表面黏著技術 (Surface Mount Technology, SMT) 為近年來電子工業最重要發展之一，其兼具構裝技術考量與生產自動化優勢且滿足電子產品品質嚴苛要求而成為主要印刷電路板組裝 (Printed Circuit Board Assembly, PCBA) 方法。SMT製程包含三個連續製造程序，(i) 錫膏印刷 (Stencil printing)、(ii) 零件黏貼 (Component placement)、及 (iii) 迴焊 (Solder reflow)。根據文獻揭示錫膏印刷與迴焊製程的前後因果效應迄今仍尚未被通盤釐清且製程變數間呈現非線性交互作用，約莫百分之六十焊接缺點 (Soldering defects) 源自於不當錫膏印刷製程管制，而零件黏貼準確度左右著焊接品質 (Soldering quality)，另迴焊作業則攸關焊點 (Solder joint) 結構與可靠度，因此三者間存在品質連動關係，所以任一製程產生變異都將造成焊接品質問題與降低整體生產系統績效。
模糊類神經 (Neurofuzzy) 技術結合模糊系統推論模式與類神經網路學習演算法，其提供知識透明化表達與資料學習能力且適用於動態非線性系統控制。鑒於SMT動態非線性製程特性、多重品質特性、及作業者語意化操作模式，本研究運用模糊關聯想記憶模型 (Fuzzy Associative Memory, FAM) 以萃取製程知識並配合階層協同式作業管理策略而發展出一套具圖形化人機介面SMT製程品質預測與控制系統用以協助於降低生產整備時間、預測與管制製程品質、及提供適當解決方案。本系統業已實行於台灣金訊電子廠，經實行前後各項指標評量結果顯示本系統對於整體SMT生產系統績效改善效果良好，包括提升焊性品質、降低生產線整備與當線時間、及製程除錯時間等。

Surface mount technology (SMT) is one of the most important developments in electronics industry. A high-speed SMT assembly system offers both economical and technical advantages that can reduce both production cost and time, and meet quality requirement. Thus, it has become the most popular assembly method for sophisticated electronic devices. A SMT assembly process consists of three consecutive manufacturing segments, (i) solder paste stencil printing, (ii) component placement, and (iii) solder reflow. About 60% of soldering defects are attributed to the solder paste stencil printing process, the soldering quality is affected by the component placement accuracy, and solder reflow process is related to the structure of solder joint and its reliability, all of them affect the ultimate solderability significantly.
The neurofuzzy technique integrates fuzzy logic with neural networks that provides the capability of transparent system explanation and adaptively data learning, is suitable to real-time modeling and controls of unknown, nonlinear processes. In this research, the FAM (Fuzzy Associative Memory) model was adopted to extract the knowledge of SMT manufacturing process. An adaptive SMT process prognosis and control system is then proposed, based on a hierarchically allied process control scheme for the early detection and assessment of a reflow soldering problem and for cost-effective manufacturing. This proposed system has been implemented successfully at VeriFone plant. The related improvements are significant to the expedition of setup procedure, downtime reduction, and solderability improvement provided by this proposed system.

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