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研究生: 王俞又
Wang, Yu-Yu
論文名稱: 具電流阻障層垂直金屬基板結構GaN-基藍光 發光二極體之研製
The study and fabrication of vertical-structured metallic GaN-based blue light-emitting diodes with current-blocking layer
指導教授: 王水進
Wang, Shui-Jinn
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2007
畢業學年度: 95
語文別: 中文
論文頁數: 74
中文關鍵詞: 藍光發光二極體氮化鎵電流阻障層電鍍鎳準分子雷射
外文關鍵詞: electroplating, GaN, light-emitting diodes, Laser Lift-off, vertical-structured, current blocking layer
相關次數: 點閱:74下載:2
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  • 本論文主旨在進行具有電流阻障層之鍍鎳基板垂直結構GaN-基LED之研製。配合實驗之製程,本研究使用ISE模擬軟體進行元件電性模擬分析,由模擬結果可以看出,電流阻障層之配置已成功將電極下方之電流擴展至電極四周。我們將磊晶層利用ICP蝕刻出電極大小之區域,之後使用PECVD沉積SiO2層,使用E-Beam製備附著與反射層,進行電鍍鎳基板,搭配區塊雷射剝離技術(Patterned Laser Lift-off)置換藍寶石基板,成功製作出具有電流阻障層之垂直結構12 mil LED。
    實驗結果顯示,雖然具電流阻障層之垂直結構LED之順向壓降比無電流阻障層者稍增加0.1 V(@20 mA),串聯電阻約上升1~2 Ω,然於20 mA工作電流下之光輸出功率,可比沒有電流阻障層之元件提升47.3%,其power efficiency可改善40%。於試片表面粗化部份,使用浸泡KOH溶液濕蝕刻,以進一步增加光輸出功率,結果顯示浸泡KOH 90 s,於20 mA工作電流條件下可得到最佳光輸出功率,增加59.5%,並使順向壓降減少0.1~0.2 V。本研究顯示具有電流阻障層之垂直結構元件,對增加LED光特性方面有明顯之助益,而經過表面處理,更能增加外部量子效率。

    In this study, the performance of vertical-structured metallic substrate GaN-based light-emitting diodes (VM-LEDs) with a current blocking layer (CBL) was investigated. Nickel electroplating and patterned laser lift-off (LLO) techniques were employed for the transfer of sapphire substrate to Nickel substrate. The simulation for proposed LED structure was made by the use of ISE software, showing a great effect upon the current blocking under the n-pad. In experiments, through the etching by inductively coupled plasma (ICP), deposition of SiO2 by PECVD, evaporating adhesive/mirror layer by E-Beam, Ni-plating process, incorporating with patterned laser lift-off technology to remove the sapphire substrate, the vertical structure 12-mil VM-LED with current-blocking layer was fabricated successfully.
    As compared to the VM-LEDs without a CBL, the use of proposed CBL structure leads to the higher forward voltage drop and series resistance by 0.1 V (@20 mA) and 1~2 Ω, respectively. However, under the injection current of 20 mA, the VM-LEDs with a CBL exhibits an increase in light output power (LOP) by 47.3%, as compared to the VM-LEDs without the CBL structure. Moreover, the improvement of LED performance by the use of KOH chemical treatment upon the sample surface was also demonstrated. With ICP etching followed by an additional KOH treatment for 90 s on the n-GaN layer, an increase in LOP by 59.5% and a decrease in forward voltage drop by about 0.1~0.2 V at 20 mA have been achieved for the proposed VM-LEDs with a CBL.

    中文摘要 .............................................................................................. I 英文摘要 ............................................................................................ III 誌謝 .................................................................................................... V 目錄 ................................................................................................... VI 表目錄 .............................................................................................. VIII 圖目錄 ................................................................................................ I X 第一章 簡介 ....................................................................................... 1 1-1 GaN-基LED之發展 ............................................................. 1 1-2 高功率GaN-基LED之發展與瓶頸 ...................................... 4 1-3 研究動機 ............................................................................. 10 第二章 垂直元件結構VMLED之金屬鎳基板轉換技術 ..................... 13 2-1 垂直元件結構金屬基板製程 ............................................... 13 2-1-1 附著層與反射層之使用 ................................................ 14 2-1-2 電鍍設備簡介與電鍍製程 ............................................ 16 2-2 藍寶石基板雷射剝離(LLO)技術 ......................................... 20 2-2-1 KrF準分子雷射系統與LLO原理 ................................. 20 2-2-2 雷射剝離(LLO)製程 .................................................... 27 第三章 具電流阻障層GaN-基垂直金屬結構VM-LED 之模擬與製作 ...................................................................... 33 3-1 具電流阻障層VM-LED之模擬分析與設計 ........................ 33 3-1-1 ISE-TCAD模擬軟體架構 ............................................. 34 3-1-2 電流阻障層之效應 ...................................................... 35 3-1-3 調變CBL寬度與高度之效應 ...................................... 39 3-1-4 透明傳導層(TCL)之效應 ............................................. 41 3-1-5 n-GaN結構變化對電流分布之影響 ............................. 43 3-2 SiO2薄膜電流阻障層之製備 .............................................. 46 3-3 金屬附著層與反射層之特性探討 ....................................... 51 3-3-1 垂直結構各層界面接觸特性量測與探討 ...................... 51 3-3-2 各層金屬之穿透率與反射率量測與探討 ...................... 54 第四章 實驗結果與分析討論 ............................................................ 56 4-1 垂直結構與傳統橫向式結構LED光電特性比較 ................ 56 4-2 具電流阻障層VM-LED之光電特性分析 ........................... 60 4-3 表面粗化之效應 ................................................................ 63 第五章 結論 ..................................................................................... 69 參考文獻 .......................................................................................... 71 自傳 ................................................................................................. 74

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