| 研究生: |
蘇芳瑩 Su, Fang-Ying |
|---|---|
| 論文名稱: |
室溫離子熔液中電沉積鈀合金 Electrodeposition of Palladium Alloys in the Room Temperature Ionic Liquid |
| 指導教授: |
孫亦文
Sun, I-Wen |
| 學位類別: |
碩士 Master |
| 系所名稱: |
理學院 - 化學系 Department of Chemistry |
| 論文出版年: | 2003 |
| 畢業學年度: | 91 |
| 語文別: | 中文 |
| 論文頁數: | 128 |
| 中文關鍵詞: | 室溫離子熔液 、電沉積 、鈀金 、鈀銀 |
| 外文關鍵詞: | palladium-gold, palladium-silver, electrodeposition, ionic liquids |
| 相關次數: | 點閱:128 下載:1 |
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本論文主要是探討鈀合金在室溫離子熔液內的電化學行為與電沉積。而此室溫離子熔液系統是1-ethyl-3-methyl imidazolim tetrafluoroborate(EMI-BF4),此融鹽屬於空氣及水穩定性的室溫融鹽。因為氫氣的生成、吸附使得鈀合金的鍍層易有氫脆及剝落的現象,所以在融鹽系統中電沉積金屬或合金的優點是可避免氫氣及氧氣生成所造成的干擾。
在鹼性EMI-BF4融鹽中分別利用循環伏安法(cyclic voltammetry)以及chronoamperometry探討鈀、金、銀離子在玻璃碳電極上的電化學行為。鈀離子在30度的玻璃碳電極上之成核機制為瞬時成核,但當溫度升到80度及120度時成核機制轉變為逐步成核。在銀離子的成核機制中,當溫度由30度到120度時皆屬於瞬時成核。另外於鹼性EMI-BF4融鹽中氯化金在玻璃碳電極有吸附現象。
本論文中在鹼性EMI-BF4室溫離子熔液中電沉積鈀-金、鈀-銀合金。在含有鈀-金的融鹽系統中,以定電流的方式來電沉積,並探討氯化鈀及氯化金濃度、溫度、電流密度對鍍層成份及表面型態的影響。另外,在含有鈀-銀的融鹽系統中,以定電位的方式來電沉積,並探討氯化鈀及氯化銀的相對濃度或絕對濃度、溫度、沉積電位對鍍層成份及表面型態的影響。此薄膜的表面型態、鍍層成份及晶形結構是由掃描式電子顯微鏡(SEM)、能量光譜儀(EDS)及X光繞射分析儀(XRD)加以鑑定。
In this study, the main content is the study of electrochemical behavious and electrodeposition of palladium alloys in an air- and water-stable 1-ethyl-3-methyl imidazolim tetrafluoroborate(EMI-BF4) room temperature ionic liquid. Due to hydrogen adsorptions, good Pd-alloys deposition are often difficult to obtain from aqueous dath. The advantage of doing electrodeposition of alloys in ionic liquids is that the interference of hydrogen can be avoided.
The electrochemistry and electrodeposition of Pd (Ⅱ), Au(I), and Ag(I) have been studied with cyclic voltammetry and chronoamperometry at a polycrystalline glass carbon electrode. The nucleation-growth mechanism of Pd(Ⅱ) on the GC electrode is the instantaneous three-dimesional nucleation/growth at 300C, but when the temperature was raised up to 800C and 1200C, the nucleation mechanism changes to progressive three-dimesional nucleation growth. The nucleation growth mechanism of silver on the GC electrode is instantaneous three-dimesional nucleation growth at 300C、800C and 1200C. Cyclic voltammetry of gold(I) showed a remarkable hysteresis, which is attributed to the adsorption of AuCl on the GC electrode.
In the study, the electrodeposition of Pd-Au and Pd-Ag alloys were investigated in the basic ionic liquid(EMI-BF4). In the Pd-Au system, the deposits were obtained from constant-current electrolysis. The effects of concentration of Pd(Ⅱ) and Au(I), temperature, and deposition current were discussed. In the Pd-Ag system, the deposits were obtained from constant-potential electrolysis. The effects of the relative and absolute concentrations of Pd(Ⅱ) and Ag(I), temperature, and deposition potential were discussed. Deposits were examined with a combination of methods, including scanning electromicreoscopy(SEM), energy dispersive X-ray spectroscopy(EDS), and X-ray diffraction(XRD) techniques.
