| 研究生: |
郭明同 Kuo, Ming-tong |
|---|---|
| 論文名稱: |
以無電鍍製備鎳鐵磷合金及其抗腐蝕性質之研究 Fabrication and Anti-Corrosive Properties of Electroless Ni-Fe-P Alloys |
| 指導教授: |
陳炳宏
Chen, Bing-Hung |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
| 論文出版年: | 2007 |
| 畢業學年度: | 95 |
| 語文別: | 中文 |
| 論文頁數: | 109 |
| 中文關鍵詞: | 抗腐蝕 、鎳鐵磷 、無電鍍 |
| 外文關鍵詞: | electroless, Ni-Fe-P, Anti-Corrosive |
| 相關次數: | 點閱:60 下載:0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本研究中,以在鹼性的環境下,次磷酸鈉為還原劑、檸檬酸鈉為錯合劑進行無電鍍鎳鐵磷的反應。同時,也嘗試加入其他的還原劑-聯氨於無電鍍鍍液及改變鍍液的pH值,觀察對析鍍成分與析鍍速率的影響。然而,在掃描式電子顯微鏡的觀察下,發現添加聯氨所析鍍出來的鍍層表面分佈了許多裂縫;在未加入聯氨的鍍液,改以加入硫酸氨作為緩衝劑,其表面鍍層無裂痕的分布,此外其析鍍速率為10~14 μm/hr。另外,元素分析的結果顯示無電鍍鎳鐵磷依據pH的差異,鐵的含量可控制在2~6 wt.%、磷的含量在8~10 wt.%,推論出pH值決定於鍍層的組成與其析鍍的速率。另外,經過熱處理的無電鍍鎳鐵磷合金在XRD繞射儀的幫助下,觀察其結晶的晶態,並藉由恆電位儀對鎳鐵磷合金進行抗腐蝕的分析。
Electroless Ni-Fe-P alloys have been deposited from a basic plating bath having sodium citrate as a complexing agent. Effects of added reducing agents (sodium hypophosphite and hydrazine hydrate) and pH values of plating bath were studied. The surface morphology and microstructures were examined under a scanning electron microscope equipped with an energy dispersive spectrometer (EDS). The electroless plating using hydrazine hydrate as reductants was found with many crackings on it from SEM photos. The electroless alloys using sodium hypophosphite as reductants and ammonium sulfate as a buffer agent does not contain any crackings. The deposition rate is approximately 10-14 μm/hr. In addition, the percentage of iron and phosphorus in deposits are respectively approximately 2-6 wt.% and 8-10 wt.%. Moreover, composition and the deposition rate of the electroless Ni-Fe-P alloys depend on pH in the bath. The structure of as-plated alloys at all conditions is mainly amorphous. The crystallization behavior of Ni-P-Fe alloys with heat treatment were studied by using X-ray diffractometry. Moreover, the anti-corrosive properties of Ni-Fe-P alloys were measured with a potentiostat.
Ashassi-Sorkhabi H, Dolati H, Parvini-Ahmadi N, Manzoori J. Electroless deposition of Ni-Cu-P alloy and studyof the influences of some parameters in the properties of deposits. Appl Surf Sci. 2002:185:155-160.
Bard AJ, Faulkner LR, Electrochemical methods – Fundamentals and Applications, sponsored and published by John Wiley & Sons, Inc.
Betova I, Bojinov M, Kinnunen P, Laitinen T, Pohjanne P, Saario T, Vilpas M. Transpassive dissolution mechanism of Ni-based alloysin a simulated bleaching solution - effect of alloying elements. J Electrochem Soc. 2002;149:B499-B509.
Chen CH, Chen BH, Hong L. Role of Cu2+ as an Additive in an Electroless Nickel-Phosphorus Plating System: A Stabilizer or a Codeposit?. Chem. Mater. 2006: 18:2959-2968.
Chang MK, Chen CH, Chen BH. Fabrication of magnetic nickel–tungsten–phosphorus particles by electroless deposition. J Magn Magn Mater. 2006;305:342-347.
Chen BH, Hong L, Ma Y, Ko TM. Effects of surfactants in an electroless nickel-plating bath on properties of Ni-P alloy deposits. Ind Eng Chem Res. 2002;41:2668-2678.
Chen CJ, Lin KL. Wetting interaction between the Ni-Cu-P deposit and In-Sn solders. IEEE Transactions On Components, Packaging, and Manufacturing Technology-Part B. 1997;3:211-216.
Charbonnier M, Romand M, Tin-free electroless metallization of glass substrates using different PACVD surface treatment process. Surf Coat Tech. 2002;162:19-30.
Chen BH, Zhang H, Chooi SYM, Chan L, Xu Y, Ye JH. Corrosive Behavior of Tungsten in Post Dry-Etch Residue Remover. Ind Eng Chem Res 2003;42:6096-6103.
Honma H. Plating technology for electronics of packaging. Electrochim Acta. 2001; 47:75-84.
Kohlscheen J, Stock HR, Mayr P. Chemical bonding in magnetron sputtered TiNx coating and its relation to diamond turnability. Surf Coat Tech. 2001;142-144:992-998.
Lim VWL, Kang ET, Neoh KG. Electroless plting of palladium and copper on polypyrrole films. Synthetic Met. 2001;123:107-115.
Liu PL, Shang JK. A comparative fatigue study of solder/electroless-nickel and solder/copper interfaces. J. Mater. 2000;15:2347-2355.
Mallory GO, Hajdu JB. Electroless Plating: Fundamentals And Applications, sponsored and published by American Electroplaters and Surface Finishers Society. 1990.
Shacham-Diamand Y, Sverdlov Y. Electrochemically deposition thin film alloys for ULSI and MEMS applications. Microelectron Eng. 2000;50:525-531.
Tachev D, Georgieva J, Armyanov S. Magnetothermal study of nanocrystalline particle formation in amorphous electroless Ni-P and Ni-Me-P alloys. Electrochim Acta. 2001;47:359-369.
Wang SL. Studies of electroless plating of Ni–Fe–P alloys and the influences of some deposition parameters on the properties of the deposits. Surf Coat Tech. 2004;186:372– 376.
Wang SL, Zhang Y, Wu HH. The effect of heat treatment on the properties of electroless plating Ni-Fe-P alloy. Acta Phs-Chim Sin. 2004;20:1159-1162
Wu FB, Chen YI, Peng PJ, Tsai YY, Dug JG. Fabrication, thermal stability and microhardness of sputtered Ni-P-W coating. Surf Coat Tech. 2002;150:232-238.
Wang SG, Shen CB, Long K, Zhang T, Wang FH, Zhang ZD. The Electrochemical Corrosion of Bulk Nanocrystalline Ingot Iron in Acidic Sulfate Solution. J Phys Chem B. 2006;110:377-382.
Yin X, Hong L, Chen BH. The role of Pb2+ stabilizer in electroless nickel plating system:A Theoretical Exploration. J Phys Chem B.2004;108:10919-10929.
Yu HS, Sun X, Luo SF, Wang YR, Wu ZQ. Multifractal spectra of atomic force microscope images of amorphous electroless Ni-Cu-P alloy. Appl Surf Sci. 2002;191:123-127.
神戶得藏著,莊萬發譯,無電解鍍金—化學鍍金技術,復漢出版社2000
校內:2106-08-28公開