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研究生: 潘語珍
Pandi Divya
論文名稱: 用於在柔性基材上製造 RFID 和雷達應用天線的創新增材技術方法
An Innovative Novel Additive Technique Approaches for Fabricating RFID and Radar Applications Antenna on Flexible Substrates
指導教授: 李文熙
Lee, Wen-Hsi
學位類別: 博士
Doctor
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2024
畢業學年度: 112
語文別: 英文
論文頁數: 144
中文關鍵詞: 柔性基板新型添加劑技術化學置換或電化學置換铜沉積铝厚膜漿料 高频雷達應用RFID
外文關鍵詞: Flexible substrates, Novel additive technique, Chemical replacement or galvanic displacement, Copper deposition, Aluminum thick film paste, High frequency radar application., RFID
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  • 考慮未来的擴展潛力,本論文的最終目標是開發一種新型添加技術,用於在柔性基底(聚酰亞胺-PI 或液晶聚合物-LCP)上生產天線。這種方法的核心是可持續地利用半導體行業產生的硫酸銅廢料,將其重新用於柔性印刷電路市場的高價值生產。本論文介绍了一種天線制造的開創性方法,該方法採用創新的添加劑技術,通過化學置换或電化學置換將铜沉積在鋁電極上,這是 RFID 和汽車雷達系统應用領域的一項重大突破。這項研究的核心是探索化學置換反應,將其作為增材制造技術推進天線設計的一个重要方面。最初的章節奠定了理論基礎並介绍了實驗方法,为實際應用奠定了基礎。
    在本研究的第一部分,該技術被巧妙地應用于在 PET 柔性基板上制造 RFID 標籤天線,實現了令人印象深刻的電器性能和運行效率,在 1.93 GHz 频率下顯著的回波損耗 S11 为 -22 dB。
    論文的第二部分將應用擴展到雷達系统的 24GHz 陣列貼片天線,在 LCP 襯底上採用了環保型添加劑工藝。這種方法實現了低電阻率和 8.34dBi 的增益,驗證了其在高频應用中的有效性。
    論文的第三部分探討了在 CPW 設計中進行铜沉積的各種電鍍解决方案,最终在 0.025 µm LCP 襯底上開發出精確的 50 微米 CPW,以及针對 77GHz~82GHz 雷達應用進行優化的角截斷相位陣列天線設计,展示了天線性能的顯著進步。這種方法體現了循環經濟原则,旨在為業界帶来巨大利益。此外,該研究還在天線製造中引入了一種突破性的添加劑技術,可為 RFID 和雷達技術應用建立新的標準,鼓勵創新和進步。

    Considering the potential for future scalability, the ultimate objective of this thesis is to develop a novel additive technique for producing antennas on flexible substrates (Polyimide -PI or Liquid Crystal polymer - LCP). This approach aims to move away from the traditional subtractive methods commonly used in Flexible Printed Circuits (FPCs).Central to this approach is the sustainable use of copper sulfate waste from the semiconductor industry, repurposing it for high-value production in the flexible printed circuit market. This thesis presents a pioneering approach in antenna manufacturing using an innovative additive technique for depositing copper on aluminum electrodes through chemical replacement or galvanic displacement, a significant breakthrough for applications in RFID and automotive radar systems. Central to this study is the exploration of chemical replacement as a crucial aspect of additive technology in advancing antenna design. Initial chapters lay the theoretical groundwork and describe the experimental methodology, setting the stage for practical applications.
    In the first part of this study, this technique is adeptly applied to the fabrication of RFID tag antennas on PET flexible substrates, achieving impressive electrical properties and operational efficiency, highlighted by a notable return loss S11 of -22 dB at 1.93 GHz.
    In the second part of this thesis, extends the application to 24GHz array patch antennas for radar systems, employing an eco-friendly additive process on LCP substrates. This method achieved low resistivity and a promising gain of 8.34dBi, validating its effectiveness in high-frequency applications.
    In the third part of this thesis ,explores various electroplating solutions for copper deposition in CPW designs, culminating in the development of a precise 50-micron CPW on a 0.025 µm LCP substrate and a corner-truncated phase array antenna design optimized for 77GHz~82GHz radar applications, demonstrating significant advancements in antenna performance. This approach, represents circular economic principles, aims to significantly benefit the industry. Additionally, the research introduces a groundbreaking additive technique in antenna manufacturing, which could establish new standards, encourage innovations and advancements in RFID and radar technology applications.

    摘要 I Abstract II Acknowledgement III Content IV List of Figures VIII List of Tables XII Chapter 1 Introduction 1 1-1 Overview of Antenna for Next Generation 1 1-2 Background and Issues in current subtractive process 4 1-3 Improvement to overcome the subtractive method antenna Fabrication. 4 1-4 Research motivation 7 1-5 Organization of the thesis 8 Reference 8 Chapter 2 Techniques & theoretical considerations 11 2-1 Principles of Chemical Replacement 11 2-1-1 Redox Reaction 11 2-1-2 Detailed Description of Factors Affecting Chemical Replacement Reactions 13 2-1-3 Introduction of Additives [3] 13 2-3 Thick Film Screen Printing 15 2-4 Overview of Antenna and its Characteristic Techniques 17 2-4-1 Introduction of Antenna and its working principles: 17 2-4-2 Co-Planar Waveguide, CPW 26 2-4-2 Total Loss 28 2-4-3 Vector Network Analyzers (VNA) 29 2-4-4 Anechoic Chamber 30 2-4-5 Far-Field Measurement 31 2-4-5 Probe Station 32 2-5-6 Surface Roughness Model 33 2-5-4 Skin Effect 34 2-6 Other Characterization Techniques 35 2-6-1 Electrochemical Analysis 35 2-6-2 Optical Microscope (OM) and Scanning Electron Microscope (SEM) 37 2-6-3 Introduction of LCR Meter 38 Reference 39 Chapter 3 Studies on a novel additive technique to fabricate RFID antennas utilizing flexible PI substrate. 42 3-1 Introduction 42 3-2 Experimental Procedures 43 3-2-1 Sample preparation 43 3-2-2 Characterization techniques 45 3-3 Results & Discussion 45 3-3-1 Electrochemical analysis: 45 3-3-2 Measurements and analysis of the microstructural properties of replacement conditions 50 3-3-3 Electrical Measurement analysis 59 3-3-4 RFID Tag Antenna characteristics 61 3-4 Conclusion 68 Reference 68 Chapter 4 Designing LCP Film-Based 24GHz Array Patch Antennas Using Additive Fabrication Approaches 71 4-1 Introduction 71 4-2 Experiment details 73 4-2-1 Chemical replacement procedure 73 4-2-2 Characterization techniques 74 4-3 Results & Discussion 75 4-3-1 Electrochemical Analysis: 75 4-3-2 Effect of Replacement Solution Variability on Temperature and Time 77 4-3-3 Measurements and characteristics of the replacement solution results. 80 4-3-4 Microwave characteristics of the Cu transmission line on LCP flexible film 82 4-3-5 Utilizing the Cu electrode high-performance antenna on LCP film at 24GHz. 86 4-4 Conclusion 92 Reference 93 Chapter 5 Advancements in Additive Manufacturing and Design Perspectives for CPW and 77GHz Antenna Fabrication. 97 5-1 Introduction 97 5-2 Experiment details 99 5-2-1 Sample preparation 99 5-2-2 Comprehensive Copper Deposition via Chemical Replacement and Electroplating 101 5-2-3 Characterization techniques 102 5-3 Results and Discussion 103 5-3-1 Summary of the initial phase chemical replacement for Cu deposition analysis 103 5-3-2 Electroplating results and analysis 104 5-3-3 Design of coplanar waveguides and measurement analysis 115 5-3-4 CPW loss analysis at different substrate thickness 117 5-3-5 Copper roughness simulation results for antenna loss on a 0.025µm substrate 122 5-4 Conclusion 125 Reference 126 Chapter 6 Conclusion 128 Chapter 7 Future Work 130

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