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研究生: 李富榮
Lee, Fu-rong
論文名稱: 相容於TMS320C54x數位訊號處理器之軟體功能測試方法研究
Efficient Software-Based Functional Test Methods for TMS320C54x-Compatible DSP Processors
指導教授: 謝明得
Shieh, Ming-Der
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2007
畢業學年度: 95
語文別: 中文
論文頁數: 53
中文關鍵詞: 處理器測試
外文關鍵詞: testing, processor
相關次數: 點閱:53下載:0
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  • 由於系統單晶片(System-on-a-Chip; SOC)技術發展愈來愈成熟,雙核心處理器(Dual Core Processor)如ARM與DSP,運用在手機、個人數位產品、數位照相機及消費電子上愈來愈普及,故嵌入式數位訊號處理器在SoC系統上,扮演的角色愈來愈重要。從測試的觀點而言,傳統以掃瞄鏈(Scan Chain)為基礎的測試架構,將會造成硬體電路與測試成本的增加,甚至降低整體電路之效能,因此如何在不增加面積與不降低性能的前提下,有效率去測試數位訊號處理器,進而提升錯誤涵蓋率,是一個非常重要的研究主題。
    本篇論文主要包含兩大部份:第一個部份是針對相容於TMS320C54x系列的數位訊號處理器架構之設計,我們透過Easy-Platform來驗證所設計之數位訊號處理器(NCKU DSP)的功能是否正確。NCKU DSP處理器的指令集完全相容於TI TMS320C54x。第二個部份為使用軟體功能測試方法針對所設計出來的數位訊號處理器作測試。主要方法之一利用有條件限制之自動樣本產生器(Constrained ATPG),針對子模組來產生測試樣本,並透過載入指令(Load Instruction)將測試樣本引進到子模組,再透過儲存指令(Store Instruction)將錯誤效應(fault effect)傳遞(propagation)到輸出腳,使用這個方法具有較小的測試程式,可重複使用測試範本,不需要額外的電路和不降低電路效能的優點。

    With rapid development of SoC (System-on-Chip) techniques, dual core processors (ARM and DSP processor) are extensively used in consumer electronics like mobile phone, digital camera, etc. Since the embedded processor plays an important role in SoC, an efficient test method with little overhead and high fault coverage has become a critical issue. Traditionally the CUT (circuit under test) is inserted scan chains to improve fault coverage; however the tradeoff is the area overhead and performance degradation.
    This work first presents a DSP processor designs named NCKU DSP based on TMS320C54x series, which is verified on EASY-Platform. ISA (instruction set architecture) of NCKU DSP processors is compatible with that of TI TMS320C54x. Then we propose a software-based test method for the developed NCKU DSP. The ATPG (Auto Test Pattern Generator) is constrained to ensure that the test pattern can be loaded into sub-module under test and the test response can be transmitted out of DSP by the store instruction; thus a smaller test program size can be obtained and test patterns can also be reused. Additionally, since the test program is developed based on existing instruction sets of DSP processor, there is no area overhead and performance degradation.

    摘  要.................................................i ABSTRACT................................................ii 目  錄................................................iv 表 目 錄................................................vi 圖 目 錄................................................vii CHAPTER 1 緒論............................................1 1.1 研究動機..........................................1 1.2 NCKU DSP 處理器架構設計...........................3 1.3 內容的編排........................................3 CHAPTER 2 背景知識之介紹..................................5 2.1 TI TMS320C54x處理器的介紹.........................5 2.1.1 CPU狀態和控制暫存器.........................7 2.1.2記憶體映射暫存器............................11 2.1.3 TI TMS320C54x指令集架構....................12 2.2 Functional Testing...............................14 CHAPTER 3 NCKU數位信號處理器設計與驗證...................15 3.1 NCKU DSP處理器設計之規格.........................15 3.2 NCKU DSP晶片的特性...............................18 3.3 NCKU DSP處理器架構設計...........................20 3.3.1 管線操作...................................21 3.3.1.1資料危障的處理........................21 3.3.2 NCKU DSP定址模式...........................23 3.4 NCKU DSP驗證架構.................................30 CHAPTER 4 測試規劃.......................................34 4.1 測試程式.........................................34 4.1.1 測試流程...................................35 4.1.2 隨機測試...................................37 4.1.3 有條件之ATPG...............................39 4.1.4 記憶體映射暫存器測試.......................42 4.1.5 定址模式測試...............................42 4.1.6 回饋測試...................................43 4.2 全掃描測試.......................................44 CHAPTER 5 實驗結果.......................................45 5.1 測試結果.........................................45 5.2 錯誤分析.........................................46 5.3 NCKU DSP合成報告.................................48 5.4 比較其他測試方法.................................49 CHAPTER 6 結論與未來展望.................................50 6.1 結論.............................................50 6.2 未來展望.........................................51 參考文獻.................................................52

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