隨著厚膜導電漿料的發展，目前市面上大多使用銀、銅等作為導電充物，但銀的成本過高，而銅則必須還原氣氛下燒結。本研究以鋁做為填充物，其具有便宜、導電性佳和可在空氣中燒結等優點。利用鋁表面氧化層破裂的機制和液相燒結來實現高導電率之高固含量鋁膏。
本研究首先利用大粒徑鋁粉易破裂、小粒徑鋁粉易填補空隙的機制，摻入不同比例之大小粒徑鋁粉，觀察內部的微結構及氧化的狀況 。接著採用不同鋁粉與玻璃粉的配比，觀察玻璃對鋁粒子潤濕的狀況及微結構和抑制氧化的能力。獲得上述大小粒徑的配比及鋁粉與玻璃的比例之後，將其等比例提升固含量，並藉由變動不同的燒結參數，取得最佳電性。本研究皆以熱重分析(Thermogravimetricanalysis, TGA)、掃描式電子顯微鏡(SEM)、雙束型聚焦離子束顯微系統(FIB)來交叉比對並解釋實驗的結果。
透過實驗跟分析，取得最佳鋁粉大小粒徑的比例為4:1、最佳鋁粉與玻璃的比例為10:1.利用上述兩個結果等比例提升鋁粉含量至80%，最後搭配升溫速率50℃/min(or 100℃/min)、燒結溫度850度和持溫10分鐘獲得最佳片電阻值1mΩ/□。

With the development of thick-film paste, silver and copper are circulating in the market as the electric conductive fillings currently. Unfortunately, the cost of silver is exceedingly high, while the copper has to be sintered in the reducing atmosphere. In this study, we proposed to exert aluminum as the filling due to its low cost, good electrical conductivity, and capability of being sintered in air. By means of the fracture mechanism of the oxidation layer of the Al surface and the liquid phase sintering, the Al paste with high solid content is used to implement high electrical conductivity.
In the first place, based on the mechanism that Al powder with large particle size tends to fracture easily, while it is easy for Al powder with small size to fill the gap, we mixed Al powder with large and small particle sizes at different proportion, so that the internal micro-structure and the oxidization condition could be observed. Next, with different ratios of Al powder and glass grit, we observed glass frit to wet the Al particles, the microstructure, and the ability to inhibit oxidation. After obtaining the ratio of Al particles and the ratio of Al powder and glass grit, the solid content was raised proportionally. Finally, the optimal electrical resistance was obtained through various sintering parameters. In this study, we applied Thermogravimetric Analyzer (TGA), SEM, and FIB to contrast and explain the experimental results.
By experiments and analysis, the optimal ratio of Al particles (4:1) and the ratio of Al powder and glass frit (10:1) were obtained to raise solid content. With those two results, we raised the content of Al powder to 80% proportionally; then, in collaboration with the temperature raising rate at 50℃/min(or 100℃/min), the sintering temperature at 850℃, and temperature hold time for 10 minutes, the optimal sheet resistance 1mΩ/□ was got.

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