依照材料的特性，可決定其應用範圍和使用狀況，故對於材料性質的研究，將是科學發展或工業生產的第一步。本文研究之重點在於發展出一套Bulge test材料試驗系統，使其能應用於薄膜或平板材料的試驗上。而在初期的研究目標，為設計材料測試系統及驗證其系統有效性為首要工作。

　　Bulge test試驗系統之建構包含了增壓系統、量測系統、信號擷取裝置及測試系統的主體部分，而在此系統的設計建立前，曾以Bulge test相關理論研究為基礎，來決定測試系統設計的性能與規格。實驗系統完成初期，我們以聚甲基丙烯酸甲酯(PMMA)為測試材料。此材料機械性質曾經本實驗室學長所設計之微小材料拉伸系統所測試，而其實驗結果與中正機械系之微拉力試驗機試驗結果相比較，兩者結果差距甚小，故選擇以此材料作為Bulge test試驗系統之可靠度的驗證。而PMMA材料在經Bulge test試驗後，其結果與前人相比，兩者數值接近，故可確信Bulge test試驗系統之準確性。另外，我們改良了微小材料拉伸測試系統；且亦對原Bulge test試驗系統，增加了溫度控制的功能，使兩者測試系統能同時應用於，在不同溫度下，CMP研磨墊材料之機械性質的測試上。對於研磨墊材料的測試結果，其應用在CMP的模擬工作有很大的助益。最後，希望能將Bulge test試驗系統推廣到其它薄膜材料上，並進一步地實現Blister test的研究，使測試系統可作為達到改善薄膜/基材之介面強度，及提高微機電結構之可靠度的最佳工具。

　　The purpose of this thesis is to develop and fabricate a bulge test system for the mechanical properties characterization of polymer materials such as PMMAs and CMP pads. The bulge equation is firstly developed to correlate the relationship between applied pressure and the resulted deformation for the system design and data reduction processes. By appropriately coordinate transformation from simple pressure-deformation coordinate into a modified pressure-deformation coordinate system, it is able to express the test data in a straight line manner. The slope and the intercept are then proportional to the biaxial modulus and the residual stress of the test specimen, respectively. The bulge system, containing a pressuring system, a chamber with pressure monitoring capability, a varying-diameter specimen holder, a temperature control unit, and a laser position sensor, is successful developed. This system is then verified by a series of test using PMMA. Thin PMMA sheets are then tested by this system. In parallel, their corresponded finite element (FE) simulations are also performed. By cross-checking the experimental data and FE simulation results, the bi-axial modulus of PMMA is obtained. The obtained results agree with that performed by standard uniaxial testing systems such as MTS Tytron. Finally, by utilizing this system, the bi-axial modulus of CMP pad Rodel IC 1010 are characterized at different temperatures, In the future, it is possible to use this system in MEMS thin film materials characterization. Furthermore, with a little modification, it is also possible to use this system to perform blister testing to characterize the adhesion between materials. In addition, by integrating this bulge test system with standard uniaxial tensile tester, it is possible to obtain the Young’s modulus and Poisson’s ratio for a specific material simultaneously.

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