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研究生: 沈昱翔
Shen, Yu-Hsiang
論文名稱: 高頻通訊之氮化鋁薄膜體聲波諧振器及濾波器的研製與分析
Fabrication and Analysis of AlN Thin Film Bulk Acoustic Wave Resonators and Filters for High-Frequency Communication
指導教授: 李炳鈞
Li, Bing-Jing
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2016
畢業學年度: 104
語文別: 中文
論文頁數: 108
中文關鍵詞: AlN壓電薄膜FBARFBAR濾波器MBVD模型反應式射頻磁控濺鍍
外文關鍵詞: AlN piezoelectric thin film, FBAR, FBAR filter, MBVD model, RF magnetron reactive sputter
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  • 本論文主要研製與分析薄膜體聲波諧振器(thin film bulk acoustic wave resonator, FBAR)及濾波器,分別採用背向蝕刻結構的FBAR元件、階梯式FBAR濾波器,而FBAR的結構為在矽基板上沉積下電極鉑、壓電層氮化鋁、上電極鋁。本研究以反應式射頻磁控濺鍍沉積C軸優選取向的氮化鋁薄膜,以激發縱向聲波、產生壓電效應,最終具備的諧振頻率可以達到濾波的效果。實驗結果探討濺鍍中製程參數對氮化鋁薄膜特性的影響,並透過微結構分析,發現氮氬氣體流量比為7:3 (sccm)、濺鍍功率為300W、工作壓力為 5×10^-3Torr、基板溫度為225℃時,沉積出具有最佳C軸優選取向的氮化鋁薄膜,並作為FBAR元件及濾波器的壓電薄膜。在FBAR製作流程中,發生上電極Al斷裂、蝕刻遮罩無法抵擋ICP蝕刻、光阻殘留等問題,經由檢討實驗的缺失,分別提出增加上電極厚度或使用準直管、使用光阻或金屬薄膜作為蝕刻遮罩、利用RIE乾式蝕刻將氧分子解離以去除光阻等方法,有效地改善製程上遇到的問題,並提高製作良率。最後透過頻率響應分析,探討FBAR元件及濾波器的微波特性,並藉由ADS模擬軟體萃取MBVD等效電路的元件數值。本研究製作出工作頻率為5.170GHz的FBAR元件及5.153GHz的FBAR濾波器,達成中心頻率為5GHz的目標,但其穿透損耗太大,將會是未來改善的目標。

    In this thesis, we fabricated and analyzed thin film bulk acoustic resonators (FBARs) and filters. The FBAR consists of a piezoelectric AlN thin film sandwiched between a top electrode of Al and a bottom electrode of Pt. The FABR is connected with input and output ports of GSG transmission lines. The FBAR is made on the surface of SiNx / Si which is attached to an etched cavity in the back of the Si substrate. The piezoelectric layer was formed by using RF magnetron reactive sputter. There were four process parameters to control the crystal structure of the thin film. Thin film with small FWHM and vertical C-axis is preferable. The analysis of XRD, SEM and AFM showed that the parameters of nitrogen and argon gas flow rate of 7:3 (sccm), sputtering power of 300W, operating pressure of 5×10^-3Torr and substrate temperature of 225℃ could produce the best quality of thin film. FBAR elements of 22500μm^2 of area and 0.8 μm of AlN thickness were fabricated and the measured S-paramers indicated the resonant frequency was 5.170GHz, the anti-resonant frequency was 5.190GHz, effective electromechanical coupling coefficient was 0.951% and quality factor was 706.890. The MBVD model was analyzed by using the ADS software and well-fitted values of circuit elements were obtained. A T-type FBAR bandpass filter was successfully fabricated and demonstrated. The measured S-parameters implied the center frequency was 5.153GHz, the bandwidth was 20MHz and the insertion loss was -13.121dB.

    摘要 I Extended Abstract II 誌謝 X 目錄 XI 表目錄 XV 圖目錄 XVII 第一章 緒論 1 第二章 相關理論與研究現況 4 2-1 聲波運動方程式與聲波阻抗 4 2-2 壓電材料 9 2-2-1 壓電效應 9 2-2-2 壓電方程式 11 2-2-3 氮化鋁壓電薄膜 18 2-3 薄膜體聲波諧振器 22 2-3-1 FBAR元件結構 23 2-3-2 FBAR元件工作原理 26 2-3-3 MBVD等效電路模型 27 2-3-4 FBAR元件研究現況 31 2-4 薄膜體聲波諧振濾波器 32 2-4-1 FBAR濾波器工作原理 34 2-4-2 頻率響應分析相關定義 36 2-4-3 FBAR濾波器研究現況 37 第三章 製程與分析原理 38 3-1 微影製程原理 38 3-1-1 蝕刻法 39 3-1-2 舉離法 39 3-2 薄膜製程原理 40 3-2-1 電漿輔助化學氣相沉積 41 3-2-2 電子束蒸鍍 43 3-2-3 反應式射頻磁控濺鍍 44 3-3 蝕刻製程原理 46 3-3-1 感應耦合式電漿蝕刻 47 3-4 材料微結構分析原理 48 3-4-1 X光繞射儀 48 3-4-2 掃描式電子顯微鏡 49 3-4-3 原子力顯微鏡 51 3-5 元件頻率響應分析原理 52 3-5-1 網路分析儀 52 第四章 研究方法與實驗規劃 55 4-1 光罩圖案設計 55 4-1-1 FBAR元件設計 56 4-1-2 FBAR濾波器設計 57 4-2 FBAR元件及濾波器製作 61 4-2-1 RCA清洗 61 4-2-2 PECVD沉積氮化矽 62 4-2-3 製作蝕刻遮罩 63 4-2-4 蒸鍍下電極Pt 64 4-2-5 切割晶圓及清洗試片 65 4-2-6 濺鍍壓電層AlN 65 4-2-7 濺鍍上電極Al 66 4-2-8 濺鍍負載上電極Al 68 4-2-9 ICP蝕刻空腔 68 4-3 量測分析與模擬 69 4-3-1 氮化鋁薄膜微結構分析 69 4-3-2 元件頻率響應分析 71 4-3-3 MBVD等效電路模型建立 71 4-4 實驗程序規劃 72 4-4-1 製程參數對氮化鋁薄膜特性的影響 72 4-4-2 FBAR元件及濾波器製作 73 4-4-3 頻率響應分析與MBVD等效電路模型建立 73 第五章 實驗結果與討論 74 5-1 製程參數對氮化鋁薄膜特性的影響 74 5-1-1 氮氬氣體流量與氮化鋁薄膜結晶品質的關係 75 5-1-2 濺鍍功率與氮化鋁薄膜結晶品質的關係 77 5-1-3 工作壓力與氮化鋁薄膜結晶品質的關係 79 5-1-4 基板溫度與氮化鋁薄膜結晶品質的關係 81 5-1-5 最佳C軸優選取向的氮化鋁薄膜 83 5-1-6 氮化鋁的沉積速率 90 5-2 FBAR元件及濾波器製作良率 91 5-2-1 上電極Al斷裂之改善 91 5-2-2 蝕刻遮罩無法抵擋ICP蝕刻之改善 91 5-2-3 光阻殘留之改善 92 5-3 頻率響應分析與MBVD等效電路模型建立 93 5-3-1 FBAR元件 93 5-3-2 FBAR濾波器 99 第六章 結論 104 參考文獻 106

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