簡易檢索 / 詳目顯示

研究生: 許家銘
Hsu, Chia-Ming
論文名稱: 應用於具掃描架構與邏輯矩陣之測試晶片之高效率診斷方法
Efficient Diagnosis for Test Chips with Scan-Based Logic Array
指導教授: 李昆忠
Lee, Kuen-Jong
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2021
畢業學年度: 109
語文別: 英文
論文頁數: 47
中文關鍵詞: 可製造性設計診斷錯誤診斷測試
外文關鍵詞: Diagnosis, Fault diagnosis, Testing, Design for manufacturability
相關次數: 點閱:76下載:0
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報
  • 在本論文提出了一種使用於具掃描架構與邏輯矩陣之測試晶片並針對複數錯誤的新型診斷流程。考慮的錯誤包含向量錯誤、定值錯誤及橋接錯誤。使用本地掃描致能訊號可以完全各別控制掃描鍊。我們可以透過無故障的掃描鍊來傳遞測試向量及邏輯單元塊的響應來避免受到其他錯誤的影響。診斷流程由四個可提升診斷率且減少錯誤候選的數量的測試所組成。分析結果顯示當考慮包含0、1或2個橋接錯誤之雙重錯誤,我們的診斷流程能分別在99.815%、99.753%與99.327%的情況下達到完美的診斷解析度並能分別在99.952%、99.781%與99.341%的情況下達到100%的準確度。另外,在執行完提出的診斷流程後,在分不開的錯誤對中的錯誤都會是功能等同錯誤。

    This thesis presents a novel diagnostic procedure for a scan-based test chip architecture targeting the diagnosis of multiple faults. The faults considered include input pattern faults, stuck-at faults, and bridging faults. With local scan enable signals, the scan chains can be fully controlled. We can apply patterns and observe the responses of logic blocks from the fault-free scan chains without being affected by other faults. The diagnostic procedure is composed of four tests that enhance the diagnosability and reduce fault candidates. Evaluation results show that the proposed diagnostic procedure can achieve perfect resolution for 99.815%, 99.753%, and 99.327% of the faults and achieve 100% accuracy for 99.952%, 99.781%, and 99.341% of the faults when double faults containing 0, 1, and 2 bridging faults are considered, respectively. Moreover after applying the proposed diagnostic procedure, the undistinguished fault pairs are all functional equivalent faults.

    CHAPTER 1 Introduction 1 CHAPTER 2 Overview of The Test Chip Architecture 4 CHAPTER 3 Fault models 6 3.1 Input Pattern Faults (IPFs) of the CTBs 6 3.2 Stuck-at Faults (SAFs) of the SFFs 6 3.3 Bridging Faults (BFs) 7 CHAPTER 4 Diagnostic Procedure 9 CHAPTER 5 Overviews of the Scan cain test and Module test 11 5.1 Scan Chain Test (SCT) 11 5.2 Module Test (MT) 11 5.3 Summary of the distinction of Faults 12 CHAPTER 6 The Proposed Test procedures 20 6.1 Candidate Test (CT) 20 6.1.1 Candidate Test 1 (CT1) 20 6.1.2 Candidate Test 2 (CT2) 22 6.2 Adaptive Test (AT) 25 CHAPTER 7 Diagnosability Analysis 26 7.1 The distinction between two double faults with different fault locations 27 7.2 The distinction between single faults and double faults 28 7.3 Identify the fault behaviors of the BFs which patterns of aggressors are affected by other single faults in MT 29 7.4 Functional equivalent faults 30 7.4.1 The proof of Theorem 1 30 7.4.2 The proof of Theorem 2 35 CHAPTER 8 Evaluation of Proposed method 38 8.1 Double faults with no BFs 40 8.2 Double faults with one BF 40 8.3 Double faults with two BFs 41 CHAPTER 9 Test Cycle Estimation 43 CHAPTER 10 Conclusions 44 References 45

