本論文的目標在於使鈹銅合金鍍銀後的導電率能夠提升至媲美銀鎢合金的導電率，而鍍銀這個部分會產生的問題有許多，其中包含電鍍層平整度的問題以及當電鍍時若是電流密度過高，會使得鍍層表面產生氧化銀，而氧化銀會導致樣品的導電率下降。本次研究分為四個部分，第一個部分在講述的是透過硝酸銀、氫氧化鉀以及氨水調配出的母液開始電鍍，從中取出最適合的PH值以及電鍍電位，而這個部分得出的最佳電位範圍是在0.5V-0.7V之間，而PH值維持在10-12之間最佳。
第二部分在探討的是抑制劑碳酸鉀的作用，在第一部分已經成功電鍍銀在樣品上，但是樣品的平整度並未達到要求所以透過抑制劑降低電流密度，使電鍍時間增長，抑制劑原理是它會在樣品端形成一層保護層，由這個保護層去減少電流通過的大小，而在加入抑制劑後會使樣品所承受的電場更加均勻，使樣品電鍍出來的鍍層更加平整，而這個部分我們最後測試出400ppm的碳酸鉀為最佳的添加量，在抑制電流的同時，能夠取得最佳的導電率(20.7M S/m)。
第三部分為絡合劑菸酸的研究，在第二部分的時候已經基本上完成我們預期的目標，接著再透過加入菸酸提升電鍍時的電流密度，並且使電鍍層的顆粒更加致密，透過這一方法能夠提升鍍層的導電率，最後透過不同添加的測試，得到400ppm菸酸能夠使導電率提升至23.9M S/m。
第四部份為機械強度測試 ，這個部分是將電鍍後的樣品做不同厚度的測試，電鍍層的厚度是會隨時間變化的，電鍍的時間越長厚度越厚，而鍍層的硬度與厚度成正比，而我們先前電性測試鍍層厚度都是以10um的為基準下次測的，第四部份要探討的是硬度隨著厚度的變化，從結果來看當厚度達到10um後硬度上升的變化就不是很明顯了，當厚度達到8um以後硬度基本上都維持在170 HV不變，而170HV 基本上已經跟銀鎢的硬度150HV差異不大，這說明若鍍層厚度最少要達到8um才能得到所需硬度。

The objective of this thesis is to enhance the conductivity of beryllium-copper alloy after silver plating, aiming to achieve conductivity comparable to that of silver-tungsten alloy. However, silver plating poses several issues, including problems with coating smoothness and the formation of silver oxide on the surface when the current density is too high during plating, leading to a decrease in conductivity. This study is divided into four parts.
In the first part, we begin the electroplating process using a solution prepared from silver nitrate, potassium hydroxide, and ammonia water. We determine the optimal pH value and electroplating potential from this solution. The best electroplating potential is found to be within the range of 0.5V to 0.7V, while maintaining a pH value between 10 and 12.
The second part investigates the role of the inhibitor, potassium carbonate. Although successful silver plating was achieved in the first part, the surface smoothness of the samples did not meet the requirements. To address this issue, we introduced the inhibitor to lower the current density, thereby extending the electroplating time. The principle of the inhibitor lies in the formation of a protective layer on the sample's surface, reducing the magnitude of the current passing through it. The addition of the inhibitor ensures a more uniform electric field across the sample, resulting in a smoother electroplated layer. After testing, we found that the optimal amount of potassium carbonate to inhibit the current while achieving the best conductivity (20.7 MS/m) is 400 ppm.
In the third part, we focus on the chelating agent, nicotinic acid. Having achieved our initial objectives in the second part, we now seek to enhance the current density during electroplating and make the electroplated layer more compact by introducing nicotinic acid. This method contributes to an improvement in the conductivity of the plated layer. Through various tests, we determine that adding 400 ppm of nicotinic acid can increase the conductivity to 23.9 MS/m.

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