本論文是應用田口法結合主成分分析法與灰關聯法，建立一種可分析多重品質特性之最佳化電磁感應線圈設計方法，並結合渦電流檢測技術，設計一套非接觸式微米級印刷電路板(Printed Circuit Boards, PCB)銅箔厚度量測系統。此方法是先透過田口方法初步篩選變動的參數，評估感應線圈的品質特性，接著搭配主成分分析法，將線圈品質特性之損失函數轉換成互相獨立的主成分組合，再透過灰關聯法轉換主成分得點，以求得較佳的參數資料，並計算各因子間的貢獻度後，挑選高貢獻度因子，進行遞迴比較，以求得最佳感測線圈設計。透過此方法，可以有效降低多重品質分析中，決定最佳參數水準所造成的衝突或取捨。因該系統應用於微米級PCB，所以厚度量測首重系統的鑑別度，而系統的鑑別度跟電阻、感抗和阻抗有密不可分的關係。本論文除設計一套，低成本渦電流檢測系統外，還設計一套多重品質因素最佳感測線圈設計方法，並實際繞製感應線圈後結合本檢測系統做驗證。同時亦開發一套具自動追蹤( Auto tracking )功能的人機介面，方便讓使用者可以即時查看量測資料。最後由量測不同銅膜厚度之PCB驗證，並針對結果分析與討論。

By combining Taguchi Method with Principal Components Analysis and Grey Relational Analysis, the optimal electromagnetic sensing coil design for analyzing multiple quality characteristics is established and integrated with eddy current testing to design a contactless micron-sized printed circuit board (PCB) copper foil thickness measuring system. Taguchi Method was first used for selecting variable parameters and evaluating the quality characteristics of sensing coil. Matched with Principal Components Analysis, the loss function of coil quality characteristics is then transformed to mutually independent principal components. Grey Relational Analysis is further applied to transforming the points of principal components for the optimal parameter data. High-contribution factors, after calculating the contribution among factors, are recursively selected and compared to acquire the optimal sensing coil design. Such a method could effectively reduce the impact caused by determining optimal parameter standards in multiple quality analysis. In addition to designing a low-cost eddy current testing system, a multi-quality optimal sensing coil design is designed. After actually winding sensing coil to integrate with this testing system, an auto-tacking human machine interface is developed for users looking up the measuring data at any time. Finally, we measured PCB with different thicknesses to verify the proposed method in this study.

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