| 研究生: |
張彥傑 Chang, Yen-Chieh |
|---|---|
| 論文名稱: |
具擴充能力之六邊形線圈於平面式感應加熱系統應用 Realization of Hexagon Coil with Expansion Capability for All-Surface Induction Heating Applications |
| 指導教授: |
黃世杰
Huang, Shyh-Jier |
| 學位類別: |
碩士 Master |
| 系所名稱: |
電機資訊學院 - 電機工程學系 Department of Electrical Engineering |
| 論文出版年: | 2020 |
| 畢業學年度: | 108 |
| 語文別: | 中文 |
| 論文頁數: | 86 |
| 中文關鍵詞: | 平面式感應加熱 、六邊形線圈結構 、電流相位調整 |
| 外文關鍵詞: | all-surface induction heating, hexagon coil architecture, phase adjustment |
| 相關次數: | 點閱:77 下載:0 |
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本論文旨在開發一套具有擴充能力之平面式感應加熱系統,此研究主要考量以往圓形線圈於感應平面建置時,由於圓形線圈彼此不易密合,致使負載偏移或線圈排列時,其受熱空隙容易影響加熱效能。因此,本文提出可應用於平面式感應加熱系統之新型六邊形線圈結構,並輔以換流器模組進行操作頻率與電流相位差之調整,以提供系統穩定均勻之加熱能力。本文之線圈設計特點在於利用各線圈可彼此契合之六邊形結構進行線圈外層繞製,因而可提高平面有效使用面積。本文並於探討換流器與諧振補償架構之電路特性與參數設計時,進行系統於負載偏移時之受熱變化分析,據以擬定具有穩定輸出功率之控制策略。而為驗證本研究之實用性,本文建置一套基於六邊形線圈架構之平面感應加熱系統硬體及進行電路實測,測試結果顯示本文所提方法確可提升線圈平面之傳輸與加熱效果,研究成果可作為感應加熱工業及民生產業研發參考。
This thesis is aimed to develop an induction heating system with expansion capabilities. Considering improving the demerit of uneven induction caused by the large curvature of round coils, this study proposes a new type of hexagon coil architecture which is designed for an all-surface induction heating system. This hexagon coil architecture is powered through high-frequency inverters and phase adjustment in order to deliver a steady heat for the load. The main features of the hexagon coil lie in using the outer hexagon layer to reach a better matching between coils, hence increasing the area of induction heating. The control strategy of maintaining the stable output power is also proposed in the study, which is suggested based on the analysis of heating variation following the investigation of converter and compensation topology. To confirm the practicality of this approach, the thesis realizes an induction heating system based on the hexagon coil architecture with different tests. Experimental results reveal that the method of this study helps to improve the induction heating performance, by which it serves as a useful reference for industry heating and consumer appliances applications.
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校內:2025-07-01公開