本論文實現一峰值電流偵測結合動態電壓控制之一次測控制無線傳能系統可應用於可攜式3C產品及無線傳能系統。現有無線傳能系統研究主要著重於動態負載偵測以傳遞適當功率於輸出負載及整體系統效率提升。在傳統無線傳能系統，以外加迴授電路偵測動態負載，此方法將增加系統成本與電路面積;藉由變頻控制技術雖可改變輸出功率予不同輸出負載，然此技術將降低系統效率;增加可變電感與電容雖可改善系統效率，但此技術之缺點為需要複雜的控制電路與較大的印刷電路板面積。本論文提出之峰值電流偵測技術可於一次測控制電路偵測輸出負載變動;動態電壓控制可於不同輸出負載改變輸出功率使系統具備最佳效率操作，與傳統架構相比，除能降低系統成本與電路面積，更能用較簡單之控制電路實現(包含峰值電流偵測電路、除法電路、動態電壓電路與電感式耦合器驅動電路)。此外，本論文針對無線傳能系統進行系統架構比較、最佳操作頻率分析，將改善無線傳能系統之系統效率，使其更具應用、研究及市場潛力，並易於整合於可攜式產品與醫療用品。
本論文使用TSMC 0.25um1P5M混合訊號互補式金氧半高壓製程製作。晶片面積為1.9 x 1.635mm2，此轉換器電路輸入電壓為19V (為常用電壓器輸出電壓)，輸出電壓範圍為5V，最大輸出功率為5W，操作頻率為130kHz。

A peak current sensing method combined with the dynamic voltage scaling technique for primary side control in a wireless power transfer system is proposed, which can be applied to portable 3C products and wireless charger. In recent years, the main issues for wireless power transfer systems are: detection of load transient for sufficient output power transfer and system efficiency improvement. In conventional wireless power transfer systems, an additional feedback circuit is utilized to detect the load transient, this technique results in higher cost. The variable frequency control method is proposed to change the output power when load transient, however, this technique leads to poor system efficiency. Impedance matching technique is proposed for system efficiency improving, the disadvantage of this approach is that the additional inductors and capacitors cost large PCB area. In this thesis, the peak current sensing method combined with the dynamic voltage scaling technique is proposed for detection of load transient and sufficient output power transfer. Compared to conventional wireless power transfer system, the proposed method result in lower system cost and PCB area; the system can be implemented with easier control circuit including a peak current sensor, a division circuit, a dynamic voltage scaling circuit and a driver for inductive coupler. Moreover, topologies comparisons, optimized operating frequency and sensing methods for load transients are analyzed for improving system efficiency, so that the system provides a potential in application, research and marketing and can be easily integrated in portable devices and biomedical instruments.
This chip will be fabricated with the TSMC 0.25um CMOS high voltage mixed signal general purpose IIA based BCD 1P5M 5V/40V process. The total chip area is 1.9 x 1.635 mm2, the input and output voltages are 19V and 5V, respectively, and the operating frequency is 130 kHz.

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