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研究生: 顏嘉汶
Yen, Chia-Wen
論文名稱: 運用AHP法評選晶圓代工維修廠商之研究
A Study on Applying AHP Approach for Selecting Maintenance Vendor of the Semiconductor Foundry
指導教授: 陳澤生
Chen, Tse-Sheng
學位類別: 碩士
Master
系所名稱: 工學院 - 工程管理碩士在職專班
Engineering Management Graduate Program(on-the-job class)
論文出版年: 2012
畢業學年度: 100
語文別: 中文
論文頁數: 75
中文關鍵詞: 晶圓代工廠商評選準則層級程序分析法BCG矩陣市場佔有率
外文關鍵詞: Semiconductor foundry, Vendor evaluation criteria, AHP analysis, BCG matrix, Market sharing
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  • 歷經金融海嘯的衝擊之後,半導體產業迎面而來的是強勁的景氣成長,同時,很多消費性電子產品不斷地推陳出新。台灣的晶圓代工廠需要持續擴充先進製程的產能與積極採購新製程設備。因此,扶植本土半導體設備零組件維修商,以降低維修成本的支出就顯得非常重要,也是晶圓代工產業未來提升競爭優勢的利器。
    本研究藉由相關文獻的探討,諸如供應鏈管理、供應商關係管理、廠商評選準則,以及AHP分析法,由此探討出很多主要因素與評選準則,以便瞭解如何選擇一個優良且合作的維修廠商。特別是透過層級程序分析法AHP來決定各準則的權重,以獲最佳解決方案。因此,針對零組件維修商的稽核項目設定為評選準則的基準,考慮「使用者」、「設備整合部門」、「品管部門」,以及「採購部門」為四大準則構面,再分別將欲評選的項目列出13項次準則項目,以探討本個案研究。
    本研究以AHP分析法做為選擇最佳的維修供應商的分析工具。在評選過程中,整合組織裡眾多相關部門的意見與構想,同時,以BCG矩陣模式分析各家的市場成長率與相對市場佔有率,佐證AHP所提出的替代決策。本研究結果可提供決策者參考及有利於晶圓代工製造業者日後選擇維修商。

    After the great depression of the global financial crisis, the semiconductor industry has been faced to a strong and rapid production growth. Meanwhile, many consumable electronic products were innovated continuously during the period of the economic recovery. In Taiwan, the semiconductor foundries needed to expand their productive capacity persistently and to purchase new equipments for next generation process positively. Therefore, it would be very important to support the local maintenance vendors for reducing the repairing cost. Also, it would promote the competitive advantage for the semiconductor foundries in the future.
    The purpose of this study was firstly to review some related literatures including supply chain management, supplier relationship management, vendor evaluation criteria and the Analytic Hierarchy Process (AHP) model. Many important factors and evaluation criteria weights for selecting an excellent as well as collaborative maintenance vendor were studied. Especially, the AHP approach was used to determine the criteria weights to find the best solution. Thus, the evaluation criteria items were based on the audit checklist of the maintenance vendors, Four main divisions were considered to study such as: user division, equipment Integration division, quality control division, and purchasing division. Then, thirteen detailed items were defined as the objective criteria for their case study.
    We used the AHP approach as the analysis tool to evaluate and select a best maintenance vendor. During the selecting period, we integrated more opinions and ideas from many related divisions in the organization. Meanwhile, a BCG matrix model solution was also studied to verify market sharing to each vendor. The studied results will provide a specific reference for decision-makers and value the semiconductor foundry manufactures.

    摘要 i Abstract iii 誌謝 iv 目錄 v 表目錄 vii 圖目錄 x 中英文全名對照表 xi 第1章 緒論 1 1-1 研究動機 1 1-2 研究目的 2 1-3 研究範圍與限制 2 1-4 研究流程 3 第2章 文獻探討 5 2-1 供應鏈管理 5 2-1-1 供應鏈之定義 5 2-1-2 供應鏈之類型 7 2-1-3 供應鏈管理概論 8 2-2 供應商關係管理 11 2-2-1 企業與供應商之關係發展 11 2-2-2 供應商關係管理之效益 13 2-3 供應商之評選準則 15 2-3-1 供應商的重要性 15 2-3-2 供應商的評選準則 16 2-4 層級程序分析法 19 2-4-1 多準則決策的定義 19 2-4-2 多準則決策方法 20 2-4-3 AHP概論 23 2-4-4 AHP模式 26 2-4-5 AHP步驟與運算 28 2-5 BCG矩陣分析模型 31 第3章 個案產業與研究方法 34 3-1 晶圓代工產業 34 3-1-1 全球晶圓代工產業概述 34 3-1-2半導體機器設備之台灣市場分析 37 3-1-3 晶圓代工的未來趨勢 39 3-2 研究方法 40 3-2-1 評選準則架構 41 3-2-2 評選準則成對比較矩陣 45 3-2-3 BCG成長佔有率矩陣 48 第4章 研究分析與結果 49 4-1 依準則層之權重值分析 49 4-2 依次準則層之權重值分析 50 4-3 依替代方案層之權重值分析 52 4-4 依零組件供應商群分析 59 第5章 結論與建議 60 參考文獻 64 附錄 69

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