隨著5G通訊、高速網路及電子產品持續朝高頻化與小型化發展，同軸連接器已成為高頻訊號傳輸系統中不可或缺的重要元件。為確保訊號傳輸品質與產品可靠度，電鍍膜厚之均勻性與穩定性為關鍵品質指標。然而，電鍍製程容易受到電流密度分布、藥液濃度及溫度控制等因素影響，使膜厚品質呈現高度變異性，進而增加品質波動與不良品發生風險。傳統固定參數之抽樣檢驗計畫雖能提供基本品質管制功能，但往往難以兼顧品質保證、檢驗成本與生產效率，因此有必要針對高變異製程建立更適切之抽樣檢驗模式。
本研究以某同軸連接器製造公司鍍金製程為案例，針對個案公司的現行抽樣計畫（n=5，c=0）進行分析與改善。研究結合操作特性曲線與平均出廠品質曲線，並依據二項分配理論建立允收機率模型，進一步推導平均出廠品質上限，以評估不同抽樣方案之品質風險與管制績效。同時導入修正檢驗機制，探討不同抽樣計畫於生產者風險與消費者風險間之平衡效果，藉以建立適用於高變異電鍍製程之抽樣檢驗模式，提升實際生產環境下之品質保護能力與管理效能。

With the rapid development of 5G communications, high-speed networks, and the miniaturization of electronic products, coaxial connectors have become essential components in high-frequency signal transmission systems. The uniformity and stability of electroplated coating thickness directly affect product performance and reliability. However, the electroplating process is highly influenced by factors such as current density distribution, solution concentration, and temperature control, resulting in significant process variation and increased quality risks. Conventional fixed-parameter acceptance sampling plans often fail to balance quality assurance, inspection cost, and production efficiency .
This study investigates the gold-plating process of a coaxial connector manufacturer and evaluates its current acceptance sampling plan (n = 5, c = 0). Operating Characteristic (OC) curves and Average Outgoing Quality (AOQ) analysis are employed to assess sampling performance.
Based on the binomial distribution, an acceptance probability model and the Average Outgoing Quality Limit (AOQL) are established to evaluate the quality protection capability of different sampling plans. In addition, a rectifying inspection mechanism is incorporated to examine the trade-off between producer’s risk and consumer’s risk. The results provide a practical acceptance sampling approach for high-variation electroplating processes and serve as a reference for improving quality control effectiveness in manufacturing environments.

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