| 研究生: |
吳明鴻 Wu, Ming-Hung |
|---|---|
| 論文名稱: |
半導體機台製程缺陷問題應用TRIZ方法求解之探討 To Explore the Semiconductor Equipment’s Manufacturing Process Defects Using the TRIZ Method |
| 指導教授: |
邵揮洲
Shao, Hui-Zhou |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 工程管理碩士在職專班 Engineering Management Graduate Program(on-the-job class) |
| 論文出版年: | 2013 |
| 畢業學年度: | 101 |
| 語文別: | 中文 |
| 論文頁數: | 63 |
| 中文關鍵詞: | 萃思 、矛盾矩陣 、發明原則 、物質場分析 、專利 、半導體 |
| 外文關鍵詞: | TRIZ, contradiction matrix, inventive principles, substance field analysis,, patent,, semiconductor |
| 相關次數: | 點閱:144 下載:11 |
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半導體製造業面臨諸多挑戰和複雜性增加,產量的提高,減少缺陷和設備相關的問題,創新是保持領先競爭對手的關鍵要素。這篇論文介紹一個系統化創新的方法論-發明問題解決理論TRIZ。它是國際公認的創新科學,基於物理與創新的專利間的規則所提煉出的問題解決工具。
問題解答需透過物質場分析建構模型,再求出矛盾參數後,並使用矛盾矩陣,尋求對應發明原則。而要因分析是用來把工作聚焦化,方便TRIZ用於硬體零件部分的重新設計和整體運動流程的優化。
本研究提供了晶圓廠內部製程設備製造缺陷問題解決上,實際運用TRIZ理論推論求解的範例。並期望能藉由此範例推論過程,能幫助平庸如我輩,透過相關理論與方法也能作出與發明專家相媲美的解決方案,並縮短專利求解過程時間,提高工程師獨立自主求解的能力。
Semiconductor manufacturing faces numerous challenges and increased complexity in yield improvement, defect reduction and equipment related issues. Innovation is a key to stay ahead of the competitors. This paper will introduce a systematic innovation methodology called Theory of Inventive Problem Solving (TRIZ). TRIZ is a recognized international science of creativity, based on the laws of physics and innovative patents refined to numerous problem solving tools.
Troubles to be constructed through the substance field analysis model, after find out the contradictory parameters, we use the contradiction matrix for seeking corresponding inventive principles. The problem root-cause analysis will be used mostly for task concentration while TRIZ will be used for hardware part redesigns and overall motion process optimization.
This study provides the problem’s solution inference example with the practical application by TRIZ that get rid of the trouble in equipment’s process. And expect it could be helpful to depend on the thus example inference process, let those mediocre my generation, according the systematic methods to make the idea final solutions with inventive experts comparable. Shorten the process time of inventive ploblem and improve the engineer’s trouble shooting ability independently.
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