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研究生: 吳俊慶
Wu, Chun-ching
論文名稱: 應用於生醫方面具微流道的CMOS MEMS晶片之製程與封裝
Fabrication and Package of Microfluidic Devices Using CMOS MEMS Process for Biomedical Applications
指導教授: 張凌昇
Jang, Ling-Sheng
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2008
畢業學年度: 96
語文別: 英文
論文頁數: 53
中文關鍵詞: 電極在PDMS上之應用生醫晶片CMOS MEMS封裝
外文關鍵詞: PDMS package, CMOS MEMS
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  • 由於CMOS技術的進步,許多研究將CMOS的技術引用到生物科技方面來做為應用。與普通的MEMS製程比較起來,CMOS的融入增加了更多可以運用的空間,如電路設計、微陣列等等。於是,CMOS MEMS 成為一個極度富有潛力的研究方向。我們將CMOS MEMS 應用在生醫科技方面,融合了MEMS的結構,以及外部的儀器做成一組細胞量測系統。並且以此系統捕捉單一細胞。
    這個研究成果另外包含了此CMOS MEMS晶片的封裝。利用這種封裝的技術可以大幅減低CMOS MEMS在封裝上面的成本。並且提供一個新的方向在PDMS的應用上。我們可以在PDMS上做電極,也可以直接利用PDMS作為封裝。使PDMS的應用層次可以更廣、更多元化!

    Coming with the improvement of CMOS (complementary metal-oxide-semiconductor) technology, many researchers imply CMOS fabrication into biology field. Enhanced circuits in bioMEMS (Biological micro-electro-mechanical systems) IC (Integrated circuit) create a new research field on biology and have inconceivable potential in biosensors which can be adopted to measure multiple parameters in colonies of living cells in real time. This project proposes a design of a CMOS-based impedance sensor with MEMS structures to conduct the single cell capture and impedance measurement.
    This work proposes a PDMS (Polydimethylsiloxane) packages to CMOS MEMS IC design on post-MEMS encapsulation packaging process, which provides a low cost manufacturing process with the surfaces of high elastic solutions. The packaging method uses chip-to-PDMS bonding of micromachined PDMS substrates with a construction electrode, bonding of oxygen plasma, sealing pipe. The PDMS substrates are micromachined micro-channel and interconnection structures patterned on them with gold electrode and fluidic feedthroughs. The results indicate that these fabrication techniques may be useful as low cost alternatives to conventional approaches to bonding in microfludic channels of IC for micro-fluidic MEMS and biomedical applications.

    TABLE OF CONTENT 中文摘要 IV ABSTRACT V ACKNOWLEDGEMENT VI TABLE OF CONTENT VII LIST OF TABLES IX LIST OF FIGURES IX CHAPTER 1 INTRODUCTION 1 1-1 Prior Accomplishments 3 1-2 Advantage of this Work 4 1-2-1 Cell-capture Structure 5 1-2-2 Microchannel IC 5 1-2-3 PDMS Fabrications 6 1-2-4 Measurement Devices 7 CHAPTER 2 CELL CAPTURE VERIFICATION 8 2-1 Filter Blockers 9 2-2 Three Pillar Structures 10 CHAPTER 3 CMOS MEMS IC DESIGN 13 CHAPTER 4FABRICATIONS 16 4-1 PDMS Mold Design 16 4-1-1 Bottom PDMS Mold Design 16 4-1-2 Top PDMS Mold Design 18 4-2 Electrodes on PDMS 23 4-3 PDMS Bonding 35 4-3-1 Coplanar Condition 35 CHAPTER 5 EXPERIMENTS AND SETUP 38 5-1 Cell Impedance Measurement Devices 38 5-2 Measurement Instrument 39 5-3 PDMS Bonding Tensile Testing 40 5-4 Particle Capture 42 CHAPTER 6 DISCUSSIONS AND RESULTS 43 6-1 Microchannel IC Performance 43 6-2 PDMS Bonding Tensile Testing 44 6-3 Package Testing 46 6-3 Conclusions 49 6-4 Future Works 50 REFERENCES 52

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