風箱配置之主流強制對流操作區間（≧3.5m/s）內表現優異，且動態驗證誤差率嚴格控制在4%以內。本研究所建立之數學框架成功將複雜之三維熱流規律轉化為簡潔的工程評估工具，協助製程與熱管理工程師在產品開發初期快速評估散熱佈局極限，具備極高之工業實務指導價值。

This study investigates the heat transfer characteristics of electronic packaging components operating under confined air channels and open space environments. Through rigorous experimental measurements and an empirical heat path decoupling procedure, a highly accurate heat transfer predictive model was established. The research systematically observes the steady-state thermal responses of a heating electronic component (DB157S) across various measurement distances (ranging from 8 cm to 45 cm) and local wind speeds (from 1.6 m/s to 6.0 m/s). A comprehensive comparative analysis was conducted to evaluate the cooling efficiency differences between the "with air duct" (confined channel) and "without air duct" (open space) configurations. Flow field measurements demonstrate that the confined channel significantly preserves the kinetic energy of the airflow. Compared to the open space environment, the air duct configuration achieves a local wind speed enhancement ratio of up to 1.79, providing a stable temperature reduction ranging from 5.1°C to 6.0°C across the entire measurement distance. Concurrently, flow topology analysis reveals that the low-velocity zone locked directly behind the fan hub exhibits a resilient "wake region" behavior. Under the boundary confinement of the air duct, this localized topology remains highly sustained downstream rather than being sheared and diluted by the ambient fluid, offering a critical layout strategy that high-power components should actively bypass the hub shading zone. Finally, this study successfully constructs a second-order polynomial predictive model for the heat transfer coefficient, yielding exceptional fitting accuracy and highly reliable behaviors under the air duct configuration, with validation errors consistently controlled within 4%.

1.Angirasa, Z. (2001), “Experimental investigation of forced convection heat transfer from a surface mounted block,” International Journal of Heat and Mass Transfer, Vol. 45, pp. 919–922
2.Rebay, M., et al. (2006), “Measurement of the heat transfer coefficient on a motherboard using Pulsed Photothermal Radiometry”
3.Advanced Thermal Solutions (2008), “How Air Velocity Affects Heat Sink Performance,” ATS Technical White Paper
4.杜鳳棋 (2008)，“探討電腦中央處理器的散熱問題”，產學合作成果專刊
5.Kimber, Mark L., and Garimella, Suresh V. (2009), “Measurement and Prediction of the Cooling Characteristics of a Generalized Vibrating Piezoelectric Fan,” Journal of Heat Transfer, Vol. 129, No. 9, pp. 1168–1176
6.李弘毅 (2011)，“壓電風扇冷卻平板型散熱片之熱流特性研究(II)”，行政院國家科學委員會專題研究計畫成果報告 (NSC 99-2221-E-211-002-)
7.梁谷帆 (2012)，“數值模擬探討矩形流道裝置水平擺放單雙壓電風扇對平板型散熱器熱流特性影響”，國立台北科技大學車輛工程學系碩士論文
8.鄭進全 (2013)，“三維渠道內部電子元件之對流散熱研究”，遠東科技大學機械工程系碩士論文
9.黃冠璋 (2017)，“空氣微噴流散熱模組之研究”，國立交通大學機械工程研究所碩士論文
10.Christen, D., Stojadinovic, M., and Biela, J. (2017), “Energy-Efficient Heat Sink Design: Natural Versus Forced Convection Cooling,” IEEE Transactions on Power Electronics, Vol. 32, No. 11, pp. 8692–8704
11.張凱復 (2018)，“單鰭鰭片下的熱對流係數分析”，國立成功大學工程科學研究所碩士論文
12.Moreira, A. L. N., Tibiriçá, C. B., et al. (2019), “Heat transfer coefficient: a review of measurement techniques,” Journal of the Brazilian Society of Mechanical Sciences and Engineering
13.Estevadeordal, J., Gogineni, S., Crain, W., and Kimmel, S. (2000), “Flow field in a low-speed axial fan: a DPIV investigation,” Experimental Thermal and Fluid Science, Vol. 23, pp. 11–21
14.Lin, S.-C., and Chou, C.-A. (2004), “Blockage effect of axial-flow fans applied on heat sink assembly,” Applied Thermal Engineering, Vol. 24, pp. 2375–2389
15.Yoon, J. H., and Lee, S. J. (2004), “Stereoscopic PIV measurements of flow behind an isolated low-speed axial-fan,” Experimental Thermal and Fluid Science, Vol. 28, pp. 791–802
16.Yen, S. C., and Lin, Frank K. T. (2006), “Exit Flow Field and Performance of Axial Flow Fans,” ASME Journal of Fluids Engineering, Vol. 128, No. 2, pp. 332–339
17.Quin, D., Grimes, R., and Davies, M. (2008), “The effect of Reynolds number on microaxial flow fan performance,” ASME Journal of Fluids Engineering, Vol. 130, Article ID: 101101
18.Stafford, J., Walsh, E., and Davies, M. (2010), “Flat plate heat transfer with impinging axial fan flows,” International Journal of Heat and Mass Transfer, Vol. 45
19.Stafford, J., Walsh, E., and Newport, D. (2010), “Local heat transfer performance and exit flow characteristics of a miniature axial fan,” International Journal of Heat and Fluid Flow, Vol. 31, pp. 952–960
20.ROHM Co., Ltd. "Thermal Design," ROHM Tech Web. [Online]. Available: https://techweb.rohm.com.tw/product/circuit-design/thermal-design/9421/. [Accessed: Jul. 2, 2026].
21.Semtech Electronics, "Single Phase Silicon Bridge Rectifier DB151S-DB157S," DB157S Datasheet, 2007. [Online]. Available: https://www.alldatasheet.com/datasheet-pdf/pdf/280615/SEMTECH_ELEC/DB157S.html. [Accessed: Jul. 2, 2026].