塑膠射出成型進行大量生產製造，使微流體晶片成本降低，因此可達到拋棄式之功能性，將比現行使用矽晶片製造方法成本低。微元件及系統的成型方式可利用微射出成型技術，生產大量的微型化流體控制元件及系統，如實驗室晶片或微流體晶片等，而微射出成型的機械元件精密加工部分，也需要應用到微機電系統的製造技術，即LIGA製程，本研究使用UV微影製程配合厚膜光阻技術，則可實現低成本的類LIGA 製程。類LIGA的UV微影製程技術的優點為高效率、精確度高、低成本方式。本實驗微射出成型模仁設計與製作研究，使用類LIGA電鍍模製程，以金屬碳鋼為基材，利用UV-LIGA負型厚膜光阻製程定義微流體元件結構，配合鎳微電鍍技術，製作出高精度、壽命之射出成型模仁。研究改善微射出成型於模仁製造之技術，微射出成形微結構之微小化。

Nowadays, most MEMS devices are based on silicon. However, for mass production, these technologies are too expensive and time consuming. This leads to the development of micro-injection molding technology for MEMS products, which offers high volume production. In this study, micro-injection molding are used to fabricate microfluidics components. Molds with microstructure can be fabricated by techniques such as LIGA, micromachining, electrical discharge machining, or laser ablation. An use UV-Lithography, LIGA-Like, proves that it is much cost effective than X-Ray lithography, LIGA, was used for the production of mold inserts with micro structure. The microstructure was successfully fabricated on a steel substrate, it was found that the addition strength of the microstructure on the substrate strongly depended on the process of the electroplating. Injection molding of the part with microstructure was determined to be successful in duplicating the original micro pattern.

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