    [1] L.-T. Wang, C.-W. Wu, and X. Wen, VLSI Test Principles and Architectures: Design for Testability, Morgan Kaufmann, 2006.
    [2] R. Guo, L. Lai, Y. Huang and W. T. Cheng, “Detection and Diagnosis of Static Scan Cell Internal Defect,” in Proc. IEEE Int. Test Conf., 2008, pp. 1-10.
    [3] K. Wang and S. Y. Kuo, “Fault detection and location in reconfigurable VLSI arrays,” in Proc. IEEE Int. Conf. Comput.-Aided Des. Digest of Technical Papers, 1989, pp. 234-237.
    [4] J. C. Lien and M. A. Breuer, “Maximal Diagnosis for Wiring Networks,” in Proc. Int. Test Conf., 1991, pp. 96-.
    [5] S. L. Lin, C. H. Wu, and K. J. Lee, “Repairable Cell-Based Chip Design for Simultaneous Yield Enhancement and Fault Diagnosis” in Proc. IEEE 25th Asian Test Symp., 2016, pp. 25-30.
    [6] C. Hess, B. E. Stine, and L. H. Weiland, “Logic Characterization Vehicle to Determine Process Variation Impact on Yield and Performance of Digital Circuits,” in Proc. Int. Conf. on Microelectronic Test Structures, 2002, pp. 189-196.
    [7] Y. Huang and W. T. Cheng, “On Designing Two-Dimensional Scan Architecture for Test Chips” in Proc. Int. Symp. on VLSI Design, Automation and Test, 2017, pp. 1-4.
    [8] R. D. Blanton, B. Niewenhuis, and C. Taylor, “Logic Characterization Vehicle Design for Maximal Information Extraction for Yield Learning”, in Proc. IEEE Int. Test Conf., 2014, pp. 1-10.
    [9] R. D. Blanton, B. Niewenhuis and Z. Liu, “Design Reflection for Optimal Test-Chip Implementation” in Proc. IEEE Int. Test Conf., 2015, pp. 1-10.
    [10] L. M. Huisman “Diagnosing Arbitrary Defects in Logic Designs Using Single Location at a Time (SLAT)”, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 23, no. 1, pp. 91-101, Jan. 2004.
    [11] S.-M. Chao, P.-J. Chen, J.-Y. Chen and et al., “Divide and Conquer Diagnosis for Multiple Defects”, in Proc. Int. Test Conf., 2014, pp. 1-8.
    [12] X. Yu, and R. D. Blanton, “Diagnosis of Integrated Circuits With Multiple Defects of Arbitrary Characteristics”, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 29, no. 6, pp. 977-987, June 2010.
    [13] B. Niewenhuis, S. Mittal and R. D. Blanton, “Multiple-Defect Diagnosis for Logic Characterization Vehicles”, in Proc. IEEE European Test Symp., 2017, pp. 1-6.
    [14] A. D. Friedman, “Easily Testable Iterative Systems”, IEEE Trans. on Computers, vol. C-22, no. 12, pp. 1061-1064, Dec. 1973.
    [15] C. W. Wu and P. R. Cappello, “Easily Testable Iterative Logic Arrays”, IEEE Trans. on Computers, vol. 39, no. 5, pp. 640-652, May 1990.
    [16] R. D. Blanton and J. P. Hayes, “Properties of The Input Pattern Fault Model”, in Proc. Int. Conf. on Computer Design VLSI in Computers and Processors, 1997, pp. 372-380.
    [17] R. Guo and S. Venkataraman, “A Technique for Fault Diagnosis of Defects in Scan Chains”, in Proc. Int. Test Conf., 2001, pp. 268-277.
    [18] Synopsys, Inc., TetraMAX ATPG User Guide, Version J-2014.09-SP1, 2014.
    [19] Y. H. Chen, C. M. Hsu, and K. J. Lee, “Test Chips With Scan-Based Logic Arrays”, IEEE Trans. on Comput.-Aided Des. of Integr. Circuits and Syst., vol. 40, no. 4, pp. 790-802, April 2021

    無法下載圖示 校內:2026-08-23公開
    校外:2026-08-23公開
    電子論文尚未授權公開,紙本請查館藏目錄
    QR CODE