[1] G. Delarue, J. Electroanal. Chem., 1, 285(1959).
[2] J. M. Schafir and J. A. Plambeck, Can. J. Chem., 48, 2131(1970).
[3] L. G. Boxall, H. L. Jones and R. A. Osteryoung, J. Electrochem. Soc.: Electrochemical Science and technology, 120, 223(1973).
[4] I-W. Sun, A. G. Edwards and G. Mamantov, J. Electrochem. Soc., 140, 2733(1933).
[5] G. R. Stafford, J. Electrochem. Soc., 141, 945(1994).
[6] G. Mamantov, G.-S. Chen, H. Xiao, Y. Yang and E. Hondrogiannis, J. Electrochem.
Soc.,142, 1758(1995).
[7] D. M. Gruen and R. L. Mcbth, Pure Appl. Chem., 6 23, (1963).
[8] J. Phillips and R. A. Osteryoung, J. Electrochem. Soc., 124, 1465(1977).
[9]K. N. Marsh, A. D., A. C.-T. Wu, E. Tran and A. Klamt, Korean
J. Chem. Eng.,19(3),357-362(2002).
[10]P. Walden, Bull. Acad. Imper. Sci. (St. Petersberg) 1914, 1800.
[11]H. L. Chum, V. R. Koch, L. L. Miller and R. A. Osteryoung, J. Am. Chem. Soc., 97, 3265 (1975).
[12]R. A. Carpio, L. A. King, R. E. Lindstrom, J. C. Nardi and C. L. Hussey, J. Electrochem. Soc., 126, 1644 (1979).
[13]J. Robinson and R. A. Osteryoung, J. Am. Chem. Soc., 101, 323 (1979).
[14]J. S. Wilkes, J. A. Levisky, R. A. Wilson and C. L. Hussey, Inorg. Chem., 21, 1263 (1982).
[15]E. I. Cooper and E. J. M. O’Sullivan, in “Proceeding of the eighth International Symposium of Molten Salts, Physical and High Temperature Materials Division Proceedings”, PV 92-16, R. J. Gale, G. Blomgren and H. Kojima, Editors, pp. 386, J. Electrochem. Soc., Pennington, NJ (1992).
[16]J. S. Wilkes and M. J. Zaworotko, J. Chem. Soc. Chem. Commun., 965 (1992).
[17]R. T. Carlin, H. C. De Long, J. Fuller and P. C. Trulove, J. Electrochem. Soc., 141, L73 (1994).
[18]P. A. Z. Suarez, J. E. L. Dullius, S. Einloft, R. F. De Souza and J. Dupont, Polyhedron, 15, 1217 (1996).
[19]P. Bonhôte, A.-P. Dias, N. Papageorgious, K. Kalyanasundaram and M. Grätzel, Inorg. Chem., 35, 1168 (1996).
[20]J. S. Wilkes, in “Ionic Liquids in Synthesis”, P. Wassercheid and T. Welton, Editor, P. 1, Wiley-VCH Verlag GmbH& Co. KGaA (2002).
[21]Frank Endres,CHEMPHYSCHEM, 3, 144-154(2002).
[22]J. Cl. Puippe and N. Ibl, Plat. Surf. Finish.,67,68(1980).
[23]R. D. Grimm and D. Landolt, Surf. Coat. Technol.,31,151(1987).
[24]C. K. Lai, Y. Y. Wang, and C. C. Wan, J. Electroanal. Chem.,322,267(1992).
[25] J. S. Wilkes, Green Chemistry, 4, 73-80(2002).
[26]M. J. Earle and K. R. Seddon, Pure Appl. Chem., 72, (7), pp. 1391-1398(2000).
[27] Kenneth R. Seddon, J. Chem. Tech. Biotechnol., 68, 351-356(1997).
