目前常用的 PDMS 微流體晶片黏合方式包含氧電漿氧化處理、電暈放電處
理，但此種以電漿進行表面處理的方式，所形成的黏合強度有限，若能改善微
流體晶片的黏合強度，將有利於提升微流體晶片的應用廣度。本研究將設計製
作一起始化學氣相沉積(iCVD)設備，並用於 PDMS 微流體晶片之黏合製程。此
設備可利用化學沉積方式進行表面改質，本研究將使用 iCVD 技術在 PDMS 微
流體晶片表面形成一層 pGMA，再用 DCNA 技術完成微流體晶片的黏合。本
研究將探討 iCVD 沉積過程中 GMA 流率及沉積時間等參數對沉積薄膜厚度的
影響，並進一步探討薄膜厚度對黏合後的微流體晶片強度的影響，期望能找出
最佳的製程參數，並有效提升微流體晶片的性能。
研究結果顯示，使用此製程技術所製作之微流體晶片，與經氧電漿氧化處理的微
流體晶片進行比較，不論是在黏合強度或是最高工作流率方面，都有更佳的表現，整
體黏合強度可提升 50%，達到 105 psia 的壓力承受度，而流速最高可達 14 mL/min，
約提升 80%，並有機會可使流道內部達到較複雜的流體流動型態(例如紊流)。本研究
不僅成功製作出應用範圍廣泛的 iCVD 設備，並成功找出最佳之微流體晶片黏合製程
參數，將可進一步提升 PDMS 微流體晶片的功能性與設計多樣性。

In the field of microfluidics, oxygen plasma treatment and corona discharge
treatment are commonly used for surface modification and bonding technologies,
especially for the glass and PDMS based chips. However, the demand for bonding
strength has gradually increased in recent years. Therefore, a new method is issued to bond PDMS microfluidic chips which is DCNA (Doubly Cross-linked Nano Adhesive). This is a method of depositing a layer of pGMA film on PDMS microfluidic wafers by iCVD firstly, and then using ethylenediamine to form NH2 bond on the chips surfaces to adhesive two part of microfluidic chip.
In this study, we design and build an iCVD system, and use the presented system to
deposit a layer of pGMA film on the PDMS microfluidic chips, and then bond the
microfluidic chips with DCNA. We also measure the bonding strength of PDMS-based microfluidic chips under DCNA process and oxygen plasma treatment respectively. It can be found that the PDMS microfluidic chips bonded by this new technology has better performance in bonding strength up to 50% and increasing flow rate about 80% that can pass into the PDMS microfluidic chips. So it would be a new option for bonding PDMS microfluidic chips in the future.

1. Center, M.I., Introduction to lab-on-a-chip 2020: review, history and future. 2020.
2. Duffy, D.C., et al., Rapid Prototyping of Microfluidic Systems in Poly(dimethylsiloxane). Analytical Chemistry, 1998. 70(23): p. 4974-4984.
3. Lin, M.-S.L.a.J.-D., 橢圓微型模穴之微液體填充研究. http://hdl.handle.net/11536/78517, 2005: p. 31.
4. Bhattacharya, S., et al., Studies on surface wettability of poly(dimethyl) siloxane (PDMS) and glass under oxygen-plasma treatment and correlation with bond strength. Journal of Microelectromechanical Systems, 2005. 14(3): p. 590-597.
5. Hu, C., et al., Electrochemical grafting of poly(glycidyl methacrylate) on a carbon-fibre surface. RSC Advances, 2020. 10(18): p. 10599-10605.
6. You, J.B., et al., A doubly cross-linked nano-adhesive for the reliable sealing of flexible microfluidic devices. Lab on a Chip, 2013. 13(7): p. 1266-1272.
7. Duffy, D.C., et al., Rapid prototyping of microfluidic switches in poly(dimethyl siloxane) and their actuation by electro-osmotic flow. Journal of Micromechanics and Microengineering, 1999. 9(3): p. 211-217.
8. Yang, C., W. Wang, and Z. Li. Optimization of corona-triggered PDMS-PDMS bonding method. in 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. 2009.
9. Haubert, K., T. Drier, and D. Beebe, PDMS Bonding by Means of a Portable, Low-cost Corona System. Lab on a chip, 2007. 6: p. 1548-9.
10. 吳東權等, 微機電系統之技術現況與發展. 工業技術研究院機械工業研究所, 2005.
11. Petrov, I., et al., Microstructural evolution during film growth. Journal of Vacuum Science & Technology A, 2003. 21(5): p. S117-S128.
12. Xu, J., Amine functionalization by initiated chemical vapor deposition (iCVD) for interfacial adhesion and film cohesion. 2011. 129.
13. Baxamusa, S.H., S.G. Im, and K.K. Gleason, Initiated and oxidative chemical vapor deposition: a scalable method for conformal and functional polymer films on real substrates. Physical Chemistry Chemical Physics, 2009. 11(26): p. 5227-5240.
14. Khlyustova, A., Y. Cheng, and R. Yang, Vapor-deposited functional polymer thin films in biological applications. Journal of Materials Chemistry B, 2020. 8(31): p. 6588-6609.
15. Tenhaeff, W.E. and K.K. Gleason, Initiated and oxidative chemical vapor deposition of polymeric thin films: iCVD and oCVD. Advanced Functional Materials, 2008. 18(7): p. 979-992.
16. Kim, K., S. Park, and S. Yang, The optimization of PDMS-PMMA bonding process using silane primer. BioChip Journal, 2010. 4: p. 148-154.