本文是利用切割機和端銀機的機台作為分析，基於切割機的對位位移變化與端銀機在產品上所遇到的帶寬問題進行探討。實驗步驟分為兩部份，第一部份是進行對位位移變化並且分別以刀寬、刀型、角度來探討並針對產品有何影響，另外，在刀具部份會以三種不同的刀型去做可靠度測試，並了解各刀具優缺點，相對可以運用業界上。在第二部份是以端銀為主，在端銀過程當中，會以不同銅漿黏度去端銀在材料上，並且可以從光學顯微鏡看出微結構帶寬的變化，此外，也會考慮端銀機內部的加熱平台，並且針對不同溫度變化對銅漿有何影響，相對也可以了解銅漿溫度對帶寬的差異性。本研究是為了讓被動元件廠在設備成本上降低支出，並且在研究過程中發現，在不同類型的刀具會針對不同產品尺寸做調整，也讓被動元件廠能快速導入所需要的產品規格，以減少時間的浪費。

This research is using cutting and dipping machine as analysis equipment, with further discussion about bit displacement of cutting machine and bandwidth problems encountered while using dipping machine. Experimental procedure is divided into two parts, the first part is about bit displacement and further analyzing the effect of knife width, knife type, and angle to the product. Three different types of knives are used to perform reliability tests, to understand the advantages and disadvantages of each tool with respect to industry usage. Second part is regarding the dipping machine, Cu paste with different viscosity are applied to the material, using optical electron microscope we can observe micro-structure changes in bandwidth. The effects of dipping machine temperature on the Cu paste are also observed, so we can learn the effect of relative temperature difference to the bandwidth. This research objective is to reduce passive components plant cost, and in the course of the research, we found that different types of knives adjusted to different sizes of products could make passive components plant quickly implement the required product specifications and reduced waste of time.

[1]許溢适，線型驅動技術及其應用，台北，文笙書局股份有限公司，85 年12 月。
[2]許溢适，線型電動機與應用，台北，正文書局有限公司，73 年4月。
[3]白中和，DC 馬達控制電路設計，台北，建興書局企業有限公司，79 年3 月。
[4] 陳熹棣編譯，步進馬達應用技術，全華科技圖書股份有限公司，初版七刷，民國82 年。
[5]線性滑軌技術手冊，G99TC06-0202，上銀科技。
[6]張明勇，2000，光學尺使用，行政院勞工委員會職業訓練局。
[7]謝玉清，”光學尺原理的探討 ”，崑山科技大學學生專題，2009年8月。
[8]陳瑞和，1991，感測器，全華科技圖書股份有限公司。
[9] M. J. Pan, C. A. Randall, “A Brief Introduction to Ceramic Capacitors,” IEEE Electr. Insul. Mag., 26, 44, 2010.
[8] Kingery, W. D., Bowen, H. K. and Uhlmann, D. R., 1976, Introduction to Ceramics, 2nd ed., John Wiley & Sons, New York.
[9]Barsoum, M. W., 1997, Fundamentals of Ceramics, pp.526-543, McGraw-Hill, Singapore.
[10] G. Besendorfer, A. Roosen, C. Modes, T. Betz, “Factors Influencing the Green Body Properties and Shrinkage Tolerance of LTCC Green Tapes,” Int. J. App. Ceram. Technol., 4, 53–59, 2007.
[11] P. Nahass, W. E. Rhine, R. L. Pober, H. K. Bowen, W. L. Robbins, K.M. Nair, R. Pohanka, R.C. Buchanan, Ceram. Trans., 15, 355, 1990.
[12] R. Moreno, “The Role of Slip Additives in Tape Casting Technology: Part I-Solvents and Dispersants,” Am. Ceram. Soc. Bull., 71, 1521–1531, 1992.
[13] D.J. Shaw, Colloid stability, in Colloid and Surface Chemistry, 4th edn, Butterworth - Heinemann, Oxford, 210, 1992.
[14] K. Nagata, “Rheological Behavior of Suspension and Properties of Green Sheet Effect of Compatibility between Dispersant and Binder,” J. Ceram. Soc. Jpn., 101, 1271–1275, 1992.
[15] N. Ushifusa, M. Cima, “Aqueous Processing of Mullite-Containing Green Sheets,” J. Am. Ceram. Sot., 74, 2443–2447, 1991.
[16] K. Nagata, S. Hirano, G.L. Messing, H. Hausner, Ceram. Trans., 22, 335, 1991.
[17] K. Nagata, M. J. Cima, Ceram. Trans., 26, 205, 1992.