[28]P.-Y. Chen, I-W. Sun, Electrochimica Acta 45 441-450(1999).
[29]W. Chen, H. Ahmed and K. Nakazato, Appl. Phys. Lett. 66,3383(1995).
[30]M. Takahasi, Y. Hayashi, J. Mizuki, K. Tamura, Tamura, T. Kondo, H. Naohara, K. Uosaki, Surface Science, 461, 213-218(2000).
[31]Galo Cardenas T.,Rodrigo Segura D., Material Reserch Bulletin, 35, 1369-1379(2000).
[32]Stevens, US patent 4048023, 1977.
[33]H. Naohara, S. Ye,and K. Uosaki, J. Electroanal. Chem., 473, 2-9(1999).
[34]S.-I. Pyun, W.-J. Lee,and T.-H. Yang, Thin Solid Films, 311, 183-189(1997).
[35]T.-U. Nahm, R. Jung, J.-Y. Kim, W.-G. Park, and S.-J. Oh, J.-H. Park, J. W. Allen, S.-M. Chung, Y. S. Lee and C. N. Whang, PHYSICAL REVIEW B, 58, (15), 9817-9825(1998).
[36]Y. S. Lee, Y. D. Chung, K. Y. Lim, C. N. Whang, J. H. Kim, H. J. Kang, J. J. Woo, J. of Electro. Spectroscopy and Related Phenomena, 105, 77-84(1999).
[37]Youn-Seoung Lee, Yongseog Jeon, Y.-D. Chung, K.-Y. Lim and C.-N. Whang, J. of the Korean Physical Society, 37, 4, 451-455(2000).
[38]S. M. Foiles, J. Vac. Sci. Technol. A5(4), 889-891(1987).
[39]A. D. Vasilyev,and A. N. Bekrenev, Applied Surface Science, 191, 1-4(2002).
[40]大寧貴金屬工業股份有限公司.(http://www.taling.com.tw/c index.html.)
[41]U. Cohen, K. R. Walton, and R. Sard, J. Electrochem. Soc., 131, 11, 2489-2495(1984).
[42]FRED I. NOBEL, IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY, 8, 1, 163-172(1985).
[43]F. I. Nobel, J. L. Martin, and M. P. Toben, Plating and Surface Finishing, 73(6), 88(1986).
[44]J. L. Martin and M. P. Toben, METAL FINISHING, 39(1990).
[45]M. E. Baumgartner and D. R. Gabe, Trans IMF, 78(2),79-85(2000).
[46]B. Sturzenegger,and J. C. Puippe, Platinum Metals Review 28(3), 117-124(1987).
[47]N. Kubota, Metal Finishing, 84(1), 55-57(1986).
[48]D. Shou-Jiang, Y. Fikumoto, T. Hayashi, Plating and Surface Finishing, 76(7), 56-61(1989).
[49]Ph. Hasler and Th. Allmendinger, Surface and Coatings Technology 58 (3), 179-183(1993).
[50]Ph. Hasler and Th. Allmendinger, Surface and Coatings Technology 58 (3), 185-192(1993).
[51]J. Shu, A. Adnot, B. P. A. Grandjean,and S. Kaliaguine., Thin Solid Films, 286, 72-79(1996).
[52]Y. S. Cheng,and K. L. Yeung, J. of Membrane Science, 158, 127-141(1999).
[53]C. Damle, A. Kumar, and M. Sastry, J. Phys. Chem. B, 106, 297-302(2002).
[54]K. H. Chae, S. M. Jung, Y. S. Lee, C. N. Whang, Y. Jeon, M. Croft, D. Sills, P. H. Ansari and K. Mack, PHYSICAL REVIEW B, 53, 15, 10328-10334(1996).
[55]C.-Y. Huang, H.-J. Chiang, J.-C. Huang and S.-R. Sheen, Nanostructured Materials, 10, (8), 1393-1400(1998).
[56]U. Cohen, F. B. Koch,and R. Sard, J. Electrochem. Soc., 130, 10, 1987(1983).
[57]J. R. Sanders, in “An Investigations of Transport properties and Ion Association in Room Temperature Haloaluminate Molten Salt”, Ph. D. Dissertation, The University of Mississippi (1987).
