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研究生: 李建政
Lee, Chien-cheng
論文名稱: 利用低溫陶瓷共燒技術小型化2.4GHz藍芽主動天線模組
A Study on Miniaturizing 2.4GHz Bluetooth Active Antenna Module by Using LTCC Technology
指導教授: 李文熙
Lee, Wen-shi
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系
Department of Electrical Engineering
論文出版年: 2008
畢業學年度: 96
語文別: 中文
論文頁數: 81
中文關鍵詞: 藍芽主動天線模組
外文關鍵詞: Bluetooth Active Antenna Module
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  • 本篇論文主要研究藍芽主動天線模組中接收天線與濾波器、低雜訊放大器。首先在印刷電路板上實現各個獨立式電路,而在設計低雜訊放大器電路時,藉由電容等效電路與基板傳輸線代入模擬,使模擬結果更趨近於實作量測。接著再利用LTCC技術整合為小型化主動天線模組。而在3D化設計上使用立體堆疊方法縮小電路面積,將天線、濾波器、以及低雜訊放大器匹配電路內埋入LTCC基板內,最後實作獨立式電路模組面積為14cm x 2cm,而LTCC主動天線模組則為2.5cm x 0.9cm x 0.1cm,大幅縮小了電路面積,且主動天線模組增益仍維持在8dB以上,返回損耗也有14dB以上,有相當的不錯的特性,因此成功達成利用LTCC技術小型化藍芽主動天線模組的概念。

    The main research of about this study is 2.4GHz Bluetooth active antenna module, which consists of receiving antenna, filter and low noise amplifier. First of all, we carry out the function of the isolated circuits on the printed circuit board; secondly, by using LTTC technology, the isolated circuits can be integrated into miniature of active antenna module. And the miniatures of antenna, filter and low noise amplifier circuits can be buried in the LTCC substrate by using method of 3D stack. On the final aspect, the active antenna module size is 2.5cm x 0.9cm x 0.1cm, which is much smaller than the size of isolated circuits (14cm x 2cm). Due to the distinctive performance of the module, we can reach the best way to miniaturize Bluetooth active antenna module by LTCC technology.

    目錄 中文摘要....................................................I 英文摘要...................................................II 目錄........................................................IV 圖表目錄..................................................VII 第一章 序論.................................................1 1.1 前言.....................................................1 1.1.1 藍芽主動天線模組.....................................1 1.1.2 LTCC技術發展與介紹....................................2 1.2研究動機..................................................3 第二章 藍芽主動天線模組基本理論介紹與設計..............4 2.1 簡介.....................................................4 2.2 天線基本理論介紹.........................................4 2.2.1 輻射場型.............................................4 2.2.2 指向性及增益(Directivity and Gain)...................6 2.2.3 天線輻射效率.........................................8 2.2.4 天線極化.............................................9 2.2.5 單極天線(Monopole Antenna)...........................10 2.3 濾波器基本理論介紹......................................11 2.4 低雜訊放大器基本理論介紹................................22 2.4.1 直流偏壓點設計......................................22 2.4.2 穩定條件............................................25 2.4.3 功率增益............................................28 2.4.3.1 功率增益類型....................................28 2.4.3.2 單向性增益(Unilateral Case).....................30 2.4.4 雜訊參數..........................................31 2.4.5 VSWR..............................................34 第三章 在PCB基板上實現藍芽主動天線模組................36 3.1 簡介....................................................36 3.2 晶片天線特性量測........................................36 3.3 陶瓷晶片濾波器特性量測..................................39 3.4 低雜訊放大器特性量測....................................40 3.4.1 低雜訊放大器電性模擬................................40 3.4.1.1 直流偏壓設計....................................41 3.4.1.2 直流偏壓模型改良................................42 3.4.1.3 阻抗匹配........................................43 3.4.2低雜訊放大器量測結果.................................49 3.5 主動天線模組特性量測....................................52 第四章 利用LTCC技術整合主動天線模組....................55 4.1 簡介....................................................55 4.2 主動天線模組-LTCC晶片天線設計與量測.....................55 4.2.1 LTCC晶片天線電路設計.................................55 4.2.2 LTCC晶片天線量測.....................................59 4.3主動天線模組-LTCC晶片濾波器設計與量測....................61 4.3.1 LTCC晶片濾波器電路設計...............................61 4.3.2 LTCC晶片濾波器量測...................................64 4.4主動天線模組-LTCC晶片低雜訊放大器設計與量測..............65 4.4.1 LTCC晶片低雜訊放大器電路設計.........................65 4.4.2 LTCC晶片低雜訊放大器量測.............................71 4.5 主動天線模組實現與量測..................................74 4.6 LTCC版本與PCB版本之比較..................................77 第五章 結論................................................78

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