隨著環境衛生的改善、疫苗的發明、醫療技術的創新以及醫療照護系統的進步，讓疾病發生機率降低、治癒率提高，平均壽命明顯提升，於是，能夠在疾病初期發現甚至預防疾病的生物醫學檢測開始受到重視。近年來，晶片與生物醫學檢測技術的整合更是目前IC設計的主流趨勢之一，藉由晶片化，讓現代人能夠直接在家中自行量測並知道結果。
而本論文則是將電化學阻抗頻譜分析法 (Electrochemical Impedance Spectroscopy, EIS)整合進微晶片中，此一檢測方式可以在較快的時間內得到量測結果，且輸入訊號與量測訊號皆為電訊號，可以直接且有效的將儀器電路整合到系統晶片中，更可以透過後端電路直接計算量測結果。
此晶片包含可以同時提供兩組定電壓或定電流交流訊號的訊號處理電路，其工作頻率範圍在10 Hz到10 kHz，輸出電壓振幅範圍則是1.5V到3.5V之間，可輸出電流最大振幅為1mA，還有後端量測訊號分析電路部分，可以將通過已知阻抗模組的訊號與通過檢體的訊號作比較，以直流訊號的方式呈現兩組訊號的振幅以及之間的相位差。晶片採用國家晶片中心所提供的製程服務，使用台灣積體電路公司0.35μm 2P4M 5V混合訊號製程，以40 S/B封裝，尺寸為1.7x2.0mm^2 。

With the improvement of sanitation, the invention of vaccines, the innovation of medical technology, and the progress in health care systems, the incidence of disease is significantly decreased, the cure rate is also increased and the average life of human being has been prolonged significantly. Therefore, the biomedical detection can early detect the disease and even prevent disease gets more and more attention. In recent years, integrating biomedical detection technology into chips is one of the main trends in IC design field. By integrating the circuits, people can perform their basic bio-detections at home, with no need to go to hospital.
The presented chip uses the electrochemical impedance spectroscopy (EIS) method. Compared with other bio-sample detection methods, this detection method is much faster, and both the input signals and measured signals are all electro signals, so it can be directly and effectively integrated the circuit into the system chip.
This chip contains the entire front-end input signal processing circuit and sensing circuits of the bio-sample detection system. The input signal processing circuits can provide two sets of identical constant voltage or constant current AC signals. Its frequency range is from 10 Hz to 10 kHz, its output voltage range is 1.5V~3.5V, and the maximum magnitude of its output current is 1mA. Besides, the sensing circuits detect the magnitude and phase of the measured signals, and convert them into DC outputs. The die area of this chip is 1.7x2.0mm^2 , and the package is 40 S/B. The chip was implemented by Taiwan Semiconductor Manufacturing Company (TSMC) 0.35μm 2P4M 5V mixed-signal polycide process, patronized by National Chip Implementation Center (CIC).

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