[58]A. J. Bard and L. R. Faulkner, “Electrochemical Methods; Fundamentals and Applications”, John Wiley & Sons, New York (2001).
[59]R. Greef, R. Peat, L. M. Peter, D. Pletcher and J. Robinson, “Instrumental Methodes in Electrochemistry”, John Wiley , New York (1985).
[60]D. Pletcher, “A First Course in Electrode Process”, The Electrochemical Consultancy, England (1991).
[61]G. Gunawardena, G. Hill, I Montenegro and B. Scharifker, J. Electroanal. Chem., 138, 241 (1982).
[62]P. Allongue and E. Souteyrand, J. Electroanal. Chem., 286, 217 (1990).
[63]G. Gunawardena, G. Hill and I. Montenegro, J. Electroanal. Chem., 138, 241 (1982).
[64]G. Gunawardena, G. Hill and I. Montenegro and B. Scharifker, J. Electroanal. Chem., 138, 255 (1982).
[65]G. Gunawardena, G. Hill and I. Montenego, J. Electroanal. Chem., 184, 357 (1985).
[66] G. Gunawardena, G. Hill and I. Montenego, J. Electroanal. Chem., 184, 371 (1985).
[67]A. Milchev, S. Stoyanov and R. Kaischev, Thin Solid Films, 22, 255 (1974).
[68]A. Milchev and E. Vassileva, J. Electroanal. Chem., 107, 337 (1980).
[69]G. J. Hills, D. J. Schiffrin and J. Thompson, Electrochim Acta, 19, 657 (1974).
[70]I. Markov, Thin Solid Films, 35, 11 (1976).
[71]I. Markov and E. Stoycheva, Thin Solid Films, 35, 21 (1976).
[72]V. Tsakova and A. Milchev, J. Electroanal. Chem., 197, 359 (1986).
[73]A. Milchev, V. Tsakova, T. Chierchie, K. Jüttner and W. J. Lorenz, Electrochim. Acta, 31, 971 (1986).
[74]G. Trejo, A. F. Gil and I. González, J. Appl. Chem., 26, 1287 (1996).
[75]K. Trejo, R. Ortega B., Y. Meas V., P. Ozil, E. Chainet and B. Nguyen, J. Electrochem. Soc., 145, 4090 (1998).
[76]L. Legrand, A. Tranchant and R. Messina, J. Electrochem. Soc., 141, 378 (1994).
[77]C. L. Hussey and X.-H. Xu, J. Electrochem. Soc., 138, 1886 (1991).
[78]X.-H. Xu and C. L. Hussey, J. Electrochem. Soc., 139, 1295 (1992).
[79]X.-H. Xu and C. L. Hussey, J. Electrochem. Soc., 139, 3103 (1992).
[80]X.-H. Xu and C. L. Hussey, J. Electrochem. Soc., 140, 618 (1993).
[81]X.-H. Xu and C. L. Hussey, J. Electrochem. Soc., 140, 1226 (1993).
[82]W. R. Pitner and C. L. Hussey, J. Electrochem. Soc., 144, 3095 (1997).
[83]J. S.-Y. Liu and I-W. Sun, J. Electrochem. Soc., 144, 140 (1997).
[84]Y.-F. Lin and I-W. Sun, J. Electrochem. Soc., 146, 1054 (1999).
[85]M. Avrami, J. Chem. Phys., 7, 1103 (1939).
[86]B. R. Scharifker and G. Hills, Electrochim. Acta, 28, 879 (1983).
[87]H. C. De Long, J. S.Wilkes, and R. T. Carlin, J. Electrochem. Soc., 141, 1000(1994).
[88]P.-Y. Chen, M.-C. Lin, and I.-W. Sun, J. Electrochem. Soc., 147(9), 3350-3355(2000).
[89] Y.-F. Lin and I-W. Sun, Electrochim. Acta, 44, 2771(1999).
[90]Y. K., S. Dan, T. Miura, and T. Kishi, J. Electrochem. Soc., 148 (2) C102-C105(2001).