本研究利用將龐大基團 (imide ring) 結構導入二酸單體結構中，以期望能以此類單體合成出一可溶性之聚醯胺。分別利用tetrafluorophthalic anhydride 和 maleic anhydride 與 5-aminophthalic acid hydrate 反應合成出我們所想要結構的單體 5-tetrafluorophthalimidoisophthalic acid (PIA) 和 maleimide phthalic acid (MIPA) 。並利用其和其餘 3 個單體去合成我們所期望得到聚醯胺，分別為二酸單體 5-hydroxyisophthalic acid (HIA) 、 二胺單體2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FPPA) 、2,2-bistrifluoromethyl benzidine (TFDB) ，並利用FT-IR、NMR去鑑定其結構正確性，得到其固有黏度為0.60 ~ 0.85 (dL/g)，且其可溶於高極性溶劑 NMP、DMAc、DMF、DMSO中。
利用所得到之化學交聯型之聚醯胺 (PIA+HIA+6FPPA & PIA+HIA+TFDB) 與DMAc配成2 wt% 之聚醯胺溶液，加入交聯劑(1,4-phenylene diisocynate) 和催化劑 (triethylamine) ，在130 oC下反應3小時並除去溶劑以得到化學交聯型之聚醯胺薄膜。利用熱交聯型之聚醯胺 (PIA+MIPA+6FPPA & PIA+MIPA+TFDB) 與DMAc配成2 wt% 之聚醯胺溶液，利用升溫參數 : 升溫速率5 oC/min ，升溫至 150 oC 持溫 1小時， 180 oC 持溫 1 小時， 220 oC 持溫 2 小時， 260 oC 持溫 2 小時，即可得到熱交聯型之聚醯胺薄膜。
分別利用化學交聯型聚醯胺與熱交聯型聚醯胺薄膜去測量TGA、TMA並和未交聯聚醯胺薄膜作比較，可得到化學交聯型薄膜在交聯後之熱烈解溫度提升了約10 oC， Tg提升了約5 oC ，CTE則下降了15 ~ 40 (ppm/ oC) ；而熱交聯型薄膜之熱烈解溫度提升了50 ~ 60 oC，
Tg提升了60 ~ 100 oC，CTE則下降了16 ~ 60 (ppm/ oC)，而兩種交聯型之聚醯胺薄膜皆可在浸泡於 DMAc 溶劑中 2 天而不會有溶解現象。

In this project, we successfully prepared two dicarboxylic monomers.We used 5-aminoisophthalic acid and tetrafluorophthalic anhydride to synthesize 5-tetrafluorophthalimidoisophthalic acid (monomer 1). And we used maleic anhydride and 5-Aminophthalic acid to synthesize maleimide phthalic acid (monomer 2). The monomers were characterized by FTIR, H-NMR and element analysis to confirm their structure.
Secondly, we synthesized four new soluble polyamides from monomer 1 (PIA) and monomer 2 (MIPA), with other diamine monomers (6FPPA & TFDB) . The polyamides were characterized by FTIR and H-NMR to confirm their structure.
Thirdly, we also prepared chemical crosslinked and thermal crosslinked polyamide films that have good chemical resistance. They did not dissolve in the DMAc for 2 or 3 days. Compared with their properties, Td from TGA analysis,CTE and Tg from TMA,we found that thermal crosslinked polyamide films are better than the chemical crosslinked